Kenneth J. Huth - Whitsett NC, US Lawrence C. Monterulo - Yonkers NY, US
Assignee:
Semx Corporation - Montvale NJ
International Classification:
B23K 31/02 B23K 31/00
US Classification:
22818022, 2282481
Abstract:
A method for accurately depositing a required volume of solder material on a specific area of a lead frame, substrate or other part of an electronic component to be bonded by reflow of solder material to another part into a reliable, void-free connection during a subsequent assembly step comprises the following steps. Minute particles of solder material whose cumulative volume corresponds to the total volume to be deposited are loaded into a cavity cut into a fixture made from a material such as graphite. The cavity delineates the specific area of deposit. The part is then laid upon the fixture and immobilized thereon by a cover made from a material such as graphite. The fixture and its enclosed part are then subjected to solder material melting temperature under a controlled atmosphere in a furnace. The cavity is patterned and dimensioned to accommodate the right number of uniformly dimensioned particles necessary to precisely create the desired deposit of solder material.
Lawrence Monterulo - Yonkers NY, US Valdislav Cichra - Harrison NY, US
International Classification:
B65H059/02
US Classification:
242/421700
Abstract:
A tension-regulated wire-feeding apparatus, particularly adapted to high speed winding of thin conductor wires upon an electronic component, applies a magnetic particle brake to the wire supply spool in inverse proportion to the pulling tension applied on the wire by the winding mechanism. The brake is controlled by an electric current generated by a controllable power supply. The output of the power supply is modulated by a follower potentiometer coupled to a lever arm which resiliently bear against a segment of wire unwound from the supply spool in order to monitor its pulling tension.
Solder Deposit Method On Electronic Packages For Post-Connection Process
Kenneth Huth - Whitsett NC, US Lawrence Monterulo - Yonkers NY, US John Sugrue - Stratford CT, US
International Classification:
B23K 31/02 B21D 39/00 H01L 29/768
US Classification:
228174000, 228180100, 257244000
Abstract:
A method for accurately depositing a continuous and homogeneous line of a minute, metered volume of solder to a delineated area of an electronic component comprises positioning over said area a template made of high temperature withstanding material such as high density graphite and having a series of spaced-apart bores joined at their base by a groove defining said line. Particles of solder having a cumulative size corresponding to said volume are inserted into the bores. The component and template assembly is then subjected to solder-melting temperature under a control atmosphere, causing the solder to flow and evenly deposit on the targeted area.
Method For Depositing Solder Material On An Electronic Component Part
Kenneth J. Huth - Whitsett NC, US Lawrence C. Monterulo - Yonkers NY, US John C. Sugrue - Stratford CT, US
International Classification:
B23K 1/20 B23K 31/02
US Classification:
228256
Abstract:
A method for accurately depositing a required volume of solder material on a specific area of a lead frame, substrate or other part () of an electronic component to be bonded by reflow of solder material to another part into a reliable, void-free connection during a subsequent assembly step comprises the following steps. Minute particles () of solder material whose cumulative volume corresponds to the total volume to be deposited are loaded into a cavity () cut into a fixture () made from a material such as graphite. The cavity delineates the specific area of deposit. The part () is then laid upon the fixture and immobilized thereon by a cover () made from a material such as graphite. The fixture and its enclosed part are then subjected to solder material melting temperature under a controlled atmosphere in a furnace. The cavity is patterned and dimensioned to accommodate the right number of uniformly dimensioned particles necessary to precisely create the desired deposit of solder material.
