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Kyle J Palmiscno

from Loveland, CO
Age ~39
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Also known as:
Kyle Joseph Palmiscno, Kyle J Palmiseno, Kyle N
Related to:
Jerry Johnson, 55Kelly Johnson, 51Cheri Palmiscno, 55Becky G Brundin, 71
Connected to:
Alice M Palmisano, 64Angela T Palmisano, 41Anthony Palmisano, 95Carolyn M Palmisano, 77Christine Palmisano, 81Gary J Palmisano, 59George G Palmisciano, 72Geraldine M Palmisano, 75Glynis E Palmisano, 61Gregory P Palmisano, 62

Kyle Palmiscno Phones & Addresses

  • Loveland, CO
  • Greeley, CO
  • Grand Forks, ND

Professional Records

License Records

Kyle Joseph Palmiscno

Address:
5775 W 29 St #802, Greeley, CO 80634
License #:
48307 - Active
Issued Date:
Dec 17, 2013
Renew Date:
Nov 1, 2015
Expiration Date:
Oct 31, 2017
Type:
Professional Engineer

Publications

Us Patents

Moment Connection Component Gripping Apparatus

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US Patent:
20190249450, Aug 15, 2019
Filed:
Feb 8, 2019
Appl. No.:
16/271746
Inventors:
- Pleasanton CA, US
Kevin Marek - Hayward CA, US
Eric Bellman - Hayward CA, US
Maxwell C. Simmons - Hayward CA, US
Robert J. Simmons - Hayward CA, US
Kyle Joseph Palmiscno - Loveland CO, US
Assignee:
ConXtech, Inc. - Pleasanton CA
International Classification:
E04G 21/16
E04B 1/19
Abstract:
A gripping apparatus is disclosed, including a rigid housing having a slot with an engagement axis, and a shaft extending parallel to the engagement axis. The apparatus further includes a tab member on a distal end of the shaft and a rotational actuator on a proximal end of the shaft. The rotational actuator is configured to rotate the shaft, causing the tab member to move between a hooked position and an unhooked position.

Adapter For Inserting Wafer Ring Between Flanges Of Process Piping

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US Patent:
20150276437, Oct 1, 2015
Filed:
Mar 27, 2014
Appl. No.:
14/227535
Inventors:
- Boulder CO, US
Kyle Joseph Palmiscno - Greeley CO, US
International Classification:
G01D 11/30
Abstract:
An industrial process assembly for carrying a process fluid conveyed through process piping includes a wafer having a sealing surface of a first type and a fitting having a sealing surface of a second type, different from the first type. The wafer includes a bore for carrying the process fluid and the fitting is attached to process piping. An adapter has a first sealing surface for mating with the sealing surface of the wafer and a second sealing surface for mating with the sealing surface of the fitting. The adapter is positioned between the wafer and the fitting. The adapter further includes an inner bore having a same diameter as the bore of the wafer in some embodiments. An additional adapter is provided on a second side of the wafer in some embodiments.
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Kyle J Palmiscno from Loveland, CO, age ~39 Get Report