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Lisa Tarte Phones & Addresses

  • 808 Adams Ave, Livermore, CA 94550 (925) 373-7570 (510) 455-5196
  • Piedmont, CA
  • Tracy, CA

Skills

Engineering

Languages

English

Interests

Exercise • Home Improvement • Reading • Sports • Golf • Home Decoration • Watching Sports • Collecting Coins • Cooking • Electronics • Baseball • Music • Dogs • Movies • Collecting • Kids • Automobiles • Travel • Career • Watching Baseball • Investing • Traveling • International Traavel • Stamp Collecting

Industries

Research

Resumes

Resumes

Lisa Tarte Photo 1

Lisa Tarte

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Location:
808 Adams Ave, Livermore, CA 94550
Industry:
Research
Skills:
Engineering
Interests:
Exercise
Home Improvement
Reading
Sports
Golf
Home Decoration
Watching Sports
Collecting Coins
Cooking
Electronics
Baseball
Music
Dogs
Movies
Collecting
Kids
Automobiles
Travel
Career
Watching Baseball
Investing
Traveling
International Traavel
Stamp Collecting
Languages:
English

Publications

Us Patents

Process For Protecting Bonded Components From Plating Shorts

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US Patent:
60514930, Apr 18, 2000
Filed:
Oct 14, 1994
Appl. No.:
8/323410
Inventors:
Lisa A. Tarte - Livermore CA
Wayne L. Bonde - Pleasanton CA
Paul G. Carey - Mountain View CA
Robert J. Contolini - Pleasanton CA
Anthony M. McCarthy - Menlo Park CA
Assignee:
The Regents of the University of California - Oakland CA
International Classification:
H01L 2144
US Classification:
438662
Abstract:
A method which protects the region between a component and the substrate onto which the components is bonded using an electrically insulating fillet of photoresist. The fillet protects the regions from subsequent plating with metal and therefore shorting the plated conductors which run down the sides of the component and onto the substrate.

Method For Vacuum Fusion Bonding

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US Patent:
62058193, Mar 27, 2001
Filed:
Apr 11, 2000
Appl. No.:
9/546816
Inventors:
Harold D. Ackler - Sunnyvale CA
Stefan P. Swierkowski - Livermore CA
Lisa A. Tarte - Livermore CA
Randall K. Hicks - Stockton CA
Assignee:
The Regents of the University of California - Oakland CA
International Classification:
C03B23/20
US Classification:
65 36
Abstract:
An improved vacuum fusion bonding structure and process for aligned bonding of large area glass plates, patterned with microchannels and access holes and slots, for elevated glass fusion temperatures. Vacuum pumpout of all components is through the bottom platform which yields an untouched, defect free top surface which greatly improves optical access through this smooth surface. Also, a completely non-adherent interlayer, such as graphite, with alignment and location features is located between the main steel platform and the glass plate pair, which makes large improvements in quality, yield, and ease of use, and enables aligned bonding of very large glass structures.

Fusion Bonding And Alignment Fixture

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US Patent:
6082140, Jul 4, 2000
Filed:
Jun 16, 1999
Appl. No.:
9/334438
Inventors:
Harold D. Ackler - Sunnyvale CA
Stefan P. Swierkowski - Livermore CA
Lisa A. Tarte - Livermore CA
Randall K. Hicks - Stockton CA
Assignee:
The Regents of the University of California - Oakland CA
International Classification:
C03B 2320
US Classification:
65 36
Abstract:
An improved vacuum fusion bonding structure and process for aligned bonding of large area glass plates, patterned with microchannels and access holes and slots, for elevated glass fusion temperatures. Vacuum pumpout of all the components is through the bottom platform which yields an untouched, defect free top surface which greatly improves optical access through this smooth surface. Also, a completely non-adherent interlayer, such as graphite, with alignment and location features is located between the main steel platform and the glass plate pair, which makes large improvements in quality, yield, and ease of use, and enables aligned bonding of very large glass structures.

Removal Of Field And Embedded Metal By Spin Spray Etching

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US Patent:
54862345, Jan 23, 1996
Filed:
Jan 19, 1995
Appl. No.:
8/375054
Inventors:
Robert J. Contolini - Pleasanton CA
Steven T. Mayer - San Leandro CA
Lisa A. Tarte - Livermore CA
Assignee:
The United States of America as represented by The United States
Department of Energy - Washington DC
International Classification:
H01L 2100
US Classification:
216 91
Abstract:
A process of removing both the field metal, such as copper, and a metal, such as copper, embedded into a dielectric or substrate at substantially the same rate by dripping or spraying a suitable metal etchant onto a spinning wafer to etch the metal evenly on the entire surface of the wafer. By this process the field metal is etched away completely while etching of the metal inside patterned features in the dielectric at the same or a lesser rate. This process is dependent on the type of chemical etchant used, the concentration and the temperature of the solution, and also the rate of spin speed of the wafer during the etching. The process substantially reduces the metal removal time compared to mechanical polishing, for example, and can be carried out using significantly less expensive equipment.
Lisa Ann Tarte from Livermore, CA, age ~64 Get Report