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John W Gipprich

from Millersville, MD
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Also known as:
J Gipprich
Phone and address:
317 Beech Grove Ct, Millersville, MD 21108
(410) 987-5643
Related to:
Matthew J Swafford, 50Connie E Swafford, 64Daniel E RaskAnthony P Bruno, 59Lavern A Gipprich, 83Daniel A Higham, 66Jo Ann Rask, 83Harold L Swafford, 54Jenneken V Vankeppel, 56
Connected to:
Carmela R Gipprich, 78Philip A Gipprich, 69Veronica S Gipps, 64Don Gips, 78Ajaysie T Gipson, 38Alexis A Gipson, 33Allana V Gipson, 49Alverteen Gipson, 87Ameeya Gipson, 44Amina N Gipson, 46

John Gipprich Phones & Addresses

  • 317 Beech Grove Ct, Millersville, MD 21108 (410) 987-5643
  • Reisterstown, MD
  • Glen Burnie, MD
  • 309 Highmeadow Rd, Reisterstown, MD 21136

Resumes

Resumes

John Gipprich Photo 1

John Gipprich

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Location:
317 Beech Grove Ct, Millersville, MD 21108
Industry:
Defense & Space
Work:
Formally With Northrop Grumman
Retired Consulting Engineer
Education:
The Johns Hopkins University 1960 - 1971
Masters, Electrical Engineering, Electronics Engineering, Electronics
Skills:
Microsoft Office
Microsoft Word
Microsoft Excel
Powerpoint
Leadership
Research
Program Management
Project Planning
Team Leadership
Engineering
Analysis
Team Building
Interests:
Football
Exercise
Sweepstakes
Home Improvement
Donor
Reading
Gourmet Cooking
Sports
Golf
Food
Home Decoration
Health
Watching Sports
Photograph
Cooking
Electronics
Baseball
Crafts
Fitness
Music
Dogs
Family Values
Movies
Collecting
Christianity
Medicine
Diet
Cats
Walking
Travel
Wine
Watching Baseball
Investing
Traveling
Self Improvement
Watching Football
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John Gipprich

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John Gipprich

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Publications

Us Patents

Embedded Ridge Waveguide Filters

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US Patent:
6535083, Mar 18, 2003
Filed:
Sep 4, 2001
Appl. No.:
09/944599
Inventors:
Michael A. Hageman - Millersville MD
John W. Gipprich - Millersville MD
Kawthar Zaki - Potomac MD
Assignee:
Northrop Grumman Corporation - Los Angeles CA
International Classification:
H01P 1208
US Classification:
333210, 333208
Abstract:
A ridge waveguide filter which is formed of metallized blind vias in a plurality of contiguous layers of a dielectric medium including low temperature cofired ceramic (LTCC), high temperature cofired ceramic (HTCC) or organic printed wiring boards (PWB) in the fabrication of the waveguide sidewalls and solid ground planes to provide top and bottom walls as well as in the formation of a plurality of ridge waveguide sections in an embedded ridge waveguide structure. Patterns of conductive metal are selectively printed on the outer surface of certain dielectric layers to electrically short all the vias in the ridge waveguide sections and the adjacent wall vias so that the elements behave as though they comprise a solid metal structure.

Phased Array Antenna For Space Based Radar

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US Patent:
6686885, Feb 3, 2004
Filed:
Aug 9, 2002
Appl. No.:
10/214767
Inventors:
Ty L. Barkdoll - Columbia MD
John W. Gipprich - Millersville MD
Bradley L. McCarthy - Baltimore MD
Robert Q. Wenerick - Severn MD
Benjamin R. Myers - Columbia MD
Charles R. Robinson - Pasadena MD
Assignee:
Northrop Grumman Corporation - Los Angeles CA
International Classification:
H01P 118
US Classification:
343700MS, 342372
Abstract:
A phased array antenna tile which is steered by microelectromechanical system (MEMS) switched time delay units (TDUs) in an array architecture which reduces the number of amplifiers and circulators needed for implementing an active aperture electronically scanned array antenna so as to minimize DC power consumption, cost and mass of the system, making it particularly adaptable for airborne and spaceborne radar applications.

Dual Band Quadpack Transmit/Receive Module

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US Patent:
7728771, Jun 1, 2010
Filed:
Jul 3, 2007
Appl. No.:
11/773105
Inventors:
Michael J. Lee - Ellicott City MD, US
Eric V. Miller - Phoenix MD, US
Joseph A. Faulkner - Ellicott City MD, US
Cynthia W. Berry - Pasadena MD, US
Gene A. Digennaro - Dundalk MD, US
Kerron R. Duncan - Randallstown MD, US
Ronald G. Freitag - Catonsville MD, US
Tapan K. Gupta - Ellicott City MD, US
Vincent G. Karasack - Ellicott City MD, US
Dave M. Krafcsik - Crownsville MD, US
Brian T. McMonagle - Ellicott City MD, US
Robert B. Middleton - Laurel MD, US
Benjamin R. Myers - Columbia MD, US
Mike L. Salib - Millersville MD, US
John P. Vitamvas - Columbia MD, US
Thomas M. Walsh - Bowie MD, US
Eric D. Zirofsky - Washington DC, US
John W. Gipprich - Millersville MD, US
Assignee:
Northrop Grumman Systems Corporation - Los Angeles CA
International Classification:
H01Q 3/36
US Classification:
342368
Abstract:
A multi-channel, dual-band, radio frequency (RF) transmit/receive (T/R) module, for an active electronically scanned array, is provided. The module includes a compact, RF manifold connector and at least four T/R channels. Each of the T/R channels includes a notch radiator, a diplexer coupled to the notch radiator, a power amplifier, including at least one dual-band gain stage, coupled to the notch radiator, a low noise amplifier, including at least one lower-band gain stage and at least one upper-band gain stage, coupled to the diplexer, and a T/R cell, including a phase shifter, a signal attenuator and at least one dual-band gain stage, coupled to the power amplifier, the low noise amplifier and the manifold connector.

Dual Channel Microwave Transmit/Receive Module For An Active Aperture Of A Radar System

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US Patent:
62784005, Aug 21, 2001
Filed:
Nov 29, 1999
Appl. No.:
9/450905
Inventors:
John W. Cassen - Sykesville MD
Edward L. Rich - Arnold MD
Gary N. Bonadies - Laurel MD
John S. Fisher - Ellicott City MD
John W. Gipprich - Millersville MD
John D. Gornto - Columbia MD
Daniel J. Heffernan - Pasadena MD
David A. Herlihy - Ellicott City MD
Scott C. Tolle - Baltimore MD
Patrick K. Richard - Baltimore MD
David W. Strack - Baltimore MD
Scott K. Suko - Elkridge MD
Timothy L. Eder - Glen Burnie MD
Chad E. Wilson - Redmond WA
Gary L. Ferrell - Pasadena MD
Stephanie A. Parks - Virginia Beach VA
Assignee:
Northrop Grumman Corporation - Los Angeles CA
International Classification:
G01S 728
US Classification:
342175
Abstract:
Two discrete transmit/receive (T/R) channels are implemented in a single common T/R module package having the capability of providing combined functions, control and power conditioning while utilizing a single multi-cavity, multi-layer substrate comprised of high or low temperature cofired ceramic layers. The ceramic layers have outer surfaces including respective metallization patterns of ground planes and stripline conductors as well as feedthroughs or vertical vias formed therein for providing three dimensional routing of both shielded RF and DC power and logic control signals so as to configure, among other things, a pair of RF manifold signal couplers which are embedded in the substrate and which transition to a multi-pin blind mate press-on RF connector assembly at the front end of the package. DC and logic input/output control signals are connected to a plurality of active circuit components including application specific integrated circuits (ASICs) and monolithic microwave integrated circuit chips (MMICs) via spring contact pads at the rear of the package. An RF connector assembly for coupling transmit and receive signals to and from the module is located at the front of the package.

Clutter Positioning For Electronically Agile Multi-Beam Radars

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US Patent:
45860440, Apr 29, 1986
Filed:
Jan 24, 1983
Appl. No.:
6/460688
Inventors:
Francis W. Hopwood - Severna Park MD
John W. Gipprich - Catonsville MD
Assignee:
Westinghouse Electric Corp. - Pittsburgh PA
International Classification:
G01S 1352
US Classification:
343 77
Abstract:
An electronically agile multi-beam radar including a clutter positioning system for positioning the band of clutter signals in the derived doppler frequency spectrum of each of the individual beams is disclosed. The radar is operative to switchedly transmit a plurality of beams directionally separated by time sharing the illuminating power thereof. Each beam includes at least one transmission of a plurality of R. F. pulses constituting a radar look. The radar is also operative to receive echo R. F. pulses of the look from each transmitted beam dispersed in time with echo R. F. pulses of the looks of the other transmitted beams of the plurality. The clutter positioning system operates to maintain substantially a desired pulse-to-pulse phase relationship for the received plurality of echo pulses of each look of each beam in a time-shared manner in order to derive a substantially representative pulse doppler spectrum of signals associated with each look of the transmitted beams and to adaptively position an identified group of clutter signals about a prespecified dopper frequency in a derived doppler frequency spectrum for each look of each beam. The clutter positioning system may be disposed in either the transmission portion or the reception portion of the radar in which case it effects substantially the desired pulse-to-pulse phase relationship at each transmitted or received R. F. pulsed beam, respectively.

Double Sideband Generation With Serrodyne Modulators

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US Patent:
46546081, Mar 31, 1987
Filed:
Feb 3, 1986
Appl. No.:
6/825107
Inventors:
Ronald W. Minarik - Lutherville MD
Frederick H. Harris - Crofton MD
John W. Gipprich - Millersville MD
Assignee:
The United States of America as represented by the Secretary of the Air
Force - Washington DC
International Classification:
H03C 152
US Classification:
332 44
Abstract:
A double sideband suppressed carrier modulator apparatus for combining two serrodyne (i. e. , single sideband) modulators to achieve double sideband, suppressed carrier modulation. An RF input signal is divided into two carrier signals which are 90 degrees out of phase and applied to the serrodyne modulator units. The modulated signals from the modulators are combined in a 90 degree power divider to provide a double sideband suppressed carrier modulated output signal.

Motion Insensitive Phase Compensated Coaxial Connector

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US Patent:
53271114, Jul 5, 1994
Filed:
Sep 16, 1992
Appl. No.:
7/945567
Inventors:
John W. Gipprich - Millersville MD
Assignee:
Westinghouse Electric Corp. - Pittsburgh PA
International Classification:
H01P 104
US Classification:
333260
Abstract:
In a motion insensitive coaxial cylindrical connector a male member has a substantially cylindrical body having a male or diameter and a substantially cylindrical stub having a minor diameter which stub extends from the body of the male member. The stub fits into a dielectric sleeve within a cavity in a female member. Preferably, the dielectric sleeve has two portions made of different dielectric materials.

Dual Channel Microwave Transmit/Receive Module For An Active Aperture Of A Radar System

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US Patent:
60941618, Jul 25, 2000
Filed:
Dec 8, 1999
Appl. No.:
9/456407
Inventors:
John W. Cassen - Sykesville MD
Stephanie A. Parks - Helston, GB
Edward L. Rich - Arnold MD
Gary N. Bonadies - Laurel MD
Gary L. Ferrell - Pasadena MD
John S. Fisher - Ellicott City MD
John W. Gipprich - Millersville MD
John D. Gornto - Columbia MD
Daniel J. Heffernan - Severna Park MD
David A. Herlihy - Ellicott City MD
Andrew J. Piloto - San Diego CA
Patrick K. Richard - Baltimore MD
David W. Strack - Baltimore MD
Scott K. Suko - Elkridge MD
Assignee:
Northrop Grumman Corporation - Los Angeles CA
International Classification:
G01S 728
US Classification:
342175
Abstract:
Two discrete transmit/receive (T/R) channels are implemented in a single common T/R module package having the capability of providing combined functions, control and power conditioning while utilizing a single multi-cavity, multi-layer substrate comprised of high temperature cofired ceramic (HTCC) layers. The ceramic layers have outer surfaces including respective metallization patterns of ground planes and stripline conductors as well as feedthroughs or vertical vias formed therein for providing three dimensional routing of both shielded RF and DC power and logic control signals so as to configure, among other things, a pair of RF manifold signal couplers which are embedded in the substrate and which transition to a multi-pin blind mate press-on RF connector assembly at the front end of the package. DC and logic input/output control signals are connected to a plurality of active circuit components including application specific integrated circuits (ASICs) and monolithic microwave integrated circuit chips (MMICs) via spring contact pads at the rear of the package. The MMICs which generate substantially all of the heat are located in multi-level cavities formed in the substrate and are bonded directly to a generally flat a heat sink plate which is secured to the bottom of the substrate and acts as a thermal interface to an external heat exchanger such as a cold plate.
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John W Gipprich from Millersville, MD Get Report