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Kevin F Cote

from Mesa, AZ
Age ~52
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Also known as:
Kevin Franc Cote, Kevin L Cote, Kevin S Cote, Kevin Cott
Phone and address:
2712 S Sawyer Cir, Mesa, AZ 85209
(480) 654-8355
Related to:
Heidi L Cote, 49Mildred M SalisburyDarlene S Ownbey, 74Adam Cote, 52Patrick M Shreve
Connected to:
Alec D Cote, 29Alejandro Cote, 41Allison M Cote, 56Alyson M Cote, 47Alyssa J Cote, 40Andrea C Cote, 70Andrea Cote, 37Ashleigh J Cote, 32Blaire Cote, 43Bobby J Cote, 47

Kevin Cote Phones & Addresses

  • 2712 S Sawyer Cir, Mesa, AZ 85209 (480) 654-8355
  • Apache Junction, AZ
  • Murrieta, CA
  • Simi Valley, CA
  • Richardson, TX
  • Grafton, OH
  • Elyria, OH
  • Gates Mills, OH
  • Lorain, OH

Work

Company: Phoenix logistics inc Address: 2202 E Magnolia St, Phoenix, AZ 85034 Phones: (602) 231-8616 Position: Professional engineer Industries: Electronic Components

Resumes

Resumes

Kevin Cote Photo 1

Marketing Manager - Arizona Public Service

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Location:
2035 north Steele Cir, Mesa, AZ 85201
Industry:
Marketing And Advertising
Work:
Arizona Public Service (Aps)
Marketing Manager - Arizona Public Service
State Farm Insurance
Manager, Employment Branding and Selection Strategy
State Farm Insurance Apr 2013 - Jun 2015
Digital Customer Experience and Insights Manager
State Farm Feb 2007 - Feb 2013
Marketing Strategy Manager
State Farm Jul 2004 - Jan 2007
Product Marketing Manager - P and C Insurance
Education:
Arizona State University - W. P. Carey School of Business 2013 - 2014
Master of Business Administration, Masters Arizona State University - W. P. Carey School of Business 2000 - 2002
Master of Business Administration, Masters, Marketing Bentley University 1993 - 1996
Bachelors, Bachelor of Science, Business Administration, Management, Business Administration and Management Arizona State University
Skills:
Marketing Management
Marketing Budget Management
Marketing Strategy
Marketing Research
Customer Insight
Corporate Branding
Brand Positioning Strategies
Brand Implementation
Customer Segmentation Strategy
Development of Strategic Marketing Plans
Customer Research
Vendor Management
Product Marketing
Marketing Communications
Direct Marketing
Sales Process Development
Customer Retention
Customer Acquisition
Digital Research
Digital Marketing Experience
Certifications:
Clu
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Kevin Cote

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Kevin Cote

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Kevin Cote

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Kevin Cote

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Kevin Cote

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Location:
United States

Business Records

Name / Title
Company / Classification
Phones & Addresses
Mr. Kevin Cote
Owner
Paysagement KC Landscaping
KC Landscaping
Landscape Contractors
825 Principale Street. P.O. 267, Casselman, ON K0A 1M0
(613) 764-7442, (613) 764-5729
Kevin Cote
Professional Engineer
Phoenix Logistics Inc
Electronic Components
2202 E Magnolia St, Phoenix, AZ 85034
Kevin Cote
Owner
Paysagement KC Landscaping
Landscape Contractors
(613) 764-7442, (613) 764-5729
Kevin Cote
TIMELESS EXTERIORS LLP
Kevin Cote
Professional Engineer
Phoenix Logistics Inc
Electronic Components
2202 E Magnolia St, Phoenix, AZ 85034

Publications

Us Patents

Structure And Method For Fabrication Of A Leadless Multi-Die Carrier

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US Patent:
6867493, Mar 15, 2005
Filed:
Jun 28, 2001
Appl. No.:
09/894728
Inventors:
Hassan S. Hashemi - Laguna Niguel CA, US
Kevin J. Cote - Phoenix AZ, US
Assignee:
Skyworks Solutions, Inc. - Irvine CA
International Classification:
H01L023/34
US Classification:
257717
Abstract:
One disclosed embodiment comprises a substrate having a top surface for receiving two or more semiconductor dies. The disclosed embodiment further comprises a printed circuit board attached to a bottom surface of the substrate and at least one via in the substrate. The at least one via provides an electrical connection between a signal bond pad of a first semiconductor die and the printed circuit board. The at least one via provides an electrical connection between a first substrate bond pad and the printed circuit board. The first substrate bond pad is connected to the first signal bond pad of the first semiconductor die by a first signal bonding wire. The at least one via also provides an electrical connection between the first signal bond pad of the first semiconductor die and a first land that is electrically connected to the printed circuit board.

Apparatus And Method Of Packaging Two Dimensional Photonic Array Devices

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US Patent:
6960031, Nov 1, 2005
Filed:
Dec 19, 2002
Appl. No.:
10/325259
Inventors:
Jonathan McFarland - Phoenix AZ, US
Suresh Golwalkar - Phoenix AZ, US
Sampath K. V. Karikalan - Phoenix AZ, US
Kevin J. Cote - Chandler AZ, US
Wu Chun Chou - Chandler AZ, US
Assignee:
Primarion, Inc. - Phoenix AZ
International Classification:
G02B006/38
G02B006/36
US Classification:
385 89, 385 55
Abstract:
An optical coupler for forming an optical connection between one or more two dimensional photonic array devices and an optical fiber and for forming an electrical connection between the two dimensional photonic array devices and a substrate, a system including the optical coupler and materials, and methods of forming the optical coupler and system are disclosed. The optical coupler includes a light transmission medium and electrical connectors, which are at least partially encapsulated. In addition, the device includes alignment guides configured to receive guide pins from a fiber optic connector, such that when the fiber optic connector is attached to the optical coupler, fibers of the ribbon align with the two dimensional photonic array device(s) via the light transmission medium.

Structure And Method For Fabrication Of A Leadless Chip Carrier

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US Patent:
6960824, Nov 1, 2005
Filed:
Jun 11, 2001
Appl. No.:
09/878815
Inventors:
Hassan S. Hashemi - Laguna Niguel CA, US
Kevin Cote - Phoenix AZ, US
Assignee:
Skyworks Solutions, Inc. - Irvine CA
International Classification:
H01L023/04
US Classification:
257698, 257774, 361783
Abstract:
Structure and method for fabrication of a leadless chip carrier have been disclosed. A disclosed embodiment comprises a substrate having a top surface for receiving a semiconductor die. The disclosed embodiment also comprises a printed circuit board attached to a bottom surface of the substrate. The disclosed embodiment further comprises at least one via in the substrate, which provides an electrical connection between a signal bond pad of the semiconductor die and the printed circuit board. The at least one via also electrically connects a substrate bond pad and the printed circuit board. The substrate bond pad is further connected to the signal bond pad of the semiconductor die by a signal bonding wire. The at least one via further provides an electrical connection between the signal bond pad of the semiconductor die and a land that is electrically connected to the printed circuit board.

Method For Fabricating A Leadless Chip Carrier

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US Patent:
7247516, Jul 24, 2007
Filed:
Oct 21, 2005
Appl. No.:
11/256511
Inventors:
Hassan S. Hashemi - Laguna Nigel CA, US
Kevin Cote - Phoenix AZ, US
Assignee:
Skyworks Solutions, Inc. - Woburn MA
International Classification:
H01L 21/44
H01L 21/50
US Classification:
438106, 257E23067, 257E21499, 438122
Abstract:
Structure and method for fabrication of a leadless chip carrier have been disclosed. A disclosed embodiment comprises a substrate having a top surface for receiving a semiconductor die. The disclosed embodiment also comprises a printed circuit board attached to a bottom surface of the substrate. The disclosed embodiment further comprises at least one via in the substrate, which provides an electrical connection between a signal bond pad of the semiconductor die and the printed circuit board. The at least one via also electrically connects a substrate bond pad and the printed circuit board. The substrate bond pad is further connected to the signal bond pad of the semiconductor die by a signal bonding wire. The at least one via further provides an electrical connection between the signal bond pad of the semiconductor die and a land that is electrically connected to the printed circuit board.

Multi-Drive Printed Product Processing Device With Verified Feedback Control

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US Patent:
8640617, Feb 4, 2014
Filed:
Oct 7, 2009
Appl. No.:
12/587443
Inventors:
Kevin Lauren Cote - Allen TX, US
Lothar John Schroeder - Beavercreek OH, US
Assignee:
Goss International Americas, Inc. - Durham NH
International Classification:
B41F 1/34
B41L 5/16
B41L 15/14
B41L 49/00
G05B 19/29
H02P 7/00
US Classification:
101480, 318611
Abstract:
A multi-drive printed product processing device is provided that includes a processing component and a motor driving the processing component. A motor control controls the motor. An encoder measures a position of the motor and sends an encoder feedback signal indicating the position. The motor control receives the encoder feedback signal. An encoder feedback signal verification circuit verifies the integrity of the feedback signal.

Method And Apparatus For Compacting Product

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US Patent:
20110154783, Jun 30, 2011
Filed:
Oct 21, 2010
Appl. No.:
12/909242
Inventors:
Patrick J. BIERSCHENK - Dallas TX, US
Frank M. BRENKUS - McKinney TX, US
Kevin COTE - Allen TX, US
Amelinda MELANSON - Dallas TX, US
Jerry M. REAVES - Midlothian TX, US
Assignee:
FRITO-LAY NORTH AMERICA, INC. - Plano TX
International Classification:
B65B 63/02
B65B 1/20
US Classification:
53436, 53523
Abstract:
A method for compacting a slug of product and apparatus for accomplishing the same. The invention describes collecting weighed product in an intermediate settling device to form a compact slug of product. The device can comprise a single settling chamber or can comprise multiple settling chambers which are axially rotatable. The slug can be compacted by jostling and/or vibrating the settling device. Thereafter, the product is discharged to a packaging apparatus. Because the product in the final package is denser, a smaller package can be utilized reducing manufacturing and shipping costs.

Robotic Row Collector

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US Patent:
20120006651, Jan 12, 2012
Filed:
Jul 12, 2010
Appl. No.:
12/834350
Inventors:
Kevin Cote - Allen TX, US
Assignee:
FRITO-LAY NORTH AMERICA, INC. - Plano TX
International Classification:
B65G 47/46
US Classification:
1984686
Abstract:
A method for collecting and orienting packages and a system for accomplishing the same. The invention describes a method for collecting and orienting packages on a system. The system comprises at least one arm coupled to at least one end effector. The end effector, in a pickup orientation, collects packages from an upstream conveyor. The arm then manipulates the end effector into a delivery position whereby the packages are deposited into a packaging chamber. The end effector can change the orientation of the packages so that they can be packaged in a container.

Observation-Enhanced Virtual Master System For A Printing Press

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US Patent:
20120055358, Mar 8, 2012
Filed:
Jul 20, 2011
Appl. No.:
13/186929
Inventors:
Kevin Lauren Cote - Allen TX, US
Lothar John Schroeder - West Chester OH, US
Assignee:
GOSS INTERNATIONAL AMERICAS, INC. - Durham NH
International Classification:
B41F 1/54
US Classification:
101226, 101484
Abstract:
A web printing press is provided. The web printing press includes at least one printing unit printing images on a web, at least one press component in direct contact with the web, a cutting device for cutting the web into sheets and a controller transmitting a virtual master signal to the at least one printing unit and at least one press component. A sensor senses the at least one press component or directly senses the web downstream of the at least one print unit and generates a sensor signal. A processor receives the sensor signal and the virtual master signal, the processor transmits a modified virtual master signal to the cutting device as a function of the received sensor signal. Methods are also provided.
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Kevin F Cote from Mesa, AZ, age ~52 Get Report