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John S Guzek

from Chandler, AZ
Age ~50
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Also known as:
John G Guzek, John A Guzek, Jonh S Guzek, John K
Phone and address:
4330 S Pleasant Ct, Chandler, AZ 85248
(480) 225-1699
Connected to:
Carol E Guzek, 78Christopher E Guzek, 65Craig G Guzek, 53Derrick J Guzek, 45Donna M Guzek, 66Frank S Guzek, 51James J Guzek, 38Maciej Guzek, 51Mustafa Guzel, 52Walter B Guzel, 69

John Guzek Phones & Addresses

  • 4330 S Pleasant Ct, Chandler, AZ 85248 (480) 225-1699
  • 5424 Mesquite Bosque Way, Tucson, AZ 85704 (520) 408-8278
  • Boston, MA
  • Tempe, AZ
  • Somerset, NJ
  • Newton, MA
  • 4330 S Pleasant Ct, Chandler, AZ 85248 (480) 802-4592

Work

Position: Professional/Technical

Education

Degree: Associate degree or higher

Professional Records

License Records

John O Guzek

License #:
28541 - Active
Category:
EMS Licensing
Issued Date:
Jun 30, 2016
Expiration Date:
Jun 30, 2018
Type:
EMT-Intermediate Technician (AEMT)

John Robert Guzek

License #:
MT006398T - Expired
Category:
Medicine
Type:
Graduate Medical Trainee

Publications

Us Patents

Integrated Circuit Package With Low Modulus Layer And Capacitor/Interposer

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US Patent:
7042077, May 9, 2006
Filed:
Apr 15, 2004
Appl. No.:
10/825400
Inventors:
Michael J. Walk - Mesa AZ, US
Hamid Azimi - Chandler AZ, US
John S. Guzek - Chandler AZ, US
Charan K. Gurumurthy - Chandler AZ, US
Assignee:
Intel Corporation - Santa Clara CA
International Classification:
H01L 23/02
US Classification:
257686, 257778, 438109
Abstract:
A system may include a coreless substrate, a layer of material attached to the substrate, the layer of material having a lower elastic modulus than the substrate, an interposer coupled to the layer of material, and a capacitive layer coupled to the interposer.

Forming A Substrate Core With Embedded Capacitor And Structures Formed Thereby

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US Patent:
7224571, May 29, 2007
Filed:
Sep 2, 2005
Appl. No.:
11/218357
Inventors:
Sriram Srinivasan - Chander AZ, US
John S. Guzek - Chandler AZ, US
Cengiz A. Palanduz - Chandler AZ, US
Victor Prokofiev - Phoenix AZ, US
Joel A. Auernheimer - Phoenix AZ, US
Assignee:
Intel Corporation - Santa Clara CA
International Classification:
H01G 4/228
US Classification:
3613063, 361311, 361313, 3613061, 3613211, 3613214
Abstract:
Methods of forming a microelectronic structure are described. Embodiments of those methods include forming a substrate core by attaching a first dielectric layer to a second conductive layer of a thin film capacitor, and attaching a second dielectric layer to a first conductive layer of the thin film capacitor.

Organic Substrates With Integral Thin-Film Capacitors, Methods Of Making Same, And Systems Containing Same

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US Patent:
7288459, Oct 30, 2007
Filed:
Mar 31, 2005
Appl. No.:
11/095917
Inventors:
John S. Guzek - Chandler AZ, US
Victor Prokofiev - Phoenix AZ, US
Assignee:
Intel Corporation - Santa Clara CA
International Classification:
H01L 21/20
US Classification:
438381, 257532
Abstract:
An organic substrate, thin-film capacitor composite includes two plates that are accessed through deep and shallow vias. The organic substrate, thin-film capacitor composite includes integral structure with at least one trace in the organic substrate. The composite is able to be coupled with an interposer. The composite is also part of computing system.

Organic Substrates With Embedded Thin-Film Capacitors, Methods Of Making Same, And Systems Containing Same

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US Patent:
7372126, May 13, 2008
Filed:
Mar 31, 2005
Appl. No.:
11/096235
Inventors:
John S. Guzek - Chandler AZ, US
Cengiz A. Palanduz - Chandler AZ, US
Victor Prokofiev - Phoenix AZ, US
Assignee:
Intel Corporation - Santa Clara CA
International Classification:
H01L 29/00
US Classification:
257532, 257535, 257E27048
Abstract:
A thin-film capacitor assembly includes two plates that are accessed through deep and shallow vias. The thin-film capacitor assembly is able to be coupled with a spacer and an interposer. The thin-film capacitor assembly is also able to be stacked with a plurality of thin-film capacitor assemblies. The thin-film capacitor assembly is also part of computing system.

Method Of Providing Solder Bumps Of Mixed Sizes On A Substrate Using A Sorting Mask And Bumped Substrate Formed According To The Method

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US Patent:
7485563, Feb 3, 2009
Filed:
Jun 29, 2006
Appl. No.:
11/478751
Inventors:
Mengzhi Pang - Phoenix AZ, US
John Guzek - Chandler AZ, US
Assignee:
Intel Corporation - Santa Clara CA
International Classification:
H01L 21/44
US Classification:
438613, 438612, 257738, 257779, 257780
Abstract:
A method of providing electrically conductive bumps on electrode pads of a microelectronic substrate, and bumped substrate formed according to the method. The method includes: providing a microelectronic substrate including electrode pads; providing a sorting mask defining first openings and second openings therethrough, the second openings being larger than the first openings; disposing the mask onto the substrate such that the first openings and second openings register with respective ones of the electrode pads; providing first solder portions onto corresponding ones of the electrode pads through the first openings, and second solder portions onto corresponding ones of the electrode pads through the second openings, the second solder portions being larger than the first solder portions; reflowing the solder portions to form, respectively first solder bumps and second solder bumps on respective ones of the electrode pads; and removing the mask after providing solder portions and before reflowing.

Integrated Thin Film Capacitors With Adhesion Holes For The Improvement Of Adhesion Strength

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US Patent:
7525140, Apr 28, 2009
Filed:
Dec 14, 2005
Appl. No.:
11/304649
Inventors:
Yongki Min - Phoenix AZ, US
John Guzek - Chandler AZ, US
Assignee:
Intel Corporation - Santa Clara CA
International Classification:
H01L 27/108
H01L 29/76
H01L 29/94
H01L 31/119
US Classification:
257296, 257300, 257303, 257306, 257307, 257E27114
Abstract:
In an embodiment, a substrate includes a thin film capacitor embedded within. In an embodiment, a plurality of adhesion holes extend through the thin film capacitor. These adhesion holes may improve the adhesion of the capacitor to other portions of the substrate.

Method Of Providing Mixed Size Solder Bumps On A Substrate Using A Solder Delivery Head

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US Patent:
7569471, Aug 4, 2009
Filed:
Jun 29, 2006
Appl. No.:
11/479625
Inventors:
Mengzhi Pang - Phoenix AZ, US
John Guzek - Chandler AZ, US
Assignee:
Intel Corporation - Santa Clara CA
International Classification:
H01L 21/44
US Classification:
438612, 438613, 257E21508, 257738, 257779
Abstract:
A method of providing electrically conductive bumps on electrode pads of a microelectronic substrate, and bumped substrate formed according to the method. The method includes: providing a substrate including first electrode pads and second electrode pads thereon, the first electrode pads exhibiting a first pattern, and the second electrode pads exhibiting a second pattern different from the first pattern; attaching first solder portions to a solder delivery head according to the first pattern, and second solder portions to a solder delivery head according to the second pattern, the second solder portions being larger than the first solder portions; after attaching, releasing the first solder portions onto the first electrode pads, and the second solder portions onto the second electrode pads; after releasing, reflowing the first solder portions and second solder portions to form, respectively, first solder bumps and second solder bumps on the electrode pads.

Organic Substrates With Embedded Thin-Film Capacitors, Methods Of Making Same, And Systems Containing Same

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US Patent:
7636231, Dec 22, 2009
Filed:
Mar 26, 2008
Appl. No.:
12/055467
Inventors:
John S. Guzek - Chandler AZ, US
Cengiz A. Palanduz - Chandler AZ, US
Victor Prokofiev - Phoenix AZ, US
Assignee:
Intel Corporation - Santa Clara CA
International Classification:
H01G 4/06
US Classification:
361311, 361312, 361313, 3613212, 3613014, 3613062
Abstract:
A thin-film capacitor assembly includes two plates that are accessed through deep and shallow vias. The thin-film capacitor assembly is able to be coupled with a spacer and an interposer. The thin-film capacitor assembly is also able to be stacked with a plurality of thin-film capacitor assemblies. The thin-film capacitor assembly is also part of computing system.
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John S Guzek from Chandler, AZ, age ~50 Get Report