Inventors:
Carl L. Deppisch - Phoenix AZ
Sabina J. Houle - Phoenix AZ
Thomas J. Fitzgerald - Phoenix AZ
Kristopher E. Dayton - Phoenix AZ
Fay Hua - San Jose CA
Assignee:
Intel Corporation - Santa Clara CA
International Classification:
H01L 2310
Abstract:
An electronic assembly including a die, having an integrated circuit formed therein, a thermally conductive heat spreader, and indium located between the die and the heat spreader, is described. The heat spreader has a layer of nickel. A gold layer is formed on the nickel layer, and provides better wetting of indium than nickel. A better structural connection between the indium and the heat spreader is provided, especially during thermal cycling.