Jonathan S Dahm

7345320, Mar 18, 2008

Nov 2, 2004

10/979903

Jonathan S. Dahm - Key Largo FL, US

H01L 33/00

257 99, 257 81, 257100, 257104, 362 26, 362 27, 165272, 165117

The present invention provides a method and apparatus for using light emitting diodes for curing and various solid state lighting applications. The method includes a novel method for cooling the light emitting diodes and mounting the same on heat pipe in a manner which delivers ultra high power in UV, visible and IR regions. Furthermore, the unique LED packaging technology of the present invention utilizes heat pipes that perform very efficiently in very compact space. Much more closely spaced LEDs operating at higher power levels and brightness are possible because the thermal energy is transported in an axial direction down the heat pipe and away from the light-emitting direction rather than a radial direction in nearly the same plane as the “p-n” junction.

7863641, Jan 4, 2011

Oct 12, 2007

11/974432

Jonathan S. Dahm - Key Largo FL, US

H01L 33/00

257 99, 257276, 257625, 257675, 257706, 257720, 257E23101

The present invention provides a method and apparatus for using light emitting diodes for curing and various solid state lighting applications. The method includes a novel method for cooling the light emitting diodes and mounting the same on heat pipe in a manner which delivers ultra high power in UV, visible and IR regions. Furthermore, the unique LED packaging technology of the present invention utilizes heat pipes that perform very efficiently in very compact space. Much more closely spaced LEDs operating at higher power levels and brightness are possible because the thermal energy is transported in an axial direction down the heat pipe and away from the light-emitting direction rather than a radial direction in nearly the same plane as the “p-n” junction.

7989839, Aug 2, 2011

Mar 1, 2010

12/715163

Jonathan S. Dahm - Key Largo FL, US

Koninklijke Philips Electronics, N.V.

H01L 33/00

257 99, 257276, 257625, 257675, 257706, 257717, 257720, 257796, 257E23101

The present invention provides a method and apparatus for using light emitting diodes for curing and various solid state lighting applications. The method includes a novel method for cooling the light emitting diodes and mounting the same on heat pipe in a manner which delivers ultra high power in UV, visible and IR regions. Furthermore, the unique LED packaging technology of the present invention utilizes heat pipes that perform very efficiently in very compact space. Much more closely spaced LEDs operating at higher power levels and brightness are possible because the thermal energy is transported in an axial direction down the heat pipe and away from the light-emitting direction rather than a radial direction in nearly the same plane as the “p-n” junction.

8047686, Nov 1, 2011

Aug 31, 2007

11/849147

Jonathan S. Dahm - Key Largo FL, US
Mark Paul Jongewaard - Arvada CO, US

F21V 29/00
F21V 5/00
F21V 7/20
B60Q 1/06

362294, 362580, 362345, 362373

The present invention provides an optical device comprising one or more heat pipes with a desired level of thermal coupling with the light-emitting elements which are positioned along a periphery of the evaporator surface portion of the heat pipe in such a way that they are thermally coupled to the heat pipe. In one embodiment, the heat pipe of the present invention can be readily integrated with optical elements such as reflectors or collimators.

8378322, Feb 19, 2013

Jan 26, 2011

13/014069

Jonathan S. Dahm - Key Largo FL, US
Mark Jongewaard - Westminster CO, US
Geoff Campbell - Broomfield CO, US

Fusion UV Systems - Gaithersburg MD

F21V 29/00
F21V 7/08
H05B 33/04

2504961, 2504941, 250504 R, 362218, 362235

Micro-channel-cooled UV curing systems and components thereof are provided. According to one embodiment, a lamp head module includes an optical macro-reflector, an array of LEDs and a micro-channel cooler assembly. The array is positioned within the reflector and has a high fill factor and a high aspect ratio. The array provides a high irradiance output beam pattern having a peak irradiance of greater than 25 W/cmat a work piece surface at least 1 mm away from an outer surface of a window of the reflector. The micro-channel cooler assembly maintains a substantially isothermal state among p-n junctions of the LEDs at less than or equal to 80 Celsius. The micro-channel cooler assembly also provides a common anode substrate for the array. A thermally efficient electrical connection is formed between the array and the common anode substrate by mounting the array to the micro-channel cooler assembly.

20050158687, Jul 21, 2005

Jan 24, 2005

11/042970

Jonathan Dahm - Longmont CO, US

A61C003/00

433029000

The present invention provides a method and apparatus for using light emitting diodes for curing in various applications. The method includes a novel method for cooling the light emitting diodes and mounting the same on heat pipe in a manner which delivers ultra high power in UV, visible and IR regions. Furthermore, the unique LED packaging technology of the present invention that utilizes heat pipes performs far more efficiently in much more compact space. This allows much more closely spaced LEDs operating at higher power and brightness.

20100145415, Jun 10, 2010

Oct 11, 2007

12/445061

Jonathan S. Dahm - Key Largo FL, US
William Louis Barnard - Maple Valley WA, US
James C. Chen - Clyde Hill WA, US
David B. Shine - Littleton CO, US

A61N 5/06

607 88

A light delivery system to provide light treatment to a patient includes a catheter assembly having a plurality of light sources that transmit light towards a target site within a patient. In one embodiment, the light delivery system has a plurality of light sources mounted to a flexible transparent base that extends at least partially through a distal tip of the catheter assembly. The light sources can be wire bonded or mounted in a flip chip arrangement onto the base. In one embodiment to produce the distal tip, an array of light energy sources can be held by an array of holders of a fixture device. A vacuum is applied to secure each light energy source in a corresponding holder. While the vacuum is applied, the energy sources are electrically connected by wire bonding. The vacuum can be reduced or stopped thereby permitting removal of the light energy sources from the fixture device.

20100220472, Sep 2, 2010

Mar 3, 2010

12/716846

Jonathan S. Dahm - Longmont CO, US

F21V 9/00
F21V 29/00

362231, 362373, 362294, 362235

The present invention provides a method and apparatus for using light emitting diodes for curing in various applications. The method includes a novel method for cooling the light emitting diodes and mounting the same on heat pipe in a manner which delivers ultra high power in UV, visible and IR regions. Furthermore, the unique LED packaging technology of the present invention that utilizes heat pipes performs far more efficiently in much more compact space. This allows much more closely spaced LEDs operating at higher power and brightness.