Resumes
Resumes
Lloyd Rodenbeck Phones & Addresses
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New Ulm, TX
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Pointblank, TX
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New Caney, TX
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21915 Mockingbird St, Leander, TX 78645 (512) 267-9879
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21917 Mockingbird St, Lago Vista, TX 78645 (512) 267-9879
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Houston, TX
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PO Box 36, New Ulm, TX 78950 (979) 992-3677
Work
Position:
Installation, Maintenance, and Repair Occupations
Education
Degree:
Associate degree or higher
Business Records
Name / Title
Company / Classification
Phones & Addresses
Owner
Anloy Technologies
Public Relations Services
Public Relations Services
3255 Gattis School Rd, Round Rock, TX 78664
(512) 388-2313
(512) 388-2313
Publications
Us Patents
Semiconductor And Flip Chip Packages And Method Having A Back-Side Connection
View pageUS Patent:
6406938, Jun 18, 2002
Filed:
Dec 18, 2000
Appl. No.:
09/739071
Inventors:
Lloyd R. Rodenbeck - Round Rock TX
Donald R. Potter - Round Rock TX
Donald R. Potter - Round Rock TX
Assignee:
Minco Technology Labs, Inc. - Austin TX
International Classification:
H01L 2144
US Classification:
438108, 438124, 438118, 438127
Abstract:
A semiconductor chip package having a back side connection and method of manufacture. The semiconductor chip package can combine industry standard die having conductive back sides with flip chip bump bonding to provide discrete and integrated devices that require less space on a printed circuit board. The chip packages can include a die connected by front side bond pads to a substrate. The substrate includes terminals opposite the side facing the die that electrically connect to contact pads on the opposite side of the substrate by way of vias. In one embodiment, the vias are buried in the substrate. The substrate contact pads connect to bond pads on the front side of the die. The back side of the die is electrically connected to a bond pad (and thereby to the terminal through the via) using a conductive substance that can cascade from the back side of the die to the bond pad. Solder balls can be attached to the terminals to provide solder connections to a printed circuit board. An insulating coating can be applied to the die between the conductive substance and the edge of the die along which the conductive substance cascades.
Semiconductor And Flip Chip Packages And Method Having A Back-Side Connection
View pageUS Patent:
61914878, Feb 20, 2001
Filed:
Apr 23, 1998
Appl. No.:
9/065677
Inventors:
Lloyd R. Rodenbeck - Round Rock TX
Donald R. Potter - Round Rock TX
Donald R. Potter - Round Rock TX
Assignee:
Minco Technology Labs, Inc. - Austin TX
International Classification:
H01L 2348
US Classification:
257778
Abstract:
A semiconductor chip package having a back side connection and method of manufacture. The semiconductor chip package can combine industry standard die having conductive back sides with flip chip bump bonding to provide discrete and integrated devices that require less space on a printed circuit board. The chip packages can include a die connected by front side bond pads to a substrate. The substrate includes terminals opposite the side facing the die that electrically connect to contact pads on the opposite side of the substrate by way of vias. In one embodiment, the vias are buried in the substrate. The substrate contact pads connect to bond pads on the front side of the die. The back side of the die is electrically connected to a bond pad (and thereby to the terminal through the via) using a conductive substance that can cascade from the back side of the die to the bond pad. Solder balls can be attached to the terminals to provide solder connections to a printed circuit board. An insulating coating can be applied to the die between the conductive substance and the edge of the die along which the conductive substance cascades.