US Patent:
20120324727, Dec 27, 2012
Inventors:
KURT P. SEIFERT - CORTLAND OH, US
LISA L. FLAUTO - BOARDMAN OH, US
JEFFREY M. HANDEL - WARREN OH, US
MASAHIRO YOSHINO - TOYOTA-SHI, JP
Assignee:
DELPHI TECHNOLOGIES, INC. - TROY MI
International Classification:
H01R 43/05
Abstract:
A method to electrically and mechanically connect at least one wire conductor to a terminal includes the steps of cutting and stripping a portion of an insulation outer layer along an end section of the at least one wire conductor to expose a lead of the at least one wire conductor. A further step includes applying a bonding process to the exposed lead to break down oxides disposed on the lead. A further step in the method is crimping the lead having the applied bonding process to the terminal to form a crimp connection connecting the at least one wire conductor to the terminal.