Kechuan K Liu

6711859, Mar 30, 2004

Jun 1, 2001

09/872316

Michael Ray Bell - Dallas TX, 75201
Kechuan Liu - Plano TX, 75025

E06B 300

49501, 3122656, 403329, 220 402

A system for fixing two components together includes: (a) a boss integrally formed from one component about a boss axis; and (b) a latch integrally formed from the other component in a depending extension facilitating latch movement in an engaging plane and exerting a spring force urging the latch toward a first position. The latch is oriented about a latch axis in the engaging plane. The latch is in the first position when the components are situated in an initial position with the latch axis and the boss axis separated a first distance. The latch axis and the boss axis are separated a second distance less than the first distance when the components are urged together to an installed orientation with the latch held from the first position by the boss bearing against the latch with the engaging plane crossing the boss axis.

6769150, Aug 3, 2004

Nov 7, 2001

10/053469

Kechuan Liu - Plano TX
Shawn Legas - Plano TX

Alcatel, Societe Anonyme - Paris

A46B 1300

15 211, 15 971, 15 56, 385147

An optical connector cleaning device for cleaning a ferrule end surface of an optical or fiberoptic connector is described. The device includes a cleaning rod, a drive mechanism, and a cleaning media, such as a swab, a brush, a pad, or a foam, connected to an end of the cleaning rod and having a thickness past the end of the cleaning rod of at least about 0. 125 inches. A mating connector housing the cleaning rod may be provided for connecting with the optical connector. The drive mechanism may be housed in a handheld body or may be mounted on a dummy card connector physically compatible with a slot in a card-cage. The dummy card connector may include an adjustable frame which can be adjusted to modify card size in order for the same dummy card connector to be physically compatible with more than one physical slot configuration.

7151669, Dec 19, 2006

Jul 6, 2004

10/885317

Kechuan K Liu - Weston FL, US

G06F 1/20

361707, 361704, 165 803, 165185

A heat sink apparatus for use with electronic components comprises a base frame, a clipping system and a plurality of supporting members. The base frame and the clipping system and the supporting members are of unitary construction. The base frame is configured to have “i” repeatable channels with fins extended from or attached to its outside surfaces. The clipping system comprises a matrix [i, j] set of i×j spring clips. Each spring clip is configured to have partially constrained with the base frame, and to flex about an axis resiliently to effect an engaged relation to substantially fixedly maintain the electronic component in abutting relation with the inside walls of the channel. The supporting members are configured to have fixed connection with the base frame and be solderable. The heat sink apparatus's capacity of holding electronic components is scalable to accommodate upgrades and design changes of electronic products.

20050225945, Oct 13, 2005

Apr 5, 2005

11/099378

Kechuan Liu - Weston FL, US

H05K007/20

361709000, 165080300

A heat sink apparatus for use with electronic components comprises a base member and an integral spring clip. The base member and the integral spring clip(s) are of unitary construction. The base member is configured to have at least one receiving aperture and one heat-conducting surface with fins extended from or attached to its opposite surface. The integral spring clip comprises solderable elements, i.e. leads and surfaces, and auto-align mechanism feature. The integral spring clip is configured to have fully constrained with the base member, and to flex about an axis resiliently to effect an engaged relation to substantially fixedly maintain the electronic component in abutting relation with heat-conducting surface. The heat sink apparatus can be mounted onto a print circuit or wiring board via either through-hole or surface mounting technology to meet the circuit design and space requirements.

20080019095, Jan 24, 2008

Jul 24, 2006

11/492180

Kechuan Liu - Weston FL, US

H05K 7/20

361704

A heat sink apparatus for use with electronic components comprises a base portion and at least a securing portion. The base portion and the securing portion are of unitary construction. The base portion is configured to have at least one receiving aperture and one heat-conducting surface with fins extended from or attached to its opposite surface. The securing portion is a unitary construction which comprises a cam element and spring clip with auto-align and camming mechanism features. The securing portion is configured to have partially constrained with the base portion, and to be slide along the length direction for dynamic location of electronic device on heat sink. The cam element can be rotated about its cylindrical feature axis resiliently to effect an engaged relation to substantially fixedly maintain the electronic component in abutting relation with heat-conducting surface.

20090038780, Feb 12, 2009

Aug 6, 2008

12/221859

Kechuan Kevin Liu - Weston FL, US

F28D 15/00

16510428, 16510419

A pumpless liquid cooling system for removing heat from heat-generating components or systems comprises a heat absorbing portion or cold plate, a heat dissipating portion or heat exchanger and at least one driving device. The heat absorbing portion and the heat dissipating portion are of unitary construction as a sealed container with working fluid inside. The driving device and the heat dissipating portion is co-axially aligned and attached or fastened together. The heat absorbing portion is configured to have at least one thermal contact surface and a plurality of liquid passage within. The heat dissipating portion is configured to have a heat-dissipating body with plurality of external fins and an internal cylindrical liquid passage communicating with those of the heat absorbing portion and having a running fitting impeller driven by the driving device via magnetic forces to circulate the liquid in the heat transfer loop. Meanwhile the driving device moves the cool air through the fins of the heat dissipating portion to reject the heat absorbed by the heat absorbing portion.

20110013374, Jan 20, 2011

Jul 16, 2009

12/460262

Kechuan Kevin Liu - Weston FL, US

H02B 1/01

361825

An integral spring clip for use with a heat dissipator or heat sink apparatus comprises a securing portion and an attaching portion. The securing portion is configured to flex about a pivot axis to effect an engaged relation to substantially fixedly maintain the electronic component in abutting relation to the heat absorbing surface of a heat dissipater or a heat sink apparatus and secure it in a predefined position. The attaching portion comprises a plurality of solderable elements and is configured to attach a heat dissipator assembly in either vertical or horizontal orientation firmly onto a printed circuit or wiring board in a pre-defined place via soldering techniques. The ramified integral spring clip with a cam bar added on will further facilitate the assembly and disassembly operations. The integral spring clip is a simple unitary design and made of a single length spring wire with whole or selective solder coating.

20110155360, Jun 30, 2011

Dec 29, 2009

12/655334

Kechuan Kevin Liu - Weston FL, US

F28F 7/00

165185

A surface mountable heat sink apparatus for use with surface mount electronic components comprises a heat dissipating body and a plurality of solderable feet complying with Surface Mounting Technology (SMT). The heat dissipating body and the solderable feet are made of different materials and of unitary construction. The solderable feet project partially beyond one edge of the heat dissipating body. The surface mount heat sink apparatus and surface mount electronic component are touchlessly sandwiched and simultaneously soldered onto the solder drain pads on the printed circuit board. Heat dissipated from the surface mount electronic component is conductively transferred to the heat sink body through the solder drain pad, printed circuit board and solderable feet, and finally rejected to surroundings thereafter. Like all the SMT electronic components, the surface mount heat sink apparatus can be placed onto the printed circuit board manually or automatically by a pick-&-place automation equipment.