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Lawrence M Ficarra

from Billerica, MA
Age ~61
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Also known as:
Larry M Ficarra
Phone and address:
86 Gray St, Billerica, MA 01821
(978) 663-9014
Related to:
Gina Marie Gordon, 51Elaine Ficarra, 90Diane Ficarra, 66Joseph Michalik, 35Joseph FicarraRichard Ficarra, 65
Connected to:
Jeffrey P Ficarra, 64Jennifer Ficarra, 47Justin M Ficarra, 40Lauren Ficarra, 46Loire A Ficarra, 59Louis J Ficarra, 75Luke D Ficarra, 45Salvatore Ficarra, 62Susan Ficarra, 69Anthony R Ficarri, 83

Lawrence Ficarra Phones & Addresses

  • 86 Gray St, Billerica, MA 01821 (978) 663-9014
  • North Kingstown, RI
  • Dover, NH
  • Lowell, MA
  • Thornton, NH
  • Newark, NJ
  • Stoneham, MA

Resumes

Resumes

Lawrence Ficarra Photo 1

Seniro Engineering Manager At Vsea

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Location:
Greater Boston Area
Industry:
Semiconductors
Lawrence Ficarra Photo 2

Senior Engineering Manager At Vsea

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Location:
Greater Boston Area
Industry:
Semiconductors

Publications

Us Patents

System And Method For Serial Ion Implanting Productivity Enhancements

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US Patent:
7019315, Mar 28, 2006
Filed:
Dec 8, 2004
Appl. No.:
11/007735
Inventors:
Alan P. Sheng - Gloucester MA, US
Benjamin B. Riordon - Newburyport MA, US
Lawrence M. Ficarra - Billerica MA, US
Assignee:
Varian Semiconductor Equipment Associates, Inc. - Gloucester MA
International Classification:
H01J 21/265
US Classification:
25049221, 25044211
Abstract:
An ion implantation apparatus is provided for workpiece handling. The apparatus includes a plurality of scan systems for scanning workpieces in an ion implanting beam, a plurality of exchangers for moving the workpieces to and from the scan systems, and a system controller for positioning one of the workpieces for scanning in the ion implanting beam by one of the scan systems, sensing completion of the ion beam scanning for the one workpiece and simultaneously positioning another of the workpieces for scanning in the ion implanting beam by another of the scan systems so that the workpieces are continuously presented to the ion implanting beam. The apparatus provides continuous implantation relative to the beam, thus enabling wafer exchange to occur in parallel with the implantation process. As a result, significant system productivity improvement and wafer throughput will be realized.

System And Method For Multi-Wafer Scanning In Ion Implanters

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US Patent:
20050121626, Jun 9, 2005
Filed:
Dec 8, 2003
Appl. No.:
10/730863
Inventors:
Alan Sheng - Gloucester MA, US
Beniamin Riordon - Newburyport MA, US
Lawrence Ficarra - Billerica MA, US
Assignee:
Varian Semiconductor Equipment Associates, Inc. - Gloucester MA
International Classification:
H01J037/317
US Classification:
250492210
Abstract:
Methods and systems are provided for increasing the efficiency of the ion beam during scanning workpieces in ion implanting such that multiple wafers are arranged on a platen or support so that a greater portion of the beam scans the workpiece surface. Specifically, an apparatus is provided for ion implanting a plurality of workpieces. The apparatus includes an ion source for generating an ion beam having a scan width and a scan distance which defines a predetermined scan area, a holder for receiving the workpieces that are arranged so as to maximize the surface area of the workpieces present within the predetermined scan area. Thereby, a scanner may scan the ion beam over the predetermined scan area so that the utilization efficiency of said ion beam on the workpieces is increased. More particularly, the workpieces may be semiconductor wafers that are arranged over the holder or a platen according to the formula: *()+As a result of arranging the workpieces on the holder in this manner, the utilization of ion beam is maximized.

Technique For Reducing Backside Particles

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US Patent:
20060124155, Jun 15, 2006
Filed:
Sep 30, 2005
Appl. No.:
11/239000
Inventors:
David Suuronen - Newburyport MA, US
Arthur Riaf - Gloucester MA, US
Paul Buccos - Haverhill MA, US
Kevin Daniels - Wakefield MA, US
Paul Murphy - Reading MA, US
Lawrence Ficarra - Billerica MA, US
Kenneth Starks - Gloucester MA, US
International Classification:
B08B 3/02
US Classification:
134033000, 134034000, 13405600R, 134172000, 134902000
Abstract:
A technique for reducing backside particles is disclosed. In one particular exemplary embodiment, the technique may be realized as an apparatus for reducing backside particles. The apparatus may comprise a delivery mechanism configured to supply a cleaning substance to a platen, wherein the platen is housed in a process chamber. The apparatus may also comprise a control unit configured to cause the process chamber to reach a first pressure level, cause the cleaning substance to be supplied to a surface of the platen, and cause the process chamber to reach a second pressure level, thereby removing contaminant particles, together with the cleaning substance, from the surface of the platen.

Methods And Apparatus For Enabling Multiple Process Steps On A Single Substrate

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US Patent:
20060258128, Nov 16, 2006
Filed:
Jan 11, 2006
Appl. No.:
11/329761
Inventors:
Peter Nunan - Monte Sereno CA, US
Anthony Renau - West Newbury MA, US
Alan Sheng - Gloucester MA, US
Paul Murphy - Reading MA, US
Charles Teodorczyk - Danville NH, US
Steven Anella - West Newbury MA, US
Samuel Barsky - Wakefield MA, US
Lawrence Ficarra - Billerica MA, US
Richard Hertel - Boxford MA, US
International Classification:
H01L 21/677
H01L 21/04
US Classification:
438510000, 414217000
Abstract:
Substrate masking apparatus includes a platen assembly to support a substrate for processing, a mask having an aperture, a retaining mechanism to retain the mask in a masking position, and a positioning mechanism to change the relative positions of the mask and the substrate so that different areas of the substrate are exposed through the aperture in the mask. The apparatus may further include a mask loading mechanism to transfer the mask to and between the masking position and a non-masking position. The processing may include ion implantation of the substrate with different implant parameter values in different areas. In other embodiments, an area of the substrate to be processed is selectable by a mask, a shutter or a beam modifier in front of the substrate.

Wafer-Handling Method, System, And Apparatus

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US Patent:
20070081880, Apr 12, 2007
Filed:
Sep 29, 2005
Appl. No.:
11/238777
Inventors:
Benjamin Riordon - Newburyport MA, US
Lawrence Ficarra - Billerica MA, US
James Buonodono - Amesbury MA, US
International Classification:
H01L 21/677
US Classification:
414217000
Abstract:
The invention provides a wafer-handling method, system, and apparatus. In one embodiment, the invention provides a wafer-handling apparatus comprising: a clamping surface for securing a wafer; and a load lock sealing surface for forming an airtight seal with a load lock wall.
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Lawrence M Ficarra from Billerica, MA, age ~61 Get Report