US Patent:
20130161083, Jun 27, 2013
Inventors:
CHARLES RANDALL MALSTROM - Lebanon PA, US
Joseph D. Locondro - Jacobus PA, US
Michael Fredrick Laub - Enola PA, US
David Bruce Sarraf - Elizabethtown PA, US
Assignee:
Tyco Electronics Corporation - Berwyn PA
International Classification:
H05K 1/11
H05K 3/12
H05K 1/00
US Classification:
174266, 174250, 427 973, 205125
Abstract:
A printed circuit board includes a substrate having a first surface, a first conductive circuit deposited on the first surface and a dielectric cover deposited on the first surface and covering at least a portion of the first conductive circuit. The dielectric cover has an edge and the first surface is exposed beyond the edge. A second conductive circuit is deposited on the dielectric cover and the substrate. The second conductive circuit spans the edge such that at least part of the second conductive circuit is deposited on the dielectric cover and at least part of the second conductive circuit is deposited on the first surface.