Joe P Mousseau

56125135, Mar 18, 1997

Sep 19, 1995

8/530747

Mark E. Tuttle - Boise ID
Rickie C. Lake - Boise ID
Joe P. Mousseau - Boise ID
Clay L. Cirino - Boise ID

Micron Communications, Inc. - Boise ID

H05K 300

174260

An enclosed electrical circuit and method for manufacturing the electrical circuit are provided. Initially a flexible substrate is formed with a plurality of electrical circuits. By way of example, each circuit can contain a conductive trace, a battery and a die, all in electrical communication. During the manufacturing process, a barrier is placed on the substrate and a curable encapsulant is poured into a cavity formed by the barrier and the substrate to encapsulate each circuit. The barrier can be formed as a compartmentalized dam having a separate cavity for each circuit, as a perimeter dam having a single cavity, or as a spacer sheet having a separate cavity for each circuit formed by a pattern of cut outs. Following the encapsulation step, the electrical circuits can be singulated into separate encapsulated circuits.

61669156, Dec 26, 2000

Jan 29, 1997

8/790916

Rickie C. Lake - Eagle ID
Joe Mousseau - Boise ID
Mark E. Tuttle - Boise ID

Micron Technology, Inc. - Boise ID

H05K 103

361748

A method of forming a circuit board includes, a) providing a temporary substrate; b) depositing an uncured electrically insulative circuit board material over the temporary substrate, the circuit board material adhering to the temporary substrate; c) substantially curing the uncured circuit board material into at least one self supporting sheet; d) providing circuit traces atop the cured self supporting sheet; e) mounting an electronic circuit component atop the cured self supporting sheet in electrical communication with the circuit traces; and f) peeling the temporary substrate and cured self supporting sheet from one another. An electronic circuit of the invention includes, i) a self-supporting electrically insulative ink or paint substrate, the ink or paint substrate having an outer surface; ii) circuit traces provided on the ink or paint substrate outer surface; and iii) at least one electronic circuit component mounted to the ink or paint substrate outer surface in electrical connection with the circuit traces.

59074779, May 25, 1999

Mar 11, 1997

8/814206

Mark E. Tuttle - Boise ID
Rickie C. Lake - Eagle ID
Joe P. Mousseau - Boise ID
Clay L. Cirino - Boise ID

Micron Communications, Inc. - Boise ID

H01L 2331
H05K 702

361760

An enclosed electrical circuit and method for manufacturing the electrical circuit are provided. Initially a flexible substrate is formed with a plurality of electrical circuits. By way of example, each circuit can contain a conductive trace, a battery and a die, all in electrical communication. During the manufacturing process, a barrier is placed on the substrate and a curable encapsulant is poured into a cavity formed by the barrier and the substrate to encapsulate each circuit. The barrier can be formed as a compartmentalized dam having a separate cavity for each circuit, as a perimeter dam having a single cavity, or as a spacer sheet having a separate cavity for each circuit formed by a pattern of cut outs. Following the encapsulation step, the electrical circuits can be singulated into separate encapsulated circuits.

59375124, Aug 17, 1999

Jan 11, 1996

8/585428

Rickie C. Lake - Eagle ID
Joe Mousseau - Boise ID
Mark E. Tuttle - Boise ID

Micron Communications, Inc. - Boise ID

H05K 330

29832

A method of forming a circuit board includes, a) providing a temporary substrate; b) depositing an uncured electrically insulative circuit board material over the temporary substrate, the circuit board material adhering to the temporary substrate; c) substantially curing the uncured circuit board material into at least one self supporting sheet; d) providing circuit traces atop the cured self supporting sheet; e) mounting an electronic circuit component atop the cured self supporting sheet in electrical communication with the circuit traces; and f) peeling the temporary substrate and cured self supporting sheet from one another. An electronic circuit of the invention includes, i) a self-supporting electrically insulative ink or paint substrate, the ink or paint substrate having an outer surface; ii) circuit traces provided on the ink or paint substrate outer surface; and iii) at least one electronic circuit component mounted to the ink or paint substrate outer surface in electrical connection with the circuit traces.