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Kedar G Shah

from North Wales, PA
Age ~50
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Related to:
Brian Jonathan Lipman, 68David Bianco, 52Shah Hirsh, 32Watson Kenneth, 96Joan Bianco, 86Mehul Shah, 51
Connected to:
Aadil Shah, 29Aalay D Shah, 33Aamer B Shah, 45Aashiv A Shah, 42Aasim Shah, 56Abdul R Shah, 59Abha H Shah, 53Abida Shah, 67Abu M Shah, 60Aftab H Shah, 67

Kedar Shah Phones & Addresses

  • North Wales, PA
  • San Francisco, CA
  • Blue Bell, PA
  • San Mateo, CA

Resumes

Resumes

Kedar Shah Photo 1

Product Management And Marketing

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Location:
San Francisco Bay Area
Industry:
Computer Software
Kedar Shah Photo 2

Enterprise Sales And Cloud Strategy

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Location:
95 Hartford Ave, San Carlos, CA 94070
Industry:
Computer Software
Work:
Location Labs 2010 - 2011
Product Management and Marketing
MotherApp 2010 - 2010
Solutions Architect and Business Development
Microsoft 2006 - 2009
Technical Sales and Business Development
NuTech Solutions Jun 2005 - Aug 2005
Intern
Silicon Storage Technologies (SST) Jun 2004 - Aug 2004
Product Engineer
Education:
Menlo School
University of California, Berkeley
BS, Electrical Engineering & Computer Sciences
Skills:
Cloud Computing
Start Ups
Mobile Applications
Strategy
Entrepreneurship
Business Strategy
Business Intelligence
Crm
Business Development
Interests:
Innovation
Languages
Emerging Markets
Investing
Technology
Art
Music
Sports
Globalization
Movies
History
Languages:
English
Kedar Shah Photo 3

Engineering Lead, Smart Intraocular Lenses

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Location:
3730 24Th St, San Francisco, CA 94114
Industry:
Medical Devices
Work:
Verily Life Sciences
Engineering Lead, Smart Intraocular Lenses
Verily Life Sciences 2016 - 2018
Hardware Engineer
Lawrence Livermore National Laboratory 2009 - 2015
Principal Investigator - Biomedical Microsystems
Microchips Biotech 2008 - 2008
Microfabrication Engineer
Education:
University of California, Berkeley 2006 - 2008
Master of Science, Masters, Mechanical Engineering Penn State University 2002 - 2006
Bachelors, Bachelor of Science, Engineering
Skills:
Engineering Design
Biomems
Electronics Packaging
Biomedical Engineering
Sensors
Mems
Electronics
Life Sciences
Medical Devices
Engineering
Software
Semiconductor Process Technology
Semiconductor Failure
Microfabrication
Project Management
Semiconductor Process
R&D
Semiconductor Failure Analysis
Hardware
Nanotechnology
Languages:
English
Hindi
Gujarati
Kedar Shah Photo 4

Kedar Shah

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Kedar Shah Photo 5

Kedar Shah

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Kedar Shah Photo 6

Kedar Shah

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Location:
United States
Kedar Shah Photo 7

Kedar Shah

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Publications

Us Patents

Method Of Fabricating High-Density Hermetic Electrical Feedthroughs

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US Patent:
20140020951, Jan 23, 2014
Filed:
Apr 18, 2012
Appl. No.:
14/009332
Inventors:
Kedar G. Shah - San Francisco CA, US
Satinderpall S. Pannu - Pleasanton CA, US
Terri L. Delima - Livermore CA, US
International Classification:
H01B 13/06
H02G 3/04
US Classification:
174667, 264104, 264400, 216 19, 264485
Abstract:
A method of fabricating electrical feedthroughs selectively removes substrate material from a first side of an electrically conductive substrate (e.g. a bio-compatible metal) to form an array :of electrically conductive posts in a substrate cavity. An electrically insulating material (e.g. a bio-compatible sealing glass) is then flowed to fill the substrate cavity and surround each post, and solidified. The solidified insulating material is then exposed from an opposite second side of the substrate so that each post is electrically isolated from each other as well as the bulk substrate. In this manner a hermetic electrically conductive feedthrough construction is formed having an array of electrical feedthroughs extending between the first and second sides of the substrate from which it was formed.

Location Based Value Dissemination System And Method

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US Patent:
20120215617, Aug 23, 2012
Filed:
Feb 22, 2011
Appl. No.:
13/031613
Inventors:
Kedar Shah - San Carlos CA, US
Scott Hotes - Berkeley CA, US
Tasos Roumeliotis - Orinda CA, US
Assignee:
Wavemarket, Inc. - Emeryville CA
International Classification:
G06Q 30/00
US Classification:
705 1435, 705 11, 705 141
Abstract:
A computer-implemented value dissemination method is provided. The method includes defining a physical location and detecting entrance of a mobile device associated with a user to the physical location. A value indication is generated in response to detecting the entrance to the physical location, and the value indication is rendered accessible to the user. A system for disseminating value is further provided.

Branched Proximal Connectors For High Density Neural Interfaces

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US Patent:
20220323773, Oct 13, 2022
Filed:
Jun 23, 2022
Appl. No.:
17/847457
Inventors:
- South San Francisco CA, US
Kedar Shah - San Francisco CA, US
Assignee:
Verily Life Sciences LLC - South San Francisco CA
International Classification:
A61N 1/375
A61N 1/05
H05K 1/11
H05K 1/09
H01L 23/00
Abstract:
The present disclosure relates to branched proximal connectors for high density neural interfaces and methods of microfabricating the branched proximal connectors. Particularly, aspects of the present disclosure are directed to a branched connector that includes a main body having a base portion of a supporting structure and a plurality of conductive traces formed on the base portion, and a plurality of plugs extending from the main body. Each plug of the plurality of plugs include an end portion of the supporting structure comprised of the one or more layers of dielectric material, and a subset of conductive traces from the plurality of conductive traces. Each trace from the subset of conductive traces terminates at a bond pad exposed on a surface of the end portion of the supporting structure.

Implantable Connector Including At Least One Electrical Component

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US Patent:
20200220285, Jul 9, 2020
Filed:
Mar 19, 2020
Appl. No.:
16/824013
Inventors:
- South San Francisco CA, US
Kedar Shah - San Francisco CA, US
Assignee:
Verily Life Sciences LLC - South San Francisco CA
International Classification:
H01R 12/52
H01R 13/24
A61N 1/05
A61B 17/34
A61B 5/00
H05K 5/00
H05K 3/36
H05K 3/40
H05K 1/14
H01R 43/20
H01R 13/52
H05K 1/02
H01R 12/71
H01R 12/70
A61B 5/145
A61N 1/375
Abstract:
An example implantable connector for connecting an electronics package and a neural interface is made by way of a compressible contacts (e.g., a spring) that physical contacts a corresponding exposed bond pad. The compressible contact is held in compression with the exposed bond pad using a mechanical coupler. The compressible contact is physically separated and electrically isolated from other contacts by way of a compressible gasket. The compressible gasket is also held in compression using the mechanical coupler.

Branched Proximal Connectors For High Density Neural Interfaces

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US Patent:
20200155857, May 21, 2020
Filed:
Oct 21, 2019
Appl. No.:
16/658596
Inventors:
- South San Francisco CA, US
Kedar Shah - San Francisco CA, US
Assignee:
Verily Life Sciences LLC - South San Francisco CA
International Classification:
A61N 1/375
A61N 1/05
H01L 23/00
H05K 1/11
H05K 1/09
Abstract:
The present disclosure relates to branched proximal connectors for high density neural interfaces and methods of microfabricating the branched proximal connectors. Particularly, aspects of the present disclosure are directed to a branched connector that includes a main body having a base portion of a supporting structure and a plurality of conductive traces formed on the base portion, and a plurality of plugs extending from the main body. Each plug of the plurality of plugs include an end portion of the supporting structure comprised of the one or more layers of dielectric material, and a subset of conductive traces from the plurality of conductive traces. Each trace from the subset of conductive traces terminates at a bond pad exposed on a surface of the end portion of the supporting structure.

Ophthalmic System Including Accommodating Intraocular Lens And Remote Component And Related Methods Of Use

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US Patent:
20200138565, May 7, 2020
Filed:
Oct 31, 2019
Appl. No.:
16/670921
Inventors:
- South San Francisco CA, US
Brooke Basinger - San Francisco CA, US
Patricia Johnson - San Carlos CA, US
Stein Kuiper - South San Francisco CA, US
Kedar Shah - San Francisco CA, US
Georges Goetz - Mountain View CA, US
Shishira Nagesh - San Francisco CA, US
Chelsea Gordon - San Mateo CA, US
International Classification:
A61F 2/16
Abstract:
Ophthalmic systems and methods of changing an optical power of an ophthalmic system are described. In an example, the ophthalmic system includes an accommodating intraocular device shaped to be implantable in an eye and an extraocular device separate from the accommodating intraocular device shaped to be removably mountable to a portion of the eye outside a bulb of the eye, such as an underlid portion of the eye. In an example, the method includes wirelessly transmitting power from a power source of an extraocular device removably mounted outside a bulb of an eye to an accommodating intraocular device implanted in the eye. In an example, the method includes sensing with an accommodation sensor biological accommodation signals of the eye; generating accommodation control signals representative of the biological accommodation signals; and driving an accommodation actuator disposed in the accommodating intraocular device based on the accommodation control signals to change an optical power of the ophthalmic system.

Rigid Stiffener-Reinforced Flexible Neural Probes, And Methods Of Fabrication Using Wicking Channel-Distributed Adhesives And Tissue Insertion And Extraction

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US Patent:
20190322094, Oct 24, 2019
Filed:
Feb 25, 2019
Appl. No.:
16/285094
Inventors:
Kedar G. Shah - Oakland CA, US
Diane George - Livermore CA, US
Satinderpall S. Pannu - Pleasanton CA, US
Sarah Felix - Oakland CA, US
International Classification:
B32B 37/12
A61N 1/05
A61B 90/11
A61B 5/04
Abstract:
A stiffener-reinforced microelectrode array probe and fabrication method using wicking channel-distributed adhesives which temporarily adheres a flexible device onto a rigid stiffener for insertion and extraction. Assembly is by dispensing a liquid adhesive into a narrow open groove wicking channel formed on the stiffener so that the adhesive is wicked along and fills the channel by capillary action, and adhering the adhesive-filled bonding side of the elongated section of the rigid substrate to a flexible device.

Modular Neuromodulation Systems, Methods Of Manufacture, And Methods Of Treating Rheumatoid Arthritis

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US Patent:
20190275330, Sep 12, 2019
Filed:
Nov 13, 2017
Appl. No.:
16/349540
Inventors:
- Brentford, Middlesex, GB
Kedar SHAH - South San Francisco CA, US
International Classification:
A61N 1/36
A61N 1/375
A61N 1/372
A61N 1/05
A61B 5/04
A61B 5/00
Abstract:
The present invention relates to implantable neuromodulation systems and methods, and in particular to modular neuromodulation systems suitable for implantation in a minimally invasive manner, methods of manufacturing the modular neuromodulation systems, and methods of treating rheumatoid arthritis using the modular neuromodulation systems. Particularly, aspects of the present invention are directed to a medical device that includes an implantable neurostimulator including a housing having a width of less than 10 mm and a height of less than 10 mm, one or more feedthroughs that pass through the housing, and an electronics module within the housing and connected to the one or more feedthroughs. The medical device further includes a lead assembly including a lead body including a conductor material, a lead connector that connects the conductor material to the one or more feedthroughs, and one or more electrodes connected to the conductor material.
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Kedar G Shah from North Wales, PA, age ~50 Get Report