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Kyle Stanton Lebouitz

from Bethlehem, PA
Age ~54

Kyle Lebouitz Phones & Addresses

  • 445 High St, Bethlehem, PA 18018 (412) 613-2708
  • 1725 Merriman St, West Mifflin, PA 15122 (412) 381-3860
  • 2403 Sidney St, Pittsburgh, PA 15203
  • York, PA
  • 555 Pierce St, Albany, CA 94706 (510) 527-5850
  • 1725 Merriman St, Pittsburgh, PA 15203

Work

Company: Spts technologies ltd Jun 1, 2013 Position: Director of technology , release etch products

Education

Degree: Doctorates, Doctor of Philosophy School / High School: University of California, Berkeley 1993 to 1998 Specialities: Mechanical Engineering

Skills

Semiconductors • R&D • Product Development • Electronics • Design of Experiments • Thin Films • Manufacturing • Product Management • Nanotechnology • Labview • Entrepreneurship

Industries

Semiconductors

Resumes

Resumes

Kyle Lebouitz Photo 1

Director Of Technology, Release Etch

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Location:
445 High St, Bethlehem, PA 18018
Industry:
Semiconductors
Work:
Spts Technologies Ltd
Director of Technology , Release Etch Products

Xactix Dec 1998 - Jun 2013
Chief Technology Officer and Founder

Dec 1998 - Jun 2013
Director of Technology, Release Etch
Education:
University of California, Berkeley 1993 - 1998
Doctorates, Doctor of Philosophy, Mechanical Engineering
Worcester Polytechnic Institute 1988 - 1993
Bachelors, Bachelor of Science, Engineering, Mechanical Engineering
Skills:
Semiconductors
R&D
Product Development
Electronics
Design of Experiments
Thin Films
Manufacturing
Product Management
Nanotechnology
Labview
Entrepreneurship

Business Records

Name / Title
Company / Classification
Phones & Addresses
Kyle S. Lebouitz
Principal
Lebouitz Realty
Real Estate Agent/Manager
175 Hidden Hl Farm Ln, York, PA 17403
Kyle Lebouitz
Chief Security Officer
XACTIX, Inc.
Oil & Energy · Manufacture of Semiconductor Manufacturing Equipment · Manufacturer of Semiconductor Manufacturing Equipment · Metal Restoration · Metal Coating & Nonprecious Engraving · Etched Products-Metal Glass &
2403 Sidney St #265, Pittsburgh, PA 15203
7377 William Ave, Allentown, PA 18106
(412) 381-3195
Kyle S. Lebouitz
President
Silicon Bio Technology Inc
Business Services at Non-Commercial Site · Nonclassifiable Establishments
175 Hidden Hl Farm Ln, York, PA 17403

Publications

Us Patents

Microfabricated Filter And Shell Constructed With A Permeable Membrane

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US Patent:
6478974, Nov 12, 2002
Filed:
Jul 6, 1999
Appl. No.:
09/347903
Inventors:
Kyle S. Lebouitz - Albany CA
Roger T. Howe - Lafayette CA
Albert P. Pisano - Livermore CA
Assignee:
The Regents of the University of California - Oakland CA
International Classification:
B01D 6700
US Classification:
216 2, 216 39, 216 56, 216 97
Abstract:
A method of fabricating a microfabricated filter. The method includes forming a frame structure and forming a plurality of openings through the frame structure. A permeable polysilicon membrane is formed over the plurality of openings through the frame structure. At least part of the sacrificial structure is etched with an etchant wherein the etchant passes through the permeable polysilicon membrane. The permeable polycrystal silicon membrane may have a thickness of between about 0. 05 micrometers and about 0. 30 micrometers.

Cutting Instrument Having Integrated Sensors

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US Patent:
6494882, Dec 17, 2002
Filed:
Jul 25, 2000
Appl. No.:
09/626273
Inventors:
Kyle S. Lebouitz - Pittsburgh PA
Michele Migliuolo - McMurray PA
Assignee:
Verimetra, Inc. - Pittsburgh PA
International Classification:
A61B 1818
US Classification:
606 45
Abstract:
A cutting instrument including a metal blade has a recess formed therein and a semiconductor substrate affixed to the blade in the recess. The semiconductor substrate includes at least one sensor formed thereon. The sensor formed on the semiconductor substrate may comprise at least one or an array of a strain sensors, pressure sensors, nerve sensors, temperature sensors, density sensors, accelerometers, and gyroscopes. The cutting instrument may also further include a handle wherein the blade is affixed to the handle and the semiconductor substrate is electrically coupled to the handle. The handle may then be coupled, either physically or by wireless transmission, to a computer that is adapted to display information to a person using the cutting instrument based on signals generated by one or more of the sensors formed on the semiconductor substrate. The computer or handle may also be adapted to store data based on the signals generated by one or more of the sensors. A method of making said cutting instrument includes the steps of at least one sensor being formed on a semiconductor wafer and a layer of photoresist being applied on a top side of the semiconductor wafer according to a pattern that matches the defined shape of the semiconductor substrate.

Thermal Isolation Using Vertical Structures

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US Patent:
6566725, May 20, 2003
Filed:
Jul 28, 2000
Appl. No.:
09/628201
Inventors:
Kyle Lebouitz - Pittsburgh PA
Assignee:
Xactix, Inc. - Pittsburgh PA
International Classification:
H01L 31058
US Classification:
257467, 257501, 257510
Abstract:
This invention relates to the construction of microfabricated devices and, in particular, to types of microfabricated devices requiring thermal isolation from the substrates upon which they are built. This invention discloses vertical thermal isolators and methods of fabricating the vertical thermal isolators. Vertical thermal isolators offer an advantage over thermal isolators of the prior art, which were substantially horizontal in nature, in that less wafer real estate is required for the use of the vertical thermal isolators, thereby allowing a greater density per unit area of the microfabricated devices.

Method Of Fabricating Epidermal Abrasion Device

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US Patent:
6610235, Aug 26, 2003
Filed:
Nov 17, 2000
Appl. No.:
09/715349
Inventors:
Kyle S. Lebouitz - Pittsburgh PA
Albert P. Pisano - Danville CA
Assignee:
The Regents of the University of California - Oakland CA
International Classification:
B29C 3338
US Classification:
264221, 264220, 2643281
Abstract:
A method of forming an injection molded epidermal abrasion device includes depositing mold material on an epidermal abrasion device. The epidermal abrasion device is separated from the mold material to yield a mold. An epidermal abrasion device is then formed within the mold. The epidermal abrasion device may include a matrix of isotropically etched structures having isotropically etched sidewalls positioned between wide bases and narrow tips, each isotropically etched structure having a vertical height of at least 20 m. The matrix of isotropically etched structures may define a matrix of pyramids.

Thermal Isolation Using Vertical Structures

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US Patent:
6653239, Nov 25, 2003
Filed:
Oct 30, 2001
Appl. No.:
09/682894
Inventors:
Kyle Lebouitz - Pittsburgh PA
Assignee:
Xactix, Inc. - Pittsburgh PA
International Classification:
H01L 21306
US Classification:
438702, 438455, 216 2
Abstract:
This invention relates to the construction of microfabricated devices and, in particular, to types of microfabricated devices requiring thermal isolation from the substrates upon which they are built. This invention discloses vertical thermal isolators and methods of fabricating the vertical thermal isolators. Vertical thermal isolators offer an advantage over thermal isolators of the prior art, which were substantially horizontal in nature, in that less wafer real estate is required for the use of the vertical thermal isolators, thereby allowing a greater density per unit area of the microfabricated devices.

Apparatus For Etching Semiconductor Samples And A Source For Providing A Gas By Sublimation Thereto

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US Patent:
6887337, May 3, 2005
Filed:
Apr 20, 2001
Appl. No.:
09/839763
Inventors:
Kyle S. Lebouitz - Pittsburgh PA, US
Michele Migliuolo - McMurray PA, US
Assignee:
XACTIX, Inc. - Pittsburgh PA
International Classification:
H05H001/00
H01L021/00
C23F001/00
US Classification:
1563451, 15634533, 15634529, 216 73, 216 79
Abstract:
An etching apparatus for etching semi combustion samples may include one or more variable volume expansion chambers, two or more fixed volume expansion chambers, or combinations thereof in fluid communication with an etching chamber and a source of etching gas, such as xenon difluoride. The apparatus may further include a source of a mixing gas. An etching apparatus may also include a source of etching gas, an etching chamber in fluid communication with the source of etching gas, a flow controller connected between the source of etching gas and the etching chamber, and a vacuum pump in fluid communication with the etching chamber. A source for providing a gas by sublimation from a solid material is also provided, including a vacuum tight container and a mesh mounted in the interior of the vacuum tight container, wherein the mesh is adapted to receive and restrain the solid material.

Method Of Making A Cutting Instrument Having Integrated Sensors

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US Patent:
6972199, Dec 6, 2005
Filed:
Apr 17, 2002
Appl. No.:
10/124082
Inventors:
Kyle S. Lebouitz - Pittsburgh PA, US
Michele Migliuolo - McMurray PA, US
Assignee:
Verimetra, Inc. - Pittsburgh PA
International Classification:
H01L021/00
H01L021/66
A61B017/32
US Classification:
438 5, 438 10, 438 11, 438 17, 438 18, 438 48, 438 50, 438 54, 606167
Abstract:
A cutting instrument including a metal blade has a recess formed therein and a semiconductor substrate affixed to the blade in the recess. The semiconductor substrate includes at least one sensor formed thereon. The sensor formed on the semiconductor substrate may comprise at least one or an array of a strain sensors, pressure sensors, nerve sensors, temperature sensors, density sensors, accelerometers, and gyroscopes. The cutting instrument may also further include a handle wherein the blade is affixed to the handle and the semiconductor substrate is electrically coupled to the handle. The handle may then be coupled, either physically or by wireless transmission, to a computer that is adapted to display information to a person using the cutting instrument based on signals generated by one or more of the sensors formed on the semiconductor substrate. The computer or handle may also be adapted to store data based on the signals generated by one or more of the sensors. A method of making said cutting instrument includes the steps of at least one sensor being formed on a semiconductor wafer and a layer of photoresist being applied on a top side of the semiconductor wafer according to a pattern that matches the defined shape of the semiconductor substrate.

Pulsed Etching Cooling

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US Patent:
7638435, Dec 29, 2009
Filed:
Aug 23, 2006
Appl. No.:
12/064370
Inventors:
Kyle S. Lebouitz - Pittsburgh PA, US
David L. Springer - Pittsburgh PA, US
Assignee:
Xactix, Inc. - Pittsburgh PA
International Classification:
H01L 21/302
US Classification:
438706, 438715, 216 58, 216 73
Abstract:
In an apparatus and method of vapor etching, a sample (S) to be etched is located in a main chamber () from which the atmosphere inside is evacuated. Etching gas is input into the main chamber () for a first period of time. Thereafter, the etching gas is evacuated from the main chamber () and cooling/purging gas is input into the main chamber for a second interval of time. Thereafter, the cooling/purging gas is evacuated from the main chamber (). Desirably, the steps of inputting the etching gas into the main chamber () for the first period of time, evacuating the etching gas from the main chamber, inputting the cooling/purging gas into the main chamber () for the second period of time, and evacuating the cooling/purging gas from the main chamber are repeated until samples have been etched to a desired extent.
Kyle Stanton Lebouitz from Bethlehem, PA, age ~54 Get Report