Marc I Epitaux

6585427, Jul 1, 2003

Jun 19, 2001

09/885240

Marc Finot - Palo Alto CA
Marc Epitaux - Sunnyvale CA
Jonas Webjorn - Fremont CA
Jean-Marc Verdiell - Palo Alto CA
Robert Kohler - Mountain View CA

Intel Corporation - Santa Clara CA

G02B 600

385 92

A flexure and package including the same are provided. In one embodiment, the flexure is coupled to a second optical element and a substrate to maintain the second optical element in alignment with a first optical element. The flexure comprises a body, a pair of front and back legs. The attachment of the rear legs to the substrate causes the flexure to move from a first flexure position to a second flexure position, the distance between the first flexure position and the second flexure position equaling an offset distance. A specified length of the body is chosen such that the offset distance causes a second offset distance of the second optical component held by the flexure, and this second offset distance is within a specified range. The second offset distance is equal to the difference between a primary second optical component position and a secondary second optical component position.

6628881, Sep 30, 2003

Jun 28, 2001

09/896404

Marc Epitaux - Sunnyvale CA

Intel Corporation - Santa Clara CA

G02B 600

385137, 385135, 385136

A fiber carrier and method for using the same are described. A portion on the fiber carrier is activated to enable the fiber carrier to receive a first portion of the fiber, and the fiber carrier is closed. The fiber carrier is moved to a predetermined position. The portion on the fiber carrier is activated to release the fiber.

6821032, Nov 23, 2004

May 28, 2002

10/156435

Rickie C. Lake - Sunnyvale CA
Xiaowei Yao - Fremont CA
Charles E. Askew - Mountain View CA
Marc Epitaux - Sunnyvale CA
Marc A. Finot - Palo Alto CA
Jeffrey A. Bennett - Sunnyvale CA
Robert M. Kohler - Mountain View CA
Jean-Marc Verdiell - Palo Alto CA

Intel Corporation - Santa Clara CA

G02B 642

385 94, 385 92

A low profile ringframe used in electro-optical module packaging is disclosed. The ringframe can be mounted so as to be set back from, be flush with, or be extending exteriorly over the outer end wall of the ceramic substrate, and may also be formed so as to help physically separate the ringframe-to-subtrate solder joint from the ringframe-to-laser weld seam. The ringframe, along the side where it is sealed to the adjacent substrate, can be notched with one or more cutout areas to allow a space for wicking of reflowed solder to prevent a built-up solder fillet from forming exteriorly of the ringframe.

6864553, Mar 8, 2005

Jul 30, 2002

10/209368

Marc Epitaux - Sunnyvale CA, US
Peter E. Kirkpatrick - Berkeley CA, US
Jean-Marc Verdiell - Palo Alto CA, US

Intel Corporation - Santa Clara CA

H01L031/0203

257433, 257693, 257704, 257432, 257434, 257435

A method and apparatus for a backsided and recessed optical package connection is described. The method includes the formation of a substrate having a top surface layer and an opposed layer, including one or more recessed portions. Following formation of the substrate, leads of a lead unit are coupled to one or more of the recessed portions of the substrate. Next, one or more optical electronic components are mounted onto the top surface of the substrate. Once the optoelectric components are mounted to the top surface of the substrate, a cap is attached to the top surface of the substrate to encapsulate the one or more optical electronic components and form an optoelectronic package.

6886993, May 3, 2005

Feb 14, 2002

10/077003

Jean-Marc Verdiell - Palo Alto CA, US
Eric Zbinden - Mountain View CA, US
Robert Kohler - Mountain View CA, US
Jonas Webjorn - Redwood City CA, US
Sylvain Colin - Milpitas CA, US
Marc Epitaux - Sunnyvale CA, US

Intel Corporation - Santa Clara CA

G02B006/36

385 88, 385 91, 385 93

A package is described. In one embodiment, the package includes multiple optical elements and multiple flexures, with at least one optical element attached to each flexure. The optical elements may be in alignment with each other. In an alternative embodiment, multiple optical elements are attached to a single flexure.

6890106, May 10, 2005

Feb 14, 2002

10/077436

Jean-Marc Verdiell - Palo Alto CA, US
Eric Zbinden - Mountain View CA, US
Robert Kohler - Mountain View CA, US
Jonas Webjorn - Fremont CA, US
Sylvain Colin - Milpitas CA, US
Marc Epitaux - Sunnyvale CA, US

Intel Corporation - Santa Clara CA

G02B006/36

385 88

A package is described. In one embodiment, the package includes multiple optical elements and multiple flexures, with at least one optical element attached to each flexure. The optical elements may be in alignment with each other. In an alternative embodiment, multiple optical elements are attached to a single flexure.

6901201, May 31, 2005

Mar 29, 2002

10/113552

Jayakumar Gurusamy - Newark CA, US
Marc Epitaux - Sunnyvale CA, US
Ken Fukui - Saratoga CA, US

Intel Corporation - Santa Clara CA

G02B006/00

385135, 385134

A fiber-flexure-substrate tray for transporting and protecting optical modules and optical module components. The fiber-flexture substrate tray may have a tray body for supporting an optical fiber and other components coupled to the optical fiber while the optical fiber and the other components are processed. In addition, the fiber-flexure-substrate tray may have a thermally conductive substrate holder coupled to the tray body for heat-treating other components coupled to the optical fiber. The tray body may have a support area designed to hold the optical fiber off of the thermally conductive substrate holder to thermally isolate the optical fiber. In addition, a component may be coupled to the tray to hold the optical fiber off of the thermally conductive substrate holder.

6947229, Sep 20, 2005

Dec 19, 2003

10/742713

Eric J. Zbinden - Mountain View CA, US
Marc Epitaux - Sunnyvale CA, US
Tea H. Nim - Orange CA, US

Intel Corporation - Santa Clara CA

G02B007/02
G02F001/03
H01S003/10
B23Q017/00
H01L021/00

359819, 359260, 372 20, 372 22, 2940704, 438106

Two etalons in series may be angled to reduce parasitic reflections in the space between the two. The etalons may be soldered on either side of a post having an aperture there through to allow light to pass. Various sized solder balls and/or solder pads may be used to create the desired angle and to secure the etalons to the post. Alternatively, a lip on the post may create the desired angle. Once secured to the post, rather than aligning the etalons by pick and place methods individually, the post and attached etalons may be secured as a single unit to an optical system, such as within the cavity of an external cavity diode laser (ECDL).