US Patent:
20100092888, Apr 15, 2010
Inventors:
Brent A. Buchine - Watertown MA, US
Faris Modawar - Georgetown TX, US
Marcie R. Black - Lincoln MA, US
International Classification:
G03F 7/20
B32B 3/10
B32B 15/00
C23F 1/00
H01L 33/00
H01L 31/0216
US Classification:
430296, 428156, 428173, 216 95, 216 49, 216 40, 438 42, 216 24, 216 17, 438 98, 257E33066, 257E31119, 977762
Abstract:
A process for etching a silicon-containing substrate to form structures is provided. In the process, a metal is deposited and patterned onto a silicon-containing substrate (commonly one with a resistivity above 1-10 ohm-cm) in such a way that the metal is present and touches silicon where etching is desired and is blocked from touching silicon or not present elsewhere. The metallized substrate is submerged into an etchant aqueous solution comprising about 4 to about 49 weight percent HF and an oxidizing agent such as about 0.5 to about 30 weight percent HO, thus producing a metallized substrate with one or more trenches. A second silicon etch is optionally employed to remove nanowires inside the one or more trenches.