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John A Naumovitz

from Midland, MI
Age ~60
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Also known as:
John Anthony Naumovitz
Phone and address:
5014 Amberwood Ct, Midland, MI 48640
(989) 837-6543
Related to:
Tyler S Throop, 30David Beattie, 64Karen KnollCheryl Throop, 61Lauren Hubers, 35
Connected to:
Peter Naumovich, 85Danny Naumovski, 38Nenad Naumovski, 45Sasha K Naumovski, 50Toni Naumovski, 58Vlade Naumovski, 78Carol A Naumowicz, 56George L Naumowicz, 78Jeffrey J Naumowitz, 48Joseph C Naumowicz, 45

John Naumovitz Phones & Addresses

  • 5014 Amberwood Ct, Midland, MI 48640 (989) 837-6543
  • 5014 Amberwood Ct #Q, Midland, MI 48640
  • 4780 Southfield Rd, Auburn, MI 48611
  • Moosic, PA
  • Olyphant, PA
  • 5014 Amberwood Ct, Midland, MI 48640

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Vehicle Records

John Naumovitz

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Address:
5014 Amberwood Ct, Midland, MI 48640
Phone:
(989) 837-6543
VIN:
2FMDK36C07BB54047
Make:
FORD
Model:
EDGE
Year:
2007

Resumes

Resumes

John Naumovitz Photo 1

Principle Research Scientist

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Location:
Saginaw, MI
Industry:
Chemicals
Work:
The Dow Chemical Company
Principle Research Scientist
Education:
Penn State University 1982 - 1986
Bachelors, Bachelor of Science, Chemical Engineering
Skills:
Polymers
R&D
Polymer Science
Chemical Engineering
Technology Transfer
Rheology
Chemistry
Plastics
Resin
Polymer Chemistry
Commercialization
John Naumovitz Photo 2

John Naumovitz

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Publications

Us Patents

Method For Preparing Multilayer Films

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US Patent:
6685872, Feb 3, 2004
Filed:
Jul 3, 2001
Appl. No.:
09/899614
Inventors:
Joseph Dooley - Midland MI
Steve R. Jenkins - Clare MI
John A. Naumovitz - Midland MI
Assignee:
Dow Global Technologies Inc. - Midland MI
International Classification:
B29C 4706
US Classification:
264514, 264563, 26417126, 26417316, 2642098
Abstract:
A method for coextruding a multilayer tubular film having a barrier material comprises (a) extruding a core extrudate of barrier material with a core extruder; (b) providing a preencapsulation die adjacent the outlet of the core extruder, the prencapsulation die capable of producing a non-uniform layer thickness; (c) extruding a preencapsular extrudate of preencapsular material and directing said preencapsular extrudate to the preencapsulation die; (d) joining the core extrudate and the preencapsular extrudate in the preencapsulation die in a coaxial relationship wherein the preencapsular extrudate is disposed radially outwardly of the core extrudate to form a preencapsulated core extrudate having a non-uniform layer thickness; (e) extruding an inner layer extrudate and an outer layer extrudate; (f) feeding the preencapsulated ore extrudate through a distribution manifold to a coextrusion die, the distribution manifold designed to overlap opposing longitudinally extending edges; and (g) forming a multilayer blown film having the inner layer extrudate disposed radially inwardly of the preencapsulated core extrudate and the outer layer extrudate disposed radially outwardly of the preencapsulated core extrudate. In preferred embodiments the inner layer extrudate and the outer layer extrudate are joined to the preencapsulated core extrudate before, or alternatively while, the preencapsulated core extrudate is fed through the coextrusion die.

Co-Extruded, Multilayered Polyolefin-Based Backsheet For Electronic Device Modules

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US Patent:
8431235, Apr 30, 2013
Filed:
Nov 4, 2009
Appl. No.:
12/612169
Inventors:
Lih-Long Chu - Midland MI, US
John Naumovitz - Midland MI, US
Nichole E. Nickel - Midland MI, US
Assignee:
Dow Global Technologies LLC - Midland MI
International Classification:
B32B 27/00
B32B 27/08
B32B 27/30
C09K 19/00
US Classification:
428515, 428 11, 428500, 428520, 428522, 136252
Abstract:
Multilayer structures useful as a backsheet for an electronic device, e. g. , a photovoltaic cell, comprise (A) a top layer comprising a polyolefin resin, e. g. , ethylene vinyl acetate, and having a top facial surface and a bottom facial surface, (B) a tie layer comprising an adhesive, e. g. , an ethylene glycidyl methacrylate, having a top facial surface and a bottom facial surface, the top facial surface in adhering contact with the bottom facial surface of the top layer, and (C) a bottom layer comprising a polyolefin having at least one melting peak greater than 125 C. , e. g. , a polypropylene, and having a top facial layer and a bottom facial surface, the top facial surface in adhering contact with the bottom facial surface of the tie layer.

Electronic Device Module Comprising Polyolefin Copolymer

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US Patent:
8581094, Nov 12, 2013
Filed:
Sep 18, 2007
Appl. No.:
11/857208
Inventors:
Rajen M. Patel - Lake Jackson TX, US
Shaofu Wu - Sugarland TX, US
Mark T. Bernius - Midland MI, US
Mohamed Esseghir - Monroe Township NJ, US
Robert L. McGee - Midland MI, US
Michael H. Mazor - Midland MI, US
John Naumovitz - Midland MI, US
Assignee:
Dow Global Technologies, LLC - Midland MI
International Classification:
H02N 6/00
H01L 31/042
H01L 31/00
US Classification:
136259, 136251, 136256
Abstract:
An electronic device module comprising:.

Electronic Device Module Comprising Polyolefin Copolymer

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US Patent:
8592679, Nov 26, 2013
Filed:
Nov 2, 2012
Appl. No.:
13/667744
Inventors:
Shaofu Wu - Sugar Land TX, US
Mark T. Bernius - Midland MI, US
Mohamed Esseghir - Lawrenceville NJ, US
Robert L. McGee - Midland MI, US
Michael H. Mazor - Midland MI, US
John A. Naumovitz - Midland MI, US
Assignee:
Dow Global Technologies, LLC - Midland MI
International Classification:
H01L 31/042
H02N 6/00
H01L 31/00
US Classification:
136259, 136251, 136256
Abstract:
An electronic device module comprising:Typically, the polyolefin copolymer is an ethylene/∀-olefin copolymer. Optionally, the polymeric material can further comprise a vinyl silane and/or a scorch inhibitor, and the copolymer can remain uncrosslinked or be crosslinked.

Electronic Device Module Comprising An Ethylene Multi-Block Copolymer

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US Patent:
20080115825, May 22, 2008
Filed:
Sep 18, 2007
Appl. No.:
11/857195
Inventors:
Rajen M. Patel - Lake Jackson TX, US
Shaofu Wu - Sugarland TX, US
Mark T. Bernius - Midland MI, US
Mohamed Esseghir - Monroe Township NJ, US
Robert L. McGee - Midland MI, US
Michael H. Mazor - Midland MI, US
John Naumovitz - Midland MI, US
International Classification:
H01L 31/00
US Classification:
136252
Abstract:
An electronic device module comprises:

Multicomponent Structures Having Improved Adhesion Between Components

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US Patent:
20080274245, Nov 6, 2008
Filed:
Apr 5, 2005
Appl. No.:
11/547486
Inventors:
Eric K.C. Lee - Midland MI, US
John A. Naumovitz - Midland MI, US
Mladen Ladika - Midland MI, US
International Classification:
B29C 65/14
B32B 27/36
B32B 27/30
B29C 47/08
B65D 81/34
B32B 7/10
B32B 1/08
US Classification:
426394, 428483, 428451, 428430, 428458, 428 343, 428 347, 428 361, 428 357, 264473, 1562757
Abstract:
The present invention includes a multicomponent structure comprising at least two components having a tie layer or adhesive layer directly between them, the tie layer comprising at least one olefin unsaturated ester copolymer and at least one photoinitiator and optionally a crosslinking enhancer. The tie layer is preferably irradiated with sufficient actinic radiation to result in increased interlayer adhesion strength between the two components as compared with the interlayer adhesion strength before treatment with the actinic radiation or between the components having a tie layer of the same composition except without the added photoinitiator or crosslinking enhancer. Without the photoinitiator, optionally crosslinking enhancer, and radiation the interlayer adhesion of the components is preferably less than 55 N/m. At least one of the components (first component or layer) preferably comprises a halopolymer, more preferably vinylidene chloride polymer, most preferably at least a majority of a vinyl idene chloride polymer. In another embodiment, at least one component exhibits interlayer adhesion strength similar to vinylidene chloride polymers. The structure optionally is or comprises such structures as a multilayer film, bag, or package, a lined or composite pipe, or other structure having more than one component. The tie layer is advantageously irradiated with an amount of UV light effective to increase the adhesion strength between the first and second components.

Electronic Device Module Comprising Polyolefin Copolymer With Low Unsaturation And Optional Vinyl Silane

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US Patent:
20110290317, Dec 1, 2011
Filed:
May 26, 2011
Appl. No.:
13/116520
Inventors:
John Naumovitz - Midland MI, US
Rajen M. Patel - Lake Jackson TX, US
Shaofu Wu - Sugar Land MI, US
Debra H. Niemann - Lake Jackson TX, US
International Classification:
H01L 31/0216
US Classification:
136256
Abstract:
An electronic device module comprising:

Electronic Device Module Comprising Heterogeneous Polyolefin Copolymer And Optionally Silane

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US Patent:
20130087198, Apr 11, 2013
Filed:
Jun 15, 2011
Appl. No.:
13/703405
Inventors:
John A. Naumovitz - Midland MI, US
Debra H. Niemann - Lake Jackson TX, US
Rajen M. Patel - Lake Jackson TX, US
Shaofu Wu - Sugar Land TX, US
International Classification:
H01L 31/0203
H05K 1/03
US Classification:
136259, 361746
Abstract:
An electronic device module comprising:
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John A Naumovitz from Midland, MI, age ~60 Get Report