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Leonid Boris Malevanchik

from San Diego, CA
Age ~69
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Also known as:
Leonid B Malevanchik, Leonid K
Phone and address:
10849 Corte De Marin, San Diego, CA 92130
Related to:
Darren M Pyle, 51Charissa Sigaloff, 45Ernest RoperHolli D Roper, 44Jessica Kornegay, 48Lev Malevanchik, 39
Connected to:
Joy H Malever, 58Anna Malewicz, 44Izabela J Malewicz, 55Kara A Malewicz, 58Diane M Malewiski, 64Diane Malewitz, 61Alexander J Malewski, 70Michal Malewski, 45Becky Maley, 44Brenda K Maley, 56

Leonid Malevanchik Phones & Addresses

  • 10849 Corte De Marin, San Diego, CA 92130
  • 3468 Applewood Dr, Tucson, AZ 85712
  • Brooklyn, NY

Work

Company: Illumina May 2012 Address: San Diego, CA Position: Development engineer

Education

Degree: Master of Science School / High School: Moscow State University of Environmental Engineering (MSUEE) 1972 to 1977 Specialities: Mechanical Engineering

Skills

Design For Manufacturing • Manufacturing • Product Development • Solidworks • Engineering • Semiconductors • Medical Devices • R&D • Sheet Metal • Testing • Mechanical Engineering • Automation

Industries

Biotechnology

Resumes

Resumes

Leonid Malevanchik Photo 1

Senior Staff Engineer

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Location:
San Diego, CA
Industry:
Biotechnology
Work:
Illumina - San Diego, CA since May 2012
Development engineer
Novo Engineering - San Diego, CA since Apr 2012
Mechanical Design Engineer
Cyntellect - Greater San Diego Area Mar 2010 - May 2010
Senior Mechanical Engineer (Temp)
Agilent Technologies 2002 - Mar 2010
Sr Mechanical Engineer
Veeco Instruments Sep 1998 - Apr 2002
Senior Mechanical Engineer
Education:
Moscow State University of Environmental Engineering (MSUEE) 1972 - 1977
Master of Science, Mechanical Engineering
Skills:
Design For Manufacturing
Manufacturing
Product Development
Solidworks
Engineering
Semiconductors
Medical Devices
R&D
Sheet Metal
Testing
Mechanical Engineering
Automation

Business Records

Name / Title
Company / Classification
Phones & Addresses
Leonid Malevanchik
Principal
LM Studio 2010
Misc Personal Services
10849 Corte De Marin, San Diego, CA 92130

Publications

Us Patents

High Speed Document Separator And Sequencing Apparatus

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US Patent:
61764833, Jan 23, 2001
Filed:
Mar 12, 1997
Appl. No.:
8/816193
Inventors:
Leonid Malevanchik - Tucson AZ
Assignee:
Bell & Howell Mail and Messaging Technologies Company - Durham NC
International Classification:
B65H 534
B65H 2968
US Classification:
271270
Abstract:
A separator and sequencing apparatus comprising a first selective document transport means for selective movement of documents and a second selective document transport means for selective movement of documents positioned adjacent to the first selective document transport means, the first and second selective document transport means configured to move at least one of a pair of documents located in said separator and sequencing apparatus.

Flow Cell Package And Method For Making The Same

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US Patent:
20210208055, Jul 8, 2021
Filed:
Mar 3, 2021
Appl. No.:
17/191612
Inventors:
- San Diego CA, US
- Cambridge, GB
David Heiner - Vista CA, US
Edwin Li - Los Angeles CA, US
Alexandre Richez - Cambridge, GB
John M. Beierle - Carlsbad CA, US
Kevan Samiee - San Diego CA, US
Kristina Munoz - Coronado CA, US
Leonid Malevanchik - San Diego CA, US
Ludovic Vincent - San Diego CA, US
Naiqian Zhan - San Diego CA, US
Peyton Shieh - San Diego CA, US
Robert Yang - San Diego CA, US
Samantha Schmitt - San Diego CA, US
Sang Park - San Diego CA, US
Scott Bailey - San Diego CA, US
Sean M. Ramirez - San Diego CA, US
Sunmin Ahn - San Diego CA, US
Valerie Uzzell - Solana Beach CA, US
Wei Wei - San Diego CA, US
Yuxiang Huang - San Diego CA, US
Tyler Jamison Dill - San Diego CA, US
International Classification:
G01N 15/14
C12Q 1/6874
B01L 3/00
C09D 133/24
C09D 133/26
B01J 19/00
Abstract:
A flow cell package includes first and second surface-modified patterned wafers and a spacer layer. The first surface-modified patterned wafer includes first depressions separated by first interstitial regions, a first functionalized molecule bound to a first silane or silane derivative in at least some of the first depressions, and a first primer grafted to the first functionalized molecule in the at least some of the first depressions. The second surface-modified patterned wafer includes second depressions separated by second interstitial regions, a second functionalized molecule bound to a second silane or silane derivative in at least some of the second depressions, and a second primer grafted to the second functionalized molecule in the at least some of the second depressions. The spacer layer bonds at least some first interstitial regions to at least some second interstitial regions, and at least partially defines respective fluidic chambers of the flow cell package.

Flow Cell Package And Method For Making The Same

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US Patent:
20180195950, Jul 12, 2018
Filed:
Dec 20, 2017
Appl. No.:
15/848450
Inventors:
- San Diego CA, US
- Essex, GB
David Heiner - Vista CA, US
Edwin Li - Los Angeles CA, US
Alexandre Richez - Cambridge, GB
John M. Beierle - Carlsbad CA, US
Kevan Samiee - San Diego CA, US
Kristina Munoz - Coronado CA, US
Leonid Malevanchik - San Diego CA, US
Ludovic Vincent - San Diego CA, US
Naiqian Zhan - San Diego CA, US
Peyton Shieh - San Diego CA, US
Robert Yang - San Diego CA, US
Samantha Schmitt - San Diego CA, US
Sang Park - San Diego CA, US
Scott Bailey - San Diego CA, US
Sean M. Ramirez - San Diego CA, US
Sunmin Ahn - San Diego CA, US
Valerie Uzzell - Solana Beach CA, US
Wei Wei - San Diego CA, US
Yuxiang Huang - San Diego CA, US
Tyler Jamison Dill - San Diego CA, US
International Classification:
G01N 15/14
C12Q 1/6874
B01L 3/00
C09D 133/24
C09D 133/26
Abstract:
A flow cell package includes first and second surface-modified patterned wafers and a spacer layer. The first surface-modified patterned wafer includes first depressions separated by first interstitial regions, a first functionalized molecule bound to a first silane or silane derivative in at least some of the first depressions, and a first primer grafted to the first functionalized molecule in the at least some of the first depressions. The second surface-modified patterned wafer includes second depressions separated by second interstitial regions, a second functionalized molecule bound to a second silane or silane derivative in at least some of the second depressions, and a second primer grafted to the second functionalized molecule in the at least some of the second depressions. The spacer layer bonds at least some first interstitial regions to at least some second interstitial regions, and at least partially defines respective fluidic chambers of the flow cell package.
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Leonid Boris Malevanchik from San Diego, CA, age ~69 Get Report