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John E Golombeck

from Eldersburg, MD
Age ~48
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Also known as:
John Edward Golombeck, John C Golombeck, John F Golombeck, John Edward Golomb, Ohn Golombeck, Golombeck Ohn
Related to:
James Hyrum Cook, 53
Connected to:
Aaron G Golombek, 39Benjamin Golombek, 31Dennis G Golombek, 80Fabio Golombek, 65Klaus L Golombek, 93Kristi A Golombeski, 40Peggy S Golombisky, 67David B Golombowski, 67Casey J Golomski, 41Ryan R Golomski, 50

John Golombeck Phones & Addresses

  • Eldersburg, MD
  • 1940 Blacksmith Dr, Marriottsville, MD 21104 (443) 609-4005
  • 6439 Sedgwick St, Elkridge, MD 21075 (410) 796-1232
  • Carroll, MD
  • 7203 Sleep Soft Cir, Columbia, MD 21045
  • Marriottsvl, MD

Work

Company: Northrop grumman corporation Position: Senior program director

Education

Degree: Masters School / High School: The Johns Hopkins University 1999 to 2001 Specialities: Electronics Engineering

Skills

Systems Engineering • Earned Value Management • Dod • Program Management • Radar • Engineering • Security Clearance • Proposal Writing • Requirements Management • Antennas • Rf Engineering • Technical Leadership • Cross Functional Team Leadership • Organizational Leadership • Functional Management • Product Development • Product Management • Fire Control Systems • Aesa • Engineering Management • Aerospace • Integration • Testing • Process Improvement • Rf • Leadership • Project Management • Simulations • System Architecture • Management • Systems Design • Electrical Engineering • Defense • Matlab • Electronics • U.s. Department of Defense • Esm • Ewm

Languages

English • Spanish

Interests

Children

Industries

Defense & Space

Resumes

Resumes

John Golombeck Photo 1

Senior Program Director

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Location:
3243 Joy Ln, The Villages, FL
Industry:
Defense & Space
Work:
Northrop Grumman Corporation
Senior Program Director
Education:
The Johns Hopkins University 1999 - 2001
Masters, Electronics Engineering Penn State University 1994 - 1998
Bachelors, Electronics Engineering
Skills:
Systems Engineering
Earned Value Management
Dod
Program Management
Radar
Engineering
Security Clearance
Proposal Writing
Requirements Management
Antennas
Rf Engineering
Technical Leadership
Cross Functional Team Leadership
Organizational Leadership
Functional Management
Product Development
Product Management
Fire Control Systems
Aesa
Engineering Management
Aerospace
Integration
Testing
Process Improvement
Rf
Leadership
Project Management
Simulations
System Architecture
Management
Systems Design
Electrical Engineering
Defense
Matlab
Electronics
U.s. Department of Defense
Esm
Ewm
Interests:
Children
Languages:
English
Spanish

Publications

Us Patents

Microchannel Cooling Of High Power Semiconductor Devices

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US Patent:
58014420, Sep 1, 1998
Filed:
Jul 22, 1996
Appl. No.:
8/681207
Inventors:
Robin E. Hamilton - Millersville MD
Paul G. Kennedy - Grasonville MD
John Ostop - Severna Park MD
Martin L. Baker - Sykesville MD
Gregory A. Arlow - Eldersburg MD
John C. Golombeck - Gambrills MD
Thomas J Fagan - Pittsburgh PA
Assignee:
Northrop Grumman Corporation - Los Angeles CA
International Classification:
H01L 2334
US Classification:
257714
Abstract:
Cooling of densely packaged semiconductor devices is achieved by microchannels which extract heat by forced convection and the use of fluid coolant located as close as possible to the heat source. The microchannels maximize heat sink surface area and provides improved heat transfer coefficients, thereby allowing a higher power density of semiconductor devices without increasing junction temperature or decreasing reliability. In its preferred embodiment, a plurality of microchannels are formed directly in the substrate portion of a silicon or silicon carbide chip or die mounted on a ground plane element of a circuit board and where a liquid coolant is fed to and from the microchannels through the ground plane. The microchannels comprise a plurality of closed-ended slots or grooves of generally rectangular cross section. Fabrication methods include deposition and etching, lift-off processing, micromachining and laser cutting techniques.

Method Of Extracting Heat From A Semiconductor Body And Forming Microchannels Therein

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US Patent:
59982403, Dec 7, 1999
Filed:
May 4, 1998
Appl. No.:
9/071776
Inventors:
Robin E. Hamilton - Millersville MD
Paul G. Kennedy - Grasonville MD
John Ostop - Severna Park MD
Martin L. Baker - Sykesville MD
Gregory A. Arlow - Eldersburg MD
John C. Golombeck - Gambrills MD
Thomas J. Fagan - Pittsburgh PA
Assignee:
Northrop Grumman Corporation - Los Angeles CA
International Classification:
H01L 2144
US Classification:
438122
Abstract:
Cooling of densely packaged semiconductor devices is achieved by microchannels which extract heat by forced convection and the use of fluid coolant located as close as possible to the heat source. The microchannels maximize heat sink surface area and provides improved heat transfer coefficients, thereby allowing a higher power density of semiconductor devices without increasing junction temperature or decreasing reliability. In its preferred embodiment, a plurality of microchannels are formed directly in the substrate portion of a silicon or silicon carbide chip or die mounted on a ground plane element of a circuit board and where a liquid coolant is fed to and from the microchannels through the ground plane. The microchannels comprise a plurality of closed-ended slots or grooves of generally rectangular cross section. Fabrication methods include deposition and etching, lift-off processing, micromachining and laser cutting techniques.
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John E Golombeck from Eldersburg, MD, age ~48 Get Report