US Patent:
20160284075, Sep 29, 2016
Inventors:
- Boston MA, US
Navrooppal Singh - Mullica Hill NJ, US
Jonathan Jesneck - Enfield CT, US
Jan Falkowski - Cambridge MA, US
Ezekiel Hausfather - San Francisco CA, US
William Morris - Somerville MA, US
Thomas Scaramellino - New York NY, US
International Classification:
G06T 7/00
G06T 7/60
Abstract:
The present invention provides methods, apparatus, and systems for analyzing a structure using thermal imaging. A plurality of images of a structure are automatically captured using one or more image capture devices. The images may be captured in one or more ranges of wavelengths of light. The images are then processed to generate image data for the images. The image data can then be analyzed to determine one or more properties of the structure. The images may be captured at an angle with respect to the structure of between approximately 45 to 135 degrees. The images may be captured during a time where one of indirect or no sunlight is present.