Inventors:
Magda Abu-Moustafa - Lexington MA
Silvester P. Valayil - Shrewsbury MA
Assignee:
Shipley Company Inc. - Newton MA
International Classification:
C23C 302
Abstract:
An electroless copper plating solution containing, in aqueous medium, cupric ions, hydroxyl radicals, complexing agent for cupric ions, formaldehyde and a formaldehyde addition agent; wherein the molar ratio of each of copper and free formaldehyde to hydroxyl radical is between 1 to 10 and 1 to 40.