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Kameshwar D Poolla

from Berkeley, CA
Age ~64
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Also known as:
Kameshwar R Poolla, Kameshwar Poola, Kameshwar Poolia
Phone and address:
1250 Grizzly Peak Blvd, Berkeley, CA 94708
(510) 486-2676
Related to:
Subhadra PoollaRadhika D Rao, 60Ramanamurthy V Poolla, 95
Connected to:
Anand K Poolla, 47Dan L Poolman, 66Kerry C Poolman, 54Marko Poolman, 57Melanie Poolman, 38Nicholas A Poolos, 47Robert S Poolsawat, 45Carolyn Poolus, 60Nopporn Poolyarat, 47Uve Poom, 40

Kameshwar Poolla Phones & Addresses

  • 1250 Grizzly Peak Blvd, Berkeley, CA 94708 (510) 486-2676
  • Emeryville, CA
  • Brooklyn, NY
  • Ann Arbor, MI
  • Washington, DC
  • Urbana, IL
  • 1250 Grizzly Peak Blvd, Berkeley, CA 94708

Work

Position: Building and Grounds Cleaning and Maintenance Occupations

Education

Degree: Graduate or professional degree

Resumes

Resumes

Kameshwar Poolla Photo 1

Professor At Uc Berkeley

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Position:
Professor at UC Berkeley, Professor at University of California, Berkeley
Location:
San Francisco Bay Area
Industry:
Electrical/Electronic Manufacturing
Work:
UC Berkeley
Professor
University of California, Berkeley since 1991
Professor
Kameshwar Poolla Photo 2

Kameshwar Poolla

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Business Records

Name / Title
Company / Classification
Phones & Addresses
Kameshwar Poolla
Co-Founder
Onwafer Tech
Whol Electrical Equipment · Mfg Measurement and Control Devices
5451 Patrick Henry Dr, Santa Clara, CA 95054

Publications

Us Patents

Methods Of And Apparatus For Controlling Process Profiles

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US Patent:
7016754, Mar 21, 2006
Filed:
Sep 26, 2003
Appl. No.:
10/673049
Inventors:
Kameshwar Poolla - Berkeley CA, US
Costas J. Spanos - Lafayette CA, US
Assignee:
OnWafer Technologies, Inc. - Dublin CA
International Classification:
G06F 19/00
US Classification:
700121, 700109, 438 14
Abstract:
Presented are methods and apparatus for controlling the processing of a substrate during a process step that is sensitive to one or more process conditions. One embodiment includes a method performed with corresponding apparatus that includes a controller. One step includes constructing a perturbation model relating changes in control parameters for the apparatus to one or more resulting changes in the process. The method also includes the step of using the perturbation model with at least one of a performance objective and a constraint to derive optimized control parameters for the controller. Another step in the method includes operating the controller with the optimized control parameters. Another embodiment includes an apparatus for processing substrates where the apparatus comprises optimized control parameters.

Methods And Apparatus For Equipment Matching And Characterization

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US Patent:
7212950, May 1, 2007
Filed:
Sep 17, 2003
Appl. No.:
10/666932
Inventors:
Kameshwar Poolla - Berkeley CA, US
Assignee:
OnWafer Technologies, Inc. - Pleasanton CA
International Classification:
G06F 19/00
US Classification:
702183, 702182, 702 84, 700109
Abstract:
Computer program products, methods, systems, and apparatus for fingerprinting and process matching process tools such as process tools used for processing workpieces are described. One embodiment includes a method to determine process matching of one or more process tools using a first data set and a second data set. The first data set and the second data set include an operating characteristic for a process. The method comprises fingerprinting the one or more process tools using the first data set and the second data set; finding correspondences between transition points in the first data set and the second data set; and comparing the first data set and second data set using the correspondences to determine whether the first data set and the second data set match so as to indicate whether the one or more process tools match.

Methods And Apparatus For Low Distortion Parameter Measurements

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US Patent:
7299148, Nov 20, 2007
Filed:
Jul 8, 2005
Appl. No.:
11/177922
Inventors:
Dean Hunt - Danville CA, US
Costas J. Spanos - Lafayette CA, US
Michael Welch - Livermore CA, US
Kameshwar Poolla - Berkeley CA, US
Mason L. Freed - Pleasant Hill CA, US
Assignee:
OnWafer Technologies, Inc. - Santa Clara CA
International Classification:
G01K 1/12
US Classification:
702130
Abstract:
This invention seeks to provide methods and apparatus that can improve the accuracy of measured parameter data used for processing workpieces. One aspect of the present invention includes methods of measuring process conditions with low distortion of the measurements caused by the measuring apparatus. The measurements include data for applications such as data for monitoring, controlling, and optimizing processes and process tools. Another aspect of the present invention includes apparatus for measuring substantially correct data for applications such as generating data for monitoring, controlling, and optimizing processes and process tools.

Methods Of And Apparatuses For Controlling Process Profiles

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US Patent:
7403834, Jul 22, 2008
Filed:
Sep 14, 2005
Appl. No.:
11/228004
Inventors:
Kameshwar Poolla - Berkeley CA, US
Costas J. Spanos - Lafayette CA, US
Assignee:
Regents of the University of California - Oakland CA
International Classification:
G06F 19/00
US Classification:
700121, 700109
Abstract:
Presented are methods and apparatus for controlling the processing of a substrate during a process step that is sensitive to one or more process conditions. One embodiment includes a method performed with corresponding apparatus that includes a controller. One step includes constructing a perturbation model relating changes in control parameters for the apparatus to one or more resulting changes in the process. The method also includes the step of using the perturbation model with at least one of a performance objective and a constraint to derive optimized control parameters for the controller. Another step in the method includes operating the controller with the optimized control parameters. Another embodiment includes an apparatus for processing substrates where the apparatus comprises optimized control parameters.

Sensor Geometry Correction Methods And Apparatus

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US Patent:
20020177916, Nov 28, 2002
Filed:
Apr 19, 2002
Appl. No.:
10/126456
Inventors:
Kameshwar Poolla - Berkeley CA, US
Costas Spanos - Lafayette CA, US
International Classification:
G06F019/00
US Classification:
700/108000, 700/121000
Abstract:
Described are methods and apparatus for collecting measured parameter data for applications such as deriving response models and information required for developing and maintaining processes and process tools. The methods and apparatus are capable of deriving correction factors for the measured data and applying the corrections factors to the measure data so as to provide corrected parameter data having increased accuracy. One embodiment uses warpage geometry to derive the correction factors.

Methods And Apparatus For Deriving Thermal Flux Data For Processing A Workpiece

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US Patent:
20040107066, Jun 3, 2004
Filed:
Sep 16, 2003
Appl. No.:
10/664810
Inventors:
Kameshwar Poolla - Berkeley CA, US
Randall Mundt - Pleasanton CA, US
International Classification:
G01K017/00
US Classification:
702/136000, 702/130000
Abstract:
Presented are methods, systems, and apparatus for deriving heat flux information and using heat flux information for a workpiece used in temperature sensitive processes.

Sensor Methods And Apparatus

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US Patent:
20050028049, Feb 3, 2005
Filed:
May 17, 2004
Appl. No.:
10/848523
Inventors:
Kameshwar Poolla - Berkeley CA, US
Costas Spanos - Lafayette CA, US
International Classification:
G06K005/04
US Classification:
714699000
Abstract:
Described are methods and apparatus for a sensor apparatus for collecting measured parameter data for such applications as deriving response models and information required for developing and maintaining processes and process tools.
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Kameshwar D Poolla from Berkeley, CA, age ~64 Get Report