Inventors:
Mark D. Summers - Phoenix AZ
Karl H. Mauritz - Chandler AZ
Amber S. Bedi - Phoenix AZ
William Handley - Chandler AZ
Carol Miller - Gilbert AZ
Javier Leija - Chandler AZ
Daniel Dragoon - Phoenix AZ
Assignee:
Intel Corporation - Santa Clara CA
International Classification:
H05K 720
US Classification:
361704, 361707, 361709, 361710, 361718, 361719, 361720, 361721, 257718, 257719, 165 802, 165 803, 165185
Abstract:
The present invention relates generally to apparatus and methods for the spreading and dissipation of thermal energy from heat-producing components. More particularly, it relates to a heat transfer apparatus and methods particularly useful in the electrical arts. One embodiment of a heat transfer apparatus include but not limited to, a spring-biased member comprising a first side member, a second side member, and a connecting member adapted for spring-biased removable attachment to a heat-producing device. Another embodiment of a heat transfer apparatus is a spring-biased carrier that attaches to a heat-producing device and which carries a member, such as a finned plate. Another embodiment of a heat transfer apparatus is a spring-biased member comprising fingers for conducting thermal energy to a structure. Another embodiment of a heat transfer apparatus is a spring-biased clip used to attach separate heat-spreading/dissipating members, such as a finned plate, against a heat-producing member.