Marjorie L Waddel

6533159, Mar 18, 2003

Aug 14, 2000

09/639486

Chad A. Cobbley - Boise ID
Michael B. Ball - Boise ID
Marjorie L. Waddel - Boise ID

Micron Technology, Inc. - Boise ID

B23K 500

228 201, 228 33, 228 41, 228 45

An array of solder balls is formed on a first substrate for interconnecting with conductive sites on another substrate. A ball pickup tool picks up balls with a vacuum suction from a fluidized ball reservoir and utilizes a puff of gas to release the solder ball(s) carried thereon to conductive sites of a substrate for bonding thereto. In another embodiment, the bond pads of a substrate are coated with a flux or adhesive and lowered into a fluidized ball reservoir for direct attachment of solder balls.

6551917, Apr 22, 2003

Jun 29, 2001

09/897808

Chad A. Cobbley - Boise ID
Michael B. Ball - Boise ID
Marjorie L. Waddel - Boise ID

Micron Technology, Inc. - Boise ID

H01L 2144

438613, 438612, 438614, 438615, 438616, 257737, 257738

Apparatus and methods for placing conductive spheres on prefluxed bond pads of a substrate using a stencil plate with a pattern of through-holes positioned over the bond pads. Conductive spheres are placed in the through-holes by a moving feed mechanism and the spheres drop through the through-holes onto the bond pads. In one embodiment, the feed mechanism is a sphere hopper which crosses the entire through-hole pattern. In another embodiment, a shuttle plate fed spheres from a reservoir and reversibly moves about one-half of the pitch, moving from a non-discharge position to a discharge position.

6595408, Jul 22, 2003

Oct 7, 1998

09/167763

Chad A. Cobbley - Boise ID
Michael B. Ball - Boise ID
Marjorie L. Waddel - Boise ID

Micron Technology, Inc. - Boise ID

B23K 3512

228245, 228 41, 2281801, 29841

An array of solder balls is formed on a first substrate for interconnecting with conductive sites on another substrate. A ball pickup tool picks up balls with a vacuum suction from a fluidized ball reservoir and utilizes a puff of gas to release the solder ball(s) carried thereon to conductive sites of a substrate for bonding thereto. In another embodiment, the bond pads of a substrate are coated with a flux or adhesive and lowered into a fluidized ball reservoir for direct attachment of solder balls.

6844216, Jan 18, 2005

Feb 4, 2003

10/358630

Chad A. Cobbley - Boise ID, US
Michael B. Ball - Boise ID, US
Marjorie L. Waddel - Boise ID, US

Micron Technology, Inc. - Boise ID

H01L 2444
B23K 3512
H05K 330

438106, 438612, 228245, 29841

A method of attaching solder balls to a BGA package using a ball pickup tool. An array of solder balls is formed on a first substrate for interconnecting with conductive sites on another substrate. The ball pickup tool picks up balls with a vacuum suction from a fluidized ball reservoir and utilizes a puff of gas to release the solder ball(s) carried thereon to conductive sites of a substrate for bonding thereto. In another embodiment, the bond pads of a substrate are coated with a flux or adhesive and lowered into a fluidized ball reservoir for direct attachment of solder balls.

6957760, Oct 25, 2005

Feb 4, 2003

10/358849

Chad A. Cobbley - Boise ID, US
Michael B. Ball - Boise ID, US
Marjorie L. Waddel - Boise ID, US

Micron Technology, Inc. - Boise ID

B23K005/00

228 41, 228 33

A method of attaching solder balls to a BGA package using a ball pickup tool is disclosed. An array of solder balls is formed on a first substrate for interconnecting with conductive sites on another substrate. The ball pickup tool picks up balls with a vacuum suction from a fluidized ball reservoir and utilizes a puff of gas to release the solder ball(s) carried thereon to conductive sites of a substrate for bonding thereto. In another embodiment, the bond pads of a substrate are coated with a flux or adhesive and lowered into a fluidized ball reservoir for direct attachment of solder balls.

7105432, Sep 12, 2006

Feb 3, 2003

10/357825

Chad A. Cobbley - Boise ID, US
Michael B. Ball - Boise ID, US
Marjorie L. Waddel - Boise ID, US

Micron Technology, Inc. - Boise ID

H01L 21/44

438612, 438613, 438108, 228245, 228 41

Methods for placing conductive spheres on prefluxed bond pads of a substrate using a stencil plate with a pattern of through-holes positioned over the bond pads. Conductive spheres are placed in the through-holes by a moving feed mechanism and the spheres drop through the through-holes onto the bond pads. In one embodiment, the feed mechanism is a sphere hopper which crosses the entire through-hole pattern. In another embodiment, a shuttle plate fed spheres from a reservoir and reversibly moves about one-half of the pitch, moving from a non-discharge position to a discharge position.

7275676, Oct 2, 2007

Oct 29, 2004

10/977301

Chad A. Cobbley - Boise ID, US
Michael B. Ball - Boise ID, US
Marjorie L. Waddel - Boise ID, US

Micron Technology, Inc. - Boise ID

B23K 31/02

228 41

Apparatus for placing conductive spheres on prefluxed bond pads of a substrate using a stencil plate with a pattern of through-holes positioned over the bond pads. Conductive spheres are placed in the through-holes by a moving feed mechanism and the spheres drop through the through-holes onto the bond pads. In one embodiment, the feed mechanism is a sphere hopper which crosses the entire through-hole pattern. In another embodiment, a shuttle plate fed spheres from a reservoir and reversibly moves about one-half of the pitch, moving from a non-discharge position to a discharge position.

7635079, Dec 22, 2009

May 23, 2000

09/576727

Chad A. Cobbley - Boise ID, US
Michael B. Ball - Boise ID, US
Marjorie L. Waddel - Boise ID, US

Micron Technology, Inc. - Boise ID

B23K 35/12
B23K 1/00
B23K 35/14

228245, 29783, 29843, 228246, 228 41, 228 563

System for placing conductive spheres on prefluxed bond pads of a substrate using a stencil plate with a pattern of through-holes positioned over the bond pads. Conductive spheres are placed in the through-holes by a moving feed mechanism and the spheres drop through the through-holes onto the bond pads. In one embodiment, the feed mechanism is a sphere hopper which crosses the entire through-hole pattern. In another embodiment, a shuttle plate fed spheres from a reservoir and reversibly moves about one-half of the pitch, moving from a non-discharge position to a discharge position.