Inventors:
Guiyun Bai - Chandler AZ, US
Sushrutha Gujjula - Chandler AZ, US
Ronald L. Spreitzer - Phoenix AZ, US
Naresh Satyan - Pasadena CA, US
David Mathine - ALBUQUERQUE NM, US
Sam Khalili - San Jose CA, US
Sanjeev Gupta - Santa Rosa CA, US
Eleanor Patricia Paras Rabadam - Folsom CA, US
Ankur Agrawal - Chandler AZ, US
Kenneth Brown - Mesa AZ, US
Jonathan Doylend - Morgan Hill CA, US
Daniel Grodensky - Haifa, IL
Israel Petronius - Haifa, IL
International Classification:
G01S 7/481
B81B 7/02
G01S 17/931
Abstract:
Disclosed herein are microelectronics packages and methods for manufacturing the same. The microelectronics packages may include a photonic integrated circuit (PIC), an electrical integrated circuit (EIC), and an interconnect. The interconnect may connect the EIC to the PIC. The interconnect may include a plurality of paths between the EIC and the PIC and the individual paths of the plurality of paths are less than 100 micrometers long.