Koichi Keith Morita

7490652, Feb 17, 2009

Sep 27, 2005

11/235183

Shozo Minamitani - Hirakata, JP
Naoto Hosotani - Osaka, JP
Koichi Morita - Schaumburg IL, US
Syunji Onobori - Kyoto, JP
Kenichi Nishino - Osaka, JP

Panasonic Corporation - Osaka

B29C 65/48
B29C 65/54
B32B 37/06
B32B 37/10
B32B 39/00
H05K 13/04

156537, 156538, 156539, 29729, 29739, 29740

A heating and pressurizing apparatus (), to which a circuit board () with electronic components () pre-bonded thereto via bonding elements () is carried in, is provided. The heating and pressurizing apparatus post-bonds the electronic component to the circuit board by heating and pressurizing the electronic component by a contact member () having a heating device (). By executing the pre-bonding and the post-bonding of the electronic components to the circuit board independently of each other, the time required for the post-bonding can be reduced, compared with the conventional case, and the productivity of the whole mounting line can be improved.

7938929, May 10, 2011

Jan 8, 2009

12/350334

Shozo Minamitani - Hirakata, JP
Naoto Hosotani - Osaka, JP
Koichi Morita - Schaumburg IL, US
Syunji Onobori - Kyoto, JP
Kenichi Nishino - Osaka, JP

Panasonic Corporation - Osaka

B29C 65/02
B29C 65/18
B32B 37/06
B32B 37/10
C08J 5/12
H05K 3/30

156299, 1563071, 1563077, 1563082, 1563084, 29832, 29836, 29740

A heating and pressurizing apparatus (), to which a circuit board () with electronic components () pre-bonded thereto via bonding elements () is carried in, is provided. The heating and pressurizing apparatus post-bonds the electronic component to the circuit board by heating and pressurizing the electronic component by a contact member () having a heating device (). By executing the pre-bonding and the post-bonding of the electronic components to the circuit board independently of each other, the time required for the post-bonding can be reduced, compared with the conventional case, and the productivity of the whole mounting line can be improved.

20030121616, Jul 3, 2003

Feb 13, 2003

10/365515

Shozo Minamitani - Osaka, JP
Naoto Hosotani - Osaka, JP
Koichi Morita - Schaumburg IL, US
Syunji Onobori - Soraku-gun, JP
Kenichi Nishino - Osaka, JP

B32B031/00

156/556000, 156/566000

A beating and pressurizing apparatus (), to which a circuit board () with electronic components () pre-bonded thereto via bonding elements () is carried in, is provided. The heating and pressurizing apparatus post-bonds the electronic component to the circuit board by heating and pressurizing the electronic component by a contact member () having a heating device (). By executing the pre-bonding and the post-bonding of the electronic components to the circuit board independently of each other, the time required for the post-bonding can be reduced, compared with the conventional case, and the productivity of the whole mounting line can be improved.