John J Ditri

6520400, Feb 18, 2003

Mar 30, 2001

09/822070

John Ditri - Huntingdon Valley PA

Kulicke Soffa Investments, Inc. - Wilmington DE

B23K 3102

2281805, 228 45

A device and method for providing tension and a reserve wire reservoir to a bonding wire for use with a bonding machine. The device includes an outlet port providing fluid under pressure, and a surface along which the pressurized fluid flows in a direction away from the outlet port such that the bonding wire follows a path along the surface and the pressurized fluid places a uni-directional tension on the bonding wire while maintaining a reserve portion of wire in a slack loop.

8302596, Nov 6, 2012

Oct 22, 2009

12/604055

David Velasco - Mount Laurel NJ, US
John Ditri - Huntingdon Valley PA, US
Nancy E. Wasson - Mount Laurel NJ, US
David S. Munsky - New York NY, US
Mark Trent - Cambridge, CA

Lockheed Martin Corporation - Bethesda MD

F24J 2/46
C03C 3/118
C03C 3/091
C03C 3/085

126712, 126704, 126713, 501 59, 501 66, 501 69

A matched glass-to-metal connecting device for use in a vacuum tube collector for a solar energy collecting apparatus is made of a glass envelope and a metal sleeve directly bonded to the glass envelope. The glass envelope is made of a glass having a composition, in percent by weight on the basis of oxide content, consisting essentially of BO, 19; AlO, 8; NaO, 2; KO, 3; BaO, 3; LiF, 1; and balance of SiOand the metal sleeve consists of metal material number 1. 3981 of DIN 17745. The glass envelope has a thermal expansion coefficient that deviates from the metal part's thermal expansion coefficient by no more than 4% in the temperature range from 25 C. to 350 C.

20190181071, Jun 13, 2019

Feb 15, 2019

16/277510

- Bethesda MD, US
John Ditri - Huntingdon Valley PA, US
Joseph W. Hahn - Erial NJ, US
Michael K. McNulty - Cherry Hill NJ, US

H01L 23/46
F28D 15/00
H01L 23/473

An electronic chip package includes a base defining a fluid inlet opening for receiving pressurized fluid from a fluid source and a fluid outlet opening. A dielectric body is arranged on the base and configured to support an electronic device. The dielectric body comprises a coolant flow chamber formed in a first surface thereof, and a plurality of impingement openings formed within the coolant flow chamber. The plurality of impingement openings are in communication with the fluid inlet opening of the base for generating a plurality of fluid streams to be expelled into the coolant flow chamber. The body further comprises a coolant return port formed within the coolant flow chamber and in communication with the fluid outlet opening of the base.