Joseph L Grolmes

8454780, Jun 4, 2013

Sep 10, 2009

12/556621

Barry Jay Anderson - Spokane WA, US
Anand Rudra Venkitaraman - Cincinnati OH, US
George Stephen Reising - Batavia OH, US
Jean-Philippe Marie Autran - Wyoming OH, US
Joseph Leslie Grolmes - Madeira OH, US

The Procter & Gamble Company - Cincinnati OH

B32B 37/20

156160, 156229

A method for producing a stretch laminate includes forming an intermediate stretch laminate. Forming the intermediate stretch laminate includes providing a first substrate and attaching an elastic film to a surface of the first substrate via an adhesive. The first substrate and the elastic film are in a face to face orientation. The intermediate stretch laminate has a residual energy of greater than or equal to 50% at a predetermined applied strain. The method of forming the stretch laminate further includes mechanically activating the intermediate stretch laminate at a strain rate of at least 100 s.

8574668, Nov 5, 2013

Apr 30, 2012

13/459363

Darrell Ian Brown - Mason OH, US
Joseph Leslie Grolmes - Madeira OH, US

The Procter & Gamble Company - Cincinnati OH

B05D 5/10

4272082, 4272071, 4272086, 427355, 427369, 427401, 118211, 118253, 118410, 118419, 118420

Methods and apparatuses herein may provide for the application of viscous fluids, such as adhesives, in pre-determined patterns to an advancing substrate. The fluid application apparatus may include a slot die applicator and a substrate carrier. The substrate carrier may include one or more pattern elements and may be adapted to advance the substrate past the slot die applicator as the slot die applicator discharges adhesive onto the substrate. In operation, the substrate is disposed on the substrate carrier; the substrate carrier advances the substrate past the slot opening of the slot die applicator. In turn, the substrate is intermittently compressed between the slot die applicator and the pattern surface of the pattern element. As the substrate is intermittently compressed, adhesive discharged from the slot die applicator is applied onto the substrate in an area having a shape substantially the same as a shape defined by the pattern surface.

20070202767, Aug 30, 2007

Feb 24, 2006

11/361918

Barry Anderson - Spokane WA, US
Anand Venkitaraman - Cincinnati OH, US
George Reising - Batavia OH, US
Jean-Philippe Autran - Wyoming OH, US
Joseph Grolmes - Madeira OH, US

B32B 27/04
D04H 13/00

442327000, 442149000

A method for producing a stretch laminate includes forming an intermediate stretch laminate. Forming the intermediate stretch laminate includes providing a first substrate and attaching an elastic film to a surface of the first substrate via an adhesive. The first substrate and the elastic film are in a face to face orientation. The intermediate stretch laminate has a residual energy of greater than or equal to 50% at a predetermined applied strain. The method of forming the stretch laminate further includes mechanically activating the intermediate stretch laminate at a strain rate of at least 100 s.

20080306463, Dec 11, 2008

Jun 5, 2008

12/133404

Terra Louise Dent - Mason OH, US
Joseph Leslie Grolmes - Madeira OH, US
Jeffrey Richard Holley - Mason OH, US
Yoshihiko Tachibana - Loveland OH, US
Terrill Alan Young - Cincinnati OH, US

A61F 13/51
B32B 27/00

604372, 428219

Low basis weight films having a heat capacity×density value of greater than about 970,000 Ws/mK, as measured by the method described herein, the films having a basis weight of less than about 16 gsm and comprising at least about 10% polypropylene

20110274834, Nov 10, 2011

Mar 21, 2011

13/052139

Darrell Ian Brown - Mason OH, US
Joseph Leslie Grolmes - Madeira OH, US

B05D 5/10
B05C 13/00
B05C 5/02

4272071, 118407

Methods and apparatuses herein may provide for the application of viscous fluids, such as adhesives, in pre-determined patterns to an advancing substrate. The fluid application apparatus may include a slot die applicator and a substrate carrier. The substrate carrier may include one or more pattern elements and may be adapted to advance the substrate past the slot die applicator as the slot die applicator discharges adhesive onto the substrate. In operation, the substrate is disposed on the substrate carrier; the substrate carrier advances the substrate past the slot opening of the slot die applicator. In turn, the substrate is intermittently compressed between the slot die applicator and the pattern surface of the pattern element. As the substrate is intermittently compressed, adhesive discharged from the slot die applicator is applied onto the substrate in an area having a shape substantially the same as a shape defined by the pattern surface.

20120184933, Jul 19, 2012

Jan 9, 2012

13/345840

Stefan Floeter - Euskirchen, DE
Saif Hasan - Euskirchen, DE
Gabriele Stiehl - Schwalbach, DE
Joseph Leslie Grolmes - Madeira OH, US

The Procter & Gamble Company - Cincinnati OH

A61L 15/58
C09J 109/06
B32B 37/12
C09J 123/00
B32B 5/26
B32B 7/12

604365, 156 60, 156290, 156334

A process is provided for making a bond between a first, relative hydrophilic nonwoven and a second relatively less hydrophilic nonwoven by use of a construction adhesive, by applying the adhesive only to the first more hydrophilic nonwoven; also provided are absorbent cores for absorbent article comprising such bonded nonwovens, and such absorbent articles.

20140031777, Jan 30, 2014

Oct 1, 2013

14/042999

Joseph Leslie Grolmes - Madeira OH, US

The Procter & Gamble Company - Cincinnati OH

B05D 5/10
A61F 13/15

604365

Methods and apparatuses herein may provide for the application of viscous fluids, such as adhesives, in pre-determined patterns to an advancing substrate. The fluid application apparatus may include a slot die applicator and a substrate carrier. The substrate carrier may include one or more pattern elements and may be adapted to advance the substrate past the slot die applicator as the slot die applicator discharges adhesive onto the substrate. In operation, the substrate is disposed on the substrate carrier; the substrate carrier advances the substrate past the slot opening of the slot die applicator. In turn, the substrate is intermittently compressed between the slot die applicator and the pattern surface of the pattern element. As the substrate is intermittently compressed, adhesive discharged from the slot die applicator is applied onto the substrate in an area having a shape substantially the same as a shape defined by the pattern surface.

20220192896, Jun 23, 2022

Dec 3, 2021

17/541421

- Cincinnati OH, US
Dinah HASSAN - Euskirchen, DE
Thorsten RINNERT - GIESSENER STRASSE FERNWALD, DE
Christopher KRASEN - Cincinnati OH, US
Jean Vittorio Seguro - Cincinnati OH, US
Joseph Leslie GROLMES - Madeira OH, US
Andrew Price PALMER - Lebanon OH, US
Fredrick William GIBSON - Cincinnati OH, US
Luis Eduardo NUNEZ - Koeln, DE

A61F 13/49
A61F 13/15

The present disclosure relates to absorbent articles with waist panels configured with physical properties for mitigating assembly complications. In some configurations, a waist panel comprises a longitudinal bending stiffness with peak load of at least about 0.19 N; a machine direction web modulus at 2% of at least about 72 N/%; a tensile load at peak of at least about 7 N/cm, as measured according to a MD tensile test; and/or a thickness of least about 0.4 mm, as measured according to Thickness Test. Such physical properties may help prevent and/or reduce instances of manufacturing problems and/or defective products during assembly by: enhancing the ability to consistently cut desired machine direction lengths of waist panels; reducing the possibility of a waist panel to undesirably fold back onto itself during assembly; enhancing the ability to absorb heat without damage and more consistently transfer discrete elastic parts between transformation apparatuses.