Inventors:
Teruomi Minami - Koshi, JP
Fumihiro Kamimura - Tosu, JP
Kazuki Kosai - Beaverton OR, US
Takashi Yabuta - Tosu, JP
Kenji Yokomizo - Austin TX, US
Shogo Mizota - Koshi, JP
Assignee:
Tokyo Electron Limited - Minato-Ku
International Classification:
B08B 3/04
US Classification:
134 26, 134 18, 134 21, 134 29, 134 33, 134 36, 134 42, 134902, 438745, 438748, 438749, 438750, 438751, 438906, 216 52, 216 53, 216 83, 216 92, 216 95, 257E21228
Abstract:
In a liquid processing apparatus configured to remove, from a substrate including a first film and a second film formed above the first film, the first film and the second film, a first chemical-liquid supply part supplies, to a substrate W, a first liquid for dissolving the first film, a second chemical-liquid supply part supplies a second chemical liquid for weakening the second film, and a fluid supply part serving also as an impact giving part gives a physical impact to the second film so as to break the second film and supplies a fluid for washing away debris of the broken second film. A control device controls the respective parts such that, after the second liquid has been supplied and then the fluid has been supplied from the fluid supply part, the first chemical liquid is supplied.