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Keith A Snyder

from Rome, NY
Age ~59
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Also known as:
Keith Allen Snyder, Kieth A Snyder, Keith Synder
Related to:
Mike H Snyder, 40Lois Snyder, 96Theodore Snyder, 69Patricia Youngs, 66Doreen ZalepeskiDoris Snyder, 86
Connected to:
Adelaide A Snyder, 98Aerion Snyder, 33Alex J Snyder, 47Alexandra Snyder, 41Alexis L Snyder, 30Alfred M Snyder, 83Alyse R Snyder, 34Amos W Snyder, 39Annie M Snyder, 46Arthur M Snyder, 81

Keith Snyder Phones & Addresses

  • Rome, NY
  • Utica, NY
  • Chadwicks, NY
  • 5795 Judd Rd, Oriskany, NY 13424 (315) 337-3754
  • Vestal, NY
  • Los Angeles, CA
  • Taberg, NY
  • Oneida, NY

Work

Company: Chanantry's - Utica, NY Sep 2012 Position: Meat counter clerk

Education

School / High School: Thomas R. Proctor Senior High School- Utica, NY 2011 Specialities: High School Diploma in General Studies

Resumes

Resumes

Keith Snyder Photo 1

Chaplain At Barga Maximum Correctional Facility

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Position:
Chaplain at Baraga Maximum Correctional Facility
Location:
Houghton, Michigan
Industry:
Government Administration
Work:
Baraga Maximum Correctional Facility since Nov 2000
Chaplain
Interests:
Bible, music, forex, computers, working on house, vacations, Hawaii
Keith Snyder Photo 2

Business Development Manager At Heinz

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Position:
Business Development Manager at Heinz
Location:
Milford, Delaware
Industry:
Consumer Goods
Work:
Heinz
Business Development Manager
L'Oréal Apr 2006 - Jan 2008
National Account Manager
Playtex Products Mar 2000 - Mar 2006
Senior National Account Manager
The Pillsbury Company Oct 1992 - Feb 2000
Customer Account Manager
Nestle May 1989 - Sep 1992
Account Manager
Education:
La Salle University 1996 - 1998
MBA, Management Kansas State University 1987 - 1989
Bachelor's degree, Marketing
Keith Snyder Photo 3

Keith Snyder

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Location:
United States
Keith Snyder Photo 4

Keith Snyder

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Location:
United States
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Keith Snyder

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Location:
United States
Keith Snyder Photo 6

Keith Snyder

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Location:
United States
Keith Snyder Photo 7

Keith Snyder

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Location:
United States
Keith Snyder Photo 8

Keith Snyder Utica, NY

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Work:
Chanantry's
Utica, NY
Sep 2012 to Jul 2013
Meat Counter Clerk
Lenard Young
Rome, NY
May 2009 to Sep 2012
Grounds Keeper
Education:
Thomas R. Proctor Senior High School
Utica, NY
2011 to 2012
High School Diploma in General Studies

Business Records

Name / Title
Company / Classification
Phones & Addresses
Keith Snyder
Vice President
New York Central Mutual Fire Insurance Company
Fire, Marine, and Casualty Insurance
1899 Central Plaza East, Edmeston, NY 13335
Mr. Keith Snyder
President
Snyder Party Rentals
Snyder Event Services
Party Supplies-Renting. Rental Service Stores & Yards. Party Planning
3875 Meeting St., Suite #A, North Charleston, SC 29405
(843) 766-3366, (843) 766-0460
Keith Snyder
Vice President
New York Central Mutual Fire Insurance Company
Fire, Marine, and Casualty Insurance
1899 Central Plaza East, Edmeston, NY 13335
Keith A Snyder
NEW LIFE CHAPEL CHURCH OF GOD INC
Keith J. Snyder
LEVEL LINE EXCAVATING, LLC
Keith L. Snyder
OUTBACK PIZZERIA, LTD

Publications

Amazon

The Night Men (Jason Keltner Mysteries)

The Night Men (Jason Keltner Mysteries)

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The situation has to be desperate to cause a California guy to ride his bike across the Brooklyn bridge at midnight, in a snowstorm. But that's exactly what Jason Keltner was doing because of the phone call he'd received, as chilling as the wind he was riding into, as frightening as memories that ha...
Author

Keith Snyder

Binding

Hardcover

Pages

300

Publisher

Walker & Company

ISBN #

0802733700

EAN Code

9780802733702

ISBN #

10

Night Ride

Night Ride

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"You come from where you come from. By the time you see it, it’s long since stained you all the way through."Robert's a single father trying to raise his kid.Bobby's six.Robert Senior is just back from a long time away.Three generations and their bikes in one small New York City apartment forces eac...
Author

Keith Snyder

Binding

Kindle Edition

Pages

38

ISBN #

9

Cupid & Psyche - A Screen Musical

CUPID & PSYCHE - A Screen Musical

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A FEATURE-LENGTH MUSICAL SCREENPLAY.Armed thugs, biker fistfights, and midnight flights to Paris are all just part of Carolyn's journey toward her dream: becoming an opera diva!By the author of the Jason Keltner series of crime novels and director of the award-winning short films CREDO and I LOVE YO...
Author

Keith Snyder

Binding

Kindle Edition

Pages

168

Publisher

Keith Snyder

ISBN #

8

Into Stone - A Short Story

Into Stone - A Short Story

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INTO STONE - A SHORT STORY(Originally published in Demolition Magazine.)Aiata Mabee is a transportation crew chief in NYC, so she's the one who has to go look at the damage when an armored car crashes into an expressway pillar. But what's opened up isn't just an unexpected cavity in the structure; i...
Author

Keith Snyder

Binding

Kindle Edition

Pages

9

Publisher

Keith Snyder

ISBN #

7

Deadly By The Dozen

DEADLY BY THE DOZEN

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Twelve Short Stories of Murder and Mayhem written by an eclectic group of writers. Ranging from tough and gritty to light and comic and every landscape in between, DEADLY BY THE DOZEN promises to entertain, chill, thrill and inspire. Edited by award-winning thriller author Mark Terry. The collection...
Author

Mark Terry, Natasha Fondren, Lise McClendon, Jude Hardin, Robert Weibezahl, Betsy Dornbusch, Erica Orloff, Simon Wood, Keith Snyder, Merry Monteleone

Binding

Kindle Edition

Pages

189

Publisher

OROX Books

ISBN #

4

Ride 2: More Short Fiction About Bicycles

Ride 2: More Short Fiction about Bicycles

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The second collection in the RIDE series of short fiction about bicycles, with contributions by SJ Rozan, Kent Peterson, Barb Goffman, Keith Snyder, Eric Neuenfeldt, Nigel Greene, Jan Maher, Jon Billman, and KI Hope. - - - "this stuff is brilliant ... if you, like me, have been previously bitten by ...
Author

S. J. Rozan, Kent Peterson

Binding

Paperback

Pages

146

Publisher

Typeflow

ISBN #

0983551553

EAN Code

9780983551553

ISBN #

2

Ride: Short Fiction About Bicycles

Ride: Short Fiction About Bicycles

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In this collection of short stories about bicycles, a grocery store worker finds more than he bargained for when he wangles his way into a gated community with a perfect hill for climbing...an ancient Constantinoplean invents a two-wheeled contraption to impress a girl...a bicycle reflects on its li...
Author

Keith Snyder, Paul Guyot, Simon Woods, Stephen D. Rogers, Teresa Peipins, Christopher Ryan, Kent Peterson, Barbara Jaye Wilson, David A.V. Elver

Binding

Paperback

Pages

200

Publisher

Typeflow

ISBN #

0983551529

EAN Code

9780983551522

ISBN #

1

Trouble Comes Back

Trouble Comes Back

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This is the third in a series about three mystery-solving friends in Southern California. Trouble Comes Back pits sleuth Jason Keltner and his buddies Robert and Martin against a drug dealer; a rocker named Uncle Trouble, and a little girl.
Author

Keith Snyder

Binding

Hardcover

Pages

256

Publisher

Walker & Company

ISBN #

0802733387

EAN Code

9780802733382

ISBN #

3

Isbn (Books And Publications)

Coffin's Got the Dead Guy on the Inside

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Author

Keith Snyder

ISBN #

0440235413

Coffin's Got the Dead Guy on the Inside

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Author

Keith Snyder

ISBN #

0802733204

Trouble Comes Back

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Author

Keith Snyder

ISBN #

0802733387

The Night Men: A Jason Keltner Mystery

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Author

Keith Snyder

ISBN #

0802733700

Veterans Benefits: The Complete Guide

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Author

Keith D. Snyder

ISBN #

0062731467

VVA Service Representatives Manual: Guide to Veterans Claims

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Author

Keith D. Snyder

ISBN #

0915465000

Us Patents

Process For Making Multilayer Integrated Circuit Substrate

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US Patent:
43861164, May 31, 1983
Filed:
Dec 24, 1981
Appl. No.:
6/334297
Inventors:
Krishna K. Nair - Binghamton NY
Keith A. Snyder - Vestal NY
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
B05D 512
US Classification:
427 99
Abstract:
A process is provided for making a multilayer integrated circuit substrate having improved via connection. A first layer M1 of chrome-copper-chrome is applied to a ceramic substrate and the circuits etched. A polyimide layer is then applied, cured, and developed and etched to provide via holes in the polyimide down to the M1 circuitry. The top chrome is now etched to expose the M1 copper in the via holes. A second layer M2 of copper-chrome is evaporated onto the polyimide at a high substrate temperature to provide a copper interface at the base of the vias having no visable grain boundaries and a low resistance. M2 circuitization is then carried out.

Tape Automated Bonding Package

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US Patent:
48294055, May 9, 1989
Filed:
Mar 14, 1988
Appl. No.:
7/168034
Inventors:
Keith A. Snyder - Vestal NY
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
H05K 0114
US Classification:
361413
Abstract:
The disclosure describes a new and improved Tape Automated Bonding package which admits of certain advantages that are not available with the packages as used in the past, and it overcomes some limitations with the previous packages which permits a significant step forward in realizing these advantages. Briefly, the disclosure describes a division of the dielectric support used to package integrated circuit chips in order to separate the power conductors and the signal conductors into different parts of the support. The conductors formed on at least one of these parts, preferably the part used to connect input/output signals to and from a chip, are arranged in radially extending rows to achieve more than twice the number of such connections.

Providing Circuit Lines On A Substrate

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US Patent:
46908331, Sep 1, 1987
Filed:
Mar 28, 1986
Appl. No.:
6/845316
Inventors:
William A. Donson - Endicott NY
James V. Ellerson - Endicott NY
Richard B. Hammer - Apalachin NY
William Lafer - Chenango Bridge NY
Keith A. Snyder - Vestal NY
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
B05D 512
US Classification:
427 96
Abstract:
A process for providing circuit lines on a substrate having a non-planar surface is provided. The process includes applying a layer of photoresist material to the substrate, selectively screen printing on non-planar areas of the substrate a screen-printable coating, photoprocessing the layer of photoresist material, and providing electrical conductive pattern on the substrate.

Circuit Board

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US Patent:
49279831, May 22, 1990
Filed:
Dec 16, 1988
Appl. No.:
7/286593
Inventors:
Alan L. Jones - Endwell NY
Keith A. Snyder - Vestal NY
Paul E. Winkler - Vestal NY
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
H05K 100
US Classification:
174258
Abstract:
An improved circuit board structure and method of forming the same are provided. The circuit board includes an insulating core and has plated through holes connecting the circuitry on both sides and intermediate layers of the core. A permanent dielectric material is applied on at least one surface of the board covering the circuitry and plated through holes. Vias are formed through the dielectric material and signal lines are formed on the top of the dielectric material connected to the circuitry onto the board through the vias. Additional layers of dielectric material with additional wiring and vias can also be formed for multi-level wiring.

Coaxial Cable Connector Assembly

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US Patent:
50469665, Sep 10, 1991
Filed:
Oct 5, 1990
Appl. No.:
7/593843
Inventors:
Keith A. Snyder - Vestal NY
Paul E. Winkler - Vestal NY
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
H01R 1718
US Classification:
439579
Abstract:
A connector assembly for connecting several coaxial cables to a circuit board such that the center conductors of each cable are inserted within a conductive hole which forms part of the board structure. The assembly includes a common housing which may be electrically conductive or insulative and a spring contact member which serves as part of the grounding means to effectively ground the shield members of the coaxial cables to the board's ground. The spring contacts may be in the form of resilient springs which extend from the assembly or of compressible members coupled to a conductive layer which in turn is connected to the shield members. An apparatus for positioning more than one such assembly on a common board structure is also shown and described, as is an assembly designed for positioning the cables therein in a substantially compact orientation.

Substrate For Magnetic Domain Device

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US Patent:
43778542, Mar 22, 1983
Filed:
Jul 18, 1980
Appl. No.:
6/170303
Inventors:
Roland J. Braun - Vestal NY
Gary R. Carden - Endwell NY
Keith A. Snyder - Vestal NY
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
G11C 504
G11C 1908
US Classification:
365 2
Abstract:
In a field-accessed magnetic domain device package assembly, the magnetic domain device carrier or support, the circuit line or conductor carrier, and the magnetic bias field source are integrally and coactively provided by a common substrate member. The member is a planar permanent magnetic insulator ceramic and carries a bonded conductor or wiring pattern. The input/output (I/O) terminals of the domain device, also referred to in the art as a chip, are selectively bonded to the conductors of the pattern thereby providing mechanical support of the chip directly to the substrate in a superimposed relationship, input/output electrical connection to the chip, and mounting of the chip in close proximity to the bias field source, the flux of which passes through the superimposed mounted chips to a high permeability member at least part of which is disposed on the opposite side of the chip.

Method Of Forming A Hybrid Printed Circuit Board

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US Patent:
50975935, Mar 24, 1992
Filed:
May 18, 1990
Appl. No.:
7/525971
Inventors:
Alan L. Jones - Endwell NY
Keith A. Snyder - Vestal NY
Paul E. Winkler - Vestal NY
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
H01K 310
US Classification:
29852
Abstract:
An improved circuit board structure and method of forming the same are provided. The circuit board includes an insulating core and has plated through holes connecting the circuitry on both sides and intermediate layers of the core. A permanent dielectric material is applied on at least one surface of the board covering the circuitry and plated through holes. Vias are formed through the dielectric material and signal lines are formed on the top of the dielectric material connected to the circuitry onto the board through the vias. Additional layers of dielectric material with additional wiring and vias can also be formed for multi-level wiring.

High Density Circuit Board And Method Of Making Same

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US Patent:
51911744, Mar 2, 1993
Filed:
Aug 1, 1990
Appl. No.:
7/561401
Inventors:
Chi S. Chang - Endicott NY
Joseph G. Hoffarth - Binghamton NY
Voya R. Markovich - Endwell NY
Keith A. Snyder - Vestal NY
John P. Wiley - Vestal NY
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
H05K 100
US Classification:
174266
Abstract:
A multilayered circuit board assembly which includes a plurality of layered subassemblies each having electrically conducting wiring and at least one through hole therein. A first of these subassemblies possesses a greater wiring dnesity than the others while a second subassembly possesses a lesser resistance (and wiring density) than the others. In one example, several (e. g. at least four) such layered subassemblies may be included in the overall assembly such that those layers located along one side of the board may possess substantially greater wiring densities than the layers on the other side of the board while those layers on said other side will in turn possess lesser resistance (and greater current capacities). There are also described at least three methods for making the above multilayered circuit board assembly. Such a structure may be utilized in supercomputer applications.
Control profile
Keith A Snyder from Rome, NY, age ~59 Get Report