John E Geiger

20130048342, Feb 28, 2013

Aug 23, 2011

13/215912

CHARLES RANDALL MALSTROM - LEBANON PA, US
MARJORIE KAY MYERS - MOUNT WOLF PA, US
JOHN PATTON GEIGER - WAYNESBORO PA, US

TYCO ELECTRONICS CORPORATION - BERWYN PA

H05K 1/00
H05K 3/22

174250, 427 974

A circuit board includes a dielectric layer and sacrificial bumps on the dielectric layer in predetermined circuit common areas. A conductive seed layer is printed on the dielectric layer and the sacrificial bumps. A conductive circuit layer is plated onto the conductive seed layer. Sections of the conductive circuit layer and the conductive seed layer in the circuit common areas are removed. Optionally, the circuit board may include a metal substrate, with the dielectric layer applied on the metal substrate.

20140290058, Oct 2, 2014

Jun 10, 2014

14/301011

- Berwyn PA, US
Marjorie Kay Myers - Mount Wolf PA, US
John Patton Geiger - Waynesboro PA, US

H05K 3/04

29846

A method of manufacturing a circuit board includes providing a metal substrate and applying a dielectric layer to the metal substrate and sacrificial bumps on the dielectric layer. The method also includes printing a conductive seed layer on the dielectric layer and the sacrificial bumps and plating a conductive circuit layer onto the conductive seed layer. The method includes removing sections of the conductive seed layer and sections of the conductive circuit layer during a circuit common removal process