Inventors:
Katsuhide Ohtani - Settsu, JP
Tsuyoshi Ono - Settsu, JP
Haruhisa Masuda - Settsu, JP
Ron Klein - Orangeburg NY, US
Masakazu Irie - Ichihara, JP
Kazuo Kobayashi - Ichihara, JP
Igor Chorvath - Midland MI, US
Tatyana Collins - Midland MI, US
Lauren Tonge - Midland MI, US
Assignee:
Dow Corning Corporation - Midland MI
Dow Corning Toray Co., Ltd. - Tokyo-to
Daikin Industries, Ltd. - Osaka-fu
Daikin America, Inc. - Orangeburg NY
International Classification:
C08L 27/18
Abstract:
The present invention relates to a fluorine-containing resin composition for molding comprising a fluorine-containing resin (A) and a hydrofluoric acid scavenger (B), in which the hydrofluoric acid scavenger (B) is organopolysiloxane. According to the present invention, a fluorine-containing resin composition which can reduce an amount of hydrofluoric acid released from a fluorine-containing resin and inhibits corrosiveness can be provided.