John G Sikonia

7060204, Jun 13, 2006

Apr 2, 2003

10/404047

Bo Li - San Jose CA, US
Nancy Iwamoto - San Diego CA, US
Boris Korolev - San Jose CA, US
Paul G. Apen - San Francisco CA, US
Kreisler Lau - Sunnyvale CA, US
John G. Sikonia - Bend OR, US
Ananth Naman - San Jose CA, US
Amauel Gebrebrhan - Mountain View CA, US
Nassrin Sleiman - Sunnyvale CA, US
Ruslan Zherebin - Daly City CA, US

Honeywell International Inc. - Morristown NJ

H01B 1/12
C08J 9/38
C08J 9/00

252511, 252500, 252 623, 521 52, 521 77, 525132

The present invention provides a composition comprising: (a) dielectric material; and (b) porogen comprising at least two fused aromatic rings wherein each of the fused aromatic rings has at least one alkyl substituent thereon and a bond exists between at least two of the alkyl substituents on adjacent aromatic rings. Preferably, the dielectric material is a composition comprising (a) thermosetting component comprising (1) optionally monomer of Formula I as set forth below and (2) at least one oligomer or polymer of Formula II as set forth below where Q, G, h, I, I, and w are as set forth below and (b) porogen. Preferably, the porogen is selected from the group consisting of unfunctionalized polyacenaphthylene homopolymer, functionalized polyacenaphthylene homopolymer, polyacenaphthylene copolymer, polynorbornene, polycaprolactone, poly(2-vinylnaphthalene), vinyl anthracene, polystyrene, polystyrene derivatives, polysiloxane, polyester, polyether, polyacrylate, aliphatic polycarbonate, polysulfone, polylactide, and blends thereof. The present compositions are particularly useful as dielectric substrate material in microchips, multichip modules, laminated circuit boards, and printed wiring boards.

7141188, Nov 28, 2006

May 30, 2002

10/158513

Bo Li - San Jose CA, US
Nancy Iwamoto - San Diego CA, US
Boris Korolev - San Jose CA, US
Paul G. Apen - San Jose CA, US
Kreisler Lau - Sunnyvale CA, US
John G. Sikonia - Bend OR, US
Ananth Naman - San Jose CA, US
Amauel Gebrebrhan - Mountain View CA, US
Nassrin Sleiman - Sunnyvale CA, US
Ruslan Zherebin - Daly City CA, US

Honeywell International Inc. - Morristown NJ

H01L 21/4763
H01B 3/22
C08F 8/00
C08J 9/02

252570, 252571, 252573, 252511, 521 52, 521 77, 525100, 525101, 525275, 257578

The present invention provides a composition comprising: (a) dielectric material; and (b) porogen comprising at least two fused aromatic rings wherein each of the fused aromatic rings has at least one alkyl substituent thereon and a bond exists between at least two of the alkyl substituents on adjacent aromatic rings. Preferably, the dielectric material is a composition comprising (a) thermosetting component comprising (1) optionally monomer of Formula I as set forth below and (2) at least one oligomer or polymer of Formula II as set forth below where Q, G, h, I, I, and w are as set forth below and (b) porogen. Preferably, the porogen is selected from the group consisting of unfunctionalized polyacenaphthylene homopolymer, functionalized polyacenaphthylene homopolymer, polyacenaphthylene copolymer, polynorbornene, polycaprolactone, poly(2-vinylnaphthalene), vinyl anthracene, polystyrene, polystyrene derivatives, polysiloxane, polyester, polyether, polyacrylate, aliphatic polycarbonate, polysulfone, polylactide, and blends thereof. The present compositions are particularly useful as dielectric substrate material in microchips, multichip modules, laminated circuit boards, and printed wiring boards.

20020076543, Jun 20, 2002

Dec 19, 2000

09/741634

John Sikonia - Morgan Hill CA, US

B32B003/26

428/315900, 428/317900, 428/319300

In accordance with the present invention, compositions and methods are provided in which a layered low dielectric constant nanoporous material is produced that comprises a first layer juxtaposing a substrate; a second nanoporous layer juxtaposing the first layer; and an additional layer juxtaposing the second layer. The layered dielectrics of the present invention are formed using nanoporous materials by a) depositing a first layer on a substrate; b) depositing a second layer that is nanoporous and that juxtaposes the first layer; c) treating the second layered material to produce nanoporosity; and d) depositing at least one additional layer that partially juxtaposes the second layer. A layer of wires or other electronic components can also be situated between the substrate layer and the first layer.

61716871, Jan 9, 2001

Oct 18, 1999

9/420042

Roger Leung - San Jose CA
David Schaefer - San Jose CA
John Sikonia - Morgan Hill CA

Honeywell International Inc. - Morristown NJ

B32B 326

4283044

In accordance with the present invention, a low dielectric constant structural layer is produced having increased mechanical strength and having a plurality of voids that comprises a substrate layer; a low dielectric structural layer juxtaposing the substrate layer; and an infiltrating layer comprising an infiltrating material having a volatile component and a reinforcing component juxtaposing the structural layer and coating at least some of the plurality of voids. Also, methods are provided in which the mechanical strength of a structural layer having a plurality of voids is increased by a) depositing the structural layer on a substrate layer; b) providing an infiltrating material having a volatile component and a reinforcing component; c) introducing the infiltrating material into at least some of the plurality of voids; and d) treating the infiltrating material such that the structural strength is increased by a substantial amount.