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Lorna Michelle Mitson

from Boise, ID
Age ~51
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Also known as:
Lorna M Mitson, Lorna L Mitson, Lorna M Broman
Phone and address:
9480 W River Beach Ln, Boise, ID 83714
Related to:
David K BromanLuke Linford, 30Joel Linford, 34
Connected to:
Anna E Mitson, 57Jason A Mitson, 30Mary E Mitsopoulos, 39Ron T Mitsos, 68Diana Mitsova-Boneva, 62Heather L Mitstifer, 45Portia A Mitstifer, 55Gary K Mitsui, 79Hisako Mitsui, 82Linda D Mitsui, 79

Lorna Mitson Phones & Addresses

  • 9480 W River Beach Ln, Garden City, ID 83714
  • 5847 Cosworth Pl, Boise, ID 83713 (208) 938-5421
  • Meridian, ID
  • Bozeman, MT

Work

Position: Executive, Administrative, and Managerial Occupations

Education

Degree: Associate degree or higher

Publications

Us Patents

Method For Pretreating A Substrate Prior To Application Of A Polymeric Coat

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US Patent:
6784120, Aug 31, 2004
Filed:
Jun 28, 2002
Appl. No.:
10/184493
Inventors:
John T. Davlin - Nampa ID
Douglas S. Schramm - Boise ID
Lorna M. Mitson - Meridian ID
Assignee:
Micron Technology, Inc. - Boise ID
International Classification:
H01L 2131
US Classification:
438782, 438780, 438781, 427240, 427384, 4273855
Abstract:
A method is provided for more efficient application of a polymeric coating (e. g. , die coat) to a substrate (e. g. , wafer) surface. One aspect of the method comprises applying an organic liquid (e. g. , organic solvent) to the wafer and spinning it to coat the entire wafer surface prior to the application of die coat. This reduces surface tension on the wafer and reduces the amount of die coat required to achieve a high quality film.

Method For Pretreating A Substrate Prior To Application Of A Polymeric Coat

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US Patent:
6946407, Sep 20, 2005
Filed:
Feb 3, 2004
Appl. No.:
10/770801
Inventors:
John T. Davlin - Nampa ID, US
Douglas S. Schramm - Boise ID, US
Lorna M. Mitson - Meridian ID, US
Assignee:
Micron Technology, Inc. - Boise ID
International Classification:
H01L021/31
H01L021/469
US Classification:
438782, 438780, 438781, 427240, 427384, 4273855
Abstract:
A method is provided for more efficient application of a polymeric coating (e. g. , die coat) to a substrate (e. g. , wafer) surface. One aspect of the method comprises applying an organic liquid (e. g. , organic solvent) to the wafer and spinning it to coat the entire wafer surface prior to the application of die coat. This reduces surface tension on the wafer and reduces the amount of die coat required to achieve a high quality film.

Method For Pretreating A Substrate Prior To Application Of A Polymeric Coat

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US Patent:
6461983, Oct 8, 2002
Filed:
Aug 11, 1999
Appl. No.:
09/372631
Inventors:
John T. Davlin - Nampa ID
Douglas S. Schramm - Boise ID
Lorna M. Mitson - Meridian ID
Assignee:
Micron Technology, Inc. - Boise ID
International Classification:
H01L 2131
US Classification:
438782, 438780, 438781, 427240, 427384, 4273855
Abstract:
A method is provided for more efficient application of a polymeric coating (e. g. , die coat) to a substrate (e. g. , wafer) surface. One aspect of the method comprises applying an organic liquid (e. g. , organic solvent) to the wafer and spinning it to coat the entire wafer surface prior to the application of die coat. This reduces surface tension on the wafer and reduces the amount of die coat required to achieve a high quality film.
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Lorna Michelle Mitson from Boise, ID, age ~51 Get Report