Inventors:
Michael Derek Tisack - Ann Arbor MI
Kenneth Andrew Winowiecki - Waterford MI
Assignee:
Ford Global Technologies, Inc. - Dearborn MI
International Classification:
B29C 4406
B29C 4412
B29C 4414
Abstract:
A method of manufacturing a panel having a foam interlayer. A flexible cover is placed adjacent a first mold in an open tool. A rigid substrate is placed adjacent a second mold, or alternately, is place atop the flexible cover in the first mold, of the opened tool. The first and/or second molds are electrically isolated from one another and from the associated manufacturing equipment. A vacuum draws the cover against the first mold and retains the cover in position during the manufacturing operation. The tool is moved to a closed position and the cover is positioned juxtaposed the substrate. The cover and substrate are positioned a distance apart thus creating a space therebetween. A vacuum is created in the space and a radio frequency (RF) electric field is applied between the first and second molds. The RF electric field causes a plasma to be created within the space.