Ki Hi Lee

20220310530, Sep 29, 2022

Mar 22, 2022

17/655801

- Irvine CA, US
Hoang Mong Nguyen - Fountain Valley CA, US
Matthew Sean Read - Foothill Ranch CA, US
Howard E. Chen - Anaheim CA, US
Ki Wook Lee - Irvine CA, US
Yi Liu - San Diego CA, US

H01L 23/552
H01L 23/31
H01L 25/065
H01L 23/498
H01L 21/56
H01L 21/48
H01L 25/00

A packaged semiconductor module comprises a substrate having a ground plane, an electronic device mounted on a surface of the substrate, a bond pad disposed on the surface of the substrate and electrically connected to the ground plane, a mold compound covering the electronic device, a conductive post disposed on a side of the electronic device, the conductive post extending from the bond pad and at least partially through the mold compound, and a conductive layer disposed on the mold compound and electrically coupled to the conductive post and to the ground plane, the conductive post, the conductive layer, and the ground plane together forming the integrated electromagnetic interference shield, the conductive post extending from the bond pad to the conductive layer in a direction perpendicular to a plane defined by the surface of the substrate.

20230115846, Apr 13, 2023

Oct 19, 2021

17/504911

- Irvine CA, US
Anthony James LoBianco - Irvine CA, US
Howard E. Chen - Anaheim CA, US
Ki Wook Lee - Irvine CA, US
Yi Liu - San Diego CA, US

H01L 23/498
H01L 21/56
H01L 21/48
H01L 23/31
H01L 25/10
H01L 25/00

An electronic package is provided. The electronic package comprises a substrate having a first side and a second side, the substrate configured to receive one or more electronic components; a first electronic component mounted to the first side of the substrate; a first mold structure extending over at least part of the first side of the substrate; a group of through-mold connections provided on the first side of the substrate, the through-mold connections substantially formed of non-reflowable electrically conductive material; the first mold structure substantially encapsulating the group of through-mold connections; the group of through-mold connections exposed through the first mold structure. An electronic device comprising such an electronic package is also provided. A method of manufacturing such an electronic package is also provided.

20210315109, Oct 7, 2021

Apr 14, 2021

17/230367

- Irvine CA, US
Ki Wook Lee - Irvine CA, US

H05K 3/46
H01Q 1/38
H05K 1/16

A method of making a printed circuit board structure including a closed cavity is provided. The method can include the steps of forming a cavity in a core structure of a core layer, laminating each of a top surface and a bottom surface of the core structure with an adhesive layer and a metal layer to prepare a laminate structure and cover the cavity to define a closed cavity. The method also includes forming vias through the laminate structure, and patterning the metal layers in the laminate structure.

20210315110, Oct 7, 2021

Apr 14, 2021

17/230584

- Irvine CA, US
Ki Wook Lee - Irvine CA, US

H05K 3/46
H01Q 1/38
H05K 1/16

A method of making a printed circuit board structure including a closed cavity is provided. The method can include the steps of forming a cavity in a core structure of a core layer, laminating each of a top surface and a bottom surface of the core structure with an adhesive layer and a metal layer to prepare a laminate structure and cover the cavity to define a closed cavity. The method also includes forming vias through the laminate structure, and patterning the metal layers in the laminate structure.

20210223925, Jul 22, 2021

Apr 5, 2021

17/222803

- Cupertino CA, US
Alan AN - Santa Clara CA, US
Alyssa C. RAMDYAL - Santa Clara CA, US
Andrew CHEN - Sunnyvale CA, US
Cheng-I LIN - Emeryville CA, US
Eric SHI - Cupertino CA, US
Kenneth H. MAHAN - San Jose CA, US
Ki Myung LEE - Cupertino CA, US
Kyle B. CRUZ - Campbell CA, US
Maxime CHEVRETON - Mountain View CA, US
Richard J. BLANCO - San Francisco CA, US
Sung Chang LEE - Saratoga CA, US
Walton FONG - San Jose CA, US
Wei Guang WU - Palo Alto CA, US
Xuefeng WANG - San Jose CA, US

G06F 3/0484
G06F 3/0482
G06F 3/0488
G06F 3/02
H04M 1/72454

The present disclosure generally relates to underwater user interfaces. In some embodiments, a method includes at an electronic device with a display and one or more input devices, receiving a first request to display a user interface for accessing a first function of the electronic device. In response to receiving the first request, and in accordance with a determination that the electronic device is under water, the method includes displaying a first user interface for accessing the first function. In response to receiving the first request, and in accordance with a determination that the electronic device is not under water, the method also includes displaying a second user interface for accessing the first function.

20210100122, Apr 1, 2021

Jan 31, 2020

16/778272

- Cupertino CA, US
SungChang LEE - San Jose CA, US
Alan AN - Sunnyvale CA, US
Richard BLANCO - San Francisco CA, US
Andrew CHEN - Sunnyvale CA, US
Maxime CHEVRETON - Mountain View CA, US
Kyle B. CRUZ - Campbell CA, US
Walton FONG - San Jose CA, US
Nigel J. FUNGE - Redwood City CA, US
Ki Myung LEE - Cupertino CA, US
Cheng-I LIN - Emeryville CA, US
Kenneth H. MAHAN - San Jose CA, US
Alyssa C. RAMDYAL - Waterdown, CA
Nikhil SHARMA - San Jose CA, US
Eric SHI - Cupertino CA, US
Wei Guang WU - Palo Alto CA, US

H05K 5/06
H05K 5/00
H04B 1/3888

An electronic device with a sealing layer is disclosed. The sealing layer may include several enhancements designed to improve the overall sealing performance. For instance, the sealing layer may include an adhesive material and several particles embedded in the adhesive material. The embedded particles may include liquid-activated particles that respond to liquid exposure. In some instances, the liquid-activated particles absorb the liquid. Additionally, the liquid-activated particles may expand and fill/cover areas previously occupied by the sealing layer or another structure of the electronic device. Further, the liquid-activated particles may adhere to one or more structures of the electronic device, thereby providing the sealing layer with sealing properties. As a result of the absorption/expansion/adhesion properties of the liquid-activated particles, the electronic device may maintain a specified ingress protection rating even subsequent to some form of breakdown of the sealing layer or damage to the electronic device.

20200395659, Dec 17, 2020

May 26, 2020

16/883631

- Woburn MA, US
Ki Wook Lee - Irvine CA, US

H01Q 1/38
H05K 3/46
H05K 3/42
H05K 1/11
H05K 1/02
H01Q 9/04
H01Q 1/24
H01Q 1/22
H01Q 1/36

A printed circuit board can include a substrate layer, a first metal layer disposed over the substrate layer, a core layer disposed over the first metal layer, and a second metal layer disposed over the core layer, where the core layer defines a closed cavity between the first and second metal layers. Optionally, the cavity is filled with air and operates as an antenna.

20200112609, Apr 9, 2020

Oct 8, 2019

16/596337

- McLean VA, US
Ki Hyun LEE - McLean VA, US
Tyler James ALSTON - Reston VA, US
Rohit Leena MADHU - Fairfax VA, US
Parisa GANDOMKAR YARANDI - Arlington VA, US

Booz Allen Hamilton Inc. - McLean VA

H04L 29/08
H04L 12/707

A method and system are disclosed for acquiring and processing data, the exemplary system includes: one or more intelligent devices connected in a dynamic ad hoc network as a network of edge devices which can optionally access a cloud storage, at least one intelligent device being configured with a software installation to selectively receive and execute analytics on data received; at least one of the intelligent devices being configured to identify data to be requested from at least one other edge device for enhancing analytics performed on the at least one intelligent device; and a switchboard for maintaining a current view of resources in the network, and functions for which each resource is tasked, the resources including the at least one intelligent device and those edge devices which can communicate with the at least one intelligent device on the network.