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John R Cennamo

from Laconia, NH
Age ~62
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Also known as:
John A Cennamo
Phone and address:
57 Irish Setter Ln, Laconia, NH 03249
(603) 527-0197
Related to:
Denise M Novak, 72Gregory S Levasseur, 42
Connected to:
Anne L Cennamo, 63Carmela Cennamo, 107Carol M Cennamo, 62James D Cennamo, 53Kathi C Cennamo, 70Michele I Cennamo, 77Anthony R Cenneno, 63Lisa M Cenneno, 62Adrian Cenni, 55Kimberly A Cennimo, 54

John Cennamo Phones & Addresses

  • 57 Irish Setter Ln, Gilford, NH 03249 (603) 527-0197 (603) 556-7496
  • Laconia, NH
  • Trumbull, CT
  • 30 Stoneheights Dr, Waterford, CT 06385
  • Newtown, CT
  • 57 Irish Setter Ln, Gilford, NH 03249 (603) 527-0197

Work

Company: Aavid thermalloy Jan 1995 Position: Aavid certified design engineer

Education

Degree: Master of Business Administration, Masters School / High School: University of New Haven 1989 to 1995 Specialities: Business Administration, Marketing

Skills

Mechancal Cad Design • Thermal Analysis • Thermal Design

Industries

Mechanical Or Industrial Engineering

Resumes

Resumes

John Cennamo Photo 1

Aavid Certified Design Engineer

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Location:
Laconia, NH
Industry:
Mechanical Or Industrial Engineering
Work:
Aavid Thermalloy
Aavid Certified Design Engineer
The Lee Company 1989 - 1994
Applications Engineer
Naval Underwater Systems Center 1987 - 1989
Electrical Engineer
Education:
University of New Haven 1989 - 1995
Master of Business Administration, Masters, Business Administration, Marketing University of Connecticut 1980 - 1985
Bachelors, Bachelor of Science, Electrical Engineering The University of Connecticut
Skills:
Mechancal Cad Design
Thermal Analysis
Thermal Design

Publications

Us Patents

Fluid-Containing Cooling Plate For An Electronic Component

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US Patent:
7306027, Dec 11, 2007
Filed:
Jul 1, 2004
Appl. No.:
10/883450
Inventors:
Bradley R. Whitney - Boscawen NH, US
Randolph H. Cook - Gilford NH, US
John R. Cennamo - Gilford NH, US
Sukhvinder S. Kang - Rochester MN, US
Assignee:
Aavid Thermalloy, LLC - Concord NH
International Classification:
F28F 7/00
H05K 7/20
US Classification:
165 804, 165170, 16510421
Abstract:
A fluid-containing cooling plate includes a bottom plate, a top plate, and metal wire or tubing formed into a circuit and sandwiched between the plates to form a chamber. The wire is plated or otherwise coated with a brazeable or solderable alloy which bonds it to the plates when the assembly is heated, thereby sealing the chamber. To make a two-phase cooling plate, slugs of plated metal are placed in the chamber and are bonded to the plates to provide support against collapse. The chamber is provided with a wicking structure, and is partially filled with an evaporable fluid via an inlet. A partial vacuum is then drawn, and the inlet is closed off. To make a single-phase cooling plate, wire partitions serving as baffles are provided in lieu of the slugs. These partitions can be arranged to provide a serpentine flow path between the inlet and an outlet, and are likewise plated with an alloy which melts to bond them to the plates.

Liquid Cold Plate Heat Exchanger

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US Patent:
20060096738, May 11, 2006
Filed:
Feb 8, 2005
Appl. No.:
11/053098
Inventors:
Sukhvinder Kang - Rochester MN, US
John Cennamo - Gilford NH, US
International Classification:
H05K 7/20
US Classification:
165080400, 361699000
Abstract:
A heat exchanger includes a cooling plate having a heat collection surface for fixing against an object to be cooled, an opposed heat transfer surface which may be provided with fins, and a cooling chamber over the heat transfer surface, the cooling chamber having an inlet port and an outlet port for circulating a fluid through the cooling chamber via a flow path between the ports. A flow distributor in the flow path forms a plurality of inlet channels communicating with the inlet port, a plurality of outlet channels alternating with the inlet channels and communicating with the outlet port, and a plurality of flow surfaces which are spaced from the heat transfer surface by gaps. The inlet channels communicate with the gaps so that a fluid entering the inlet channels via the inlet port will flow through the gaps, into the outlet channels, and out of the chamber via the outlet port. The gaps are dimensioned to increase fluid velocity and promote mixing of the fluid, thereby improving heat transfer.

Spring Clip For Mounting A Heat Sink To An Electronic Component

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US Patent:
58702873, Feb 9, 1999
Filed:
Oct 7, 1997
Appl. No.:
8/946459
Inventors:
Raul M. Rodriguez - Manchester NH
John R. Cennamo - Gilford NH
Assignee:
Aavid Thermal Technologies, Inc. - Laconia NH
International Classification:
H05K 720
US Classification:
361704
Abstract:
A heat sink spring clip having a linearly displaceable deflection member that operatively engages a biasing member for thermally and mechanically connecting a heat sink to an electronic component. The deflection member is moveable in a generally linear manner on and relative to the biasing member between a first position of nonengagement in which the biasing member is substantially undeflected and a second position in which the biasing member is deflected and the deflection member is contactingly and operatively engaged with the heat sink for thermally and mechanically connecting the heat sink to an electronic component. As the deflection member is moved from the disengaged position to the engaged position, complementary elements on the biasing member and deflection member engage one another and cause portions of the deflection and biasing members to move relatively apart. As the biasing member deflects in one direction generally away from the heat sink, the biasing member simultaneously imparts a generally oppositely directed compression force onto the heat sink and electrical components adjacently stacked therebeneath through the deflection member. The deflection member is operatively moveable in a generally horizontal direction longitudinally on and along the biasing member or, in an alternate embodiment, in a direction substantially transverse to the elongation of the biasing member.

Spring Clip For Attaching An Electronic Component To A Heat Sink And An Assembly Utilizing The Same

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US Patent:
60794860, Jun 27, 2000
Filed:
Feb 26, 1998
Appl. No.:
9/031002
Inventors:
John Cennamo - Gilford NH
Keith T. Mandell - Rockwall TX
Assignee:
Aavid Thermal Technologies, Inc. - Laconia NH
International Classification:
F28F 700
US Classification:
165 803
Abstract:
A spring clip manufactured from a single piece of metal for attaching an electronic component to a heat sink for defining a heat dissipation assembly. The spring clip comprises a main body having a bend with a cantilever on one side of the bend and a mounting region terminating in an engaging edge on the other side of the bend. Outriggers project perpendicularly from both sides of the mounting region and extend beyond the engaging edge In the assembly outriggers project through slots in the heat sink and the electronic component is secured between one side of the heat sink and the engaging edge of the spring clip. The outriggers preferably include retaining members which abut the opposite side of the heat sink thereby resisting rotation of the spring clip relative to the heat sink.

Thermal Transfer Device With Reduced Vertical Profile

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US Patent:
20140345829, Nov 27, 2014
Filed:
May 27, 2011
Appl. No.:
14/119919
Inventors:
Sukhvinder S. Kang - Concord NH, US
John R. Cennamo - Gilford NH, US
Bradley R. Whitney - Epsom NH, US
Randolph H. Cook - Gilford NH, US
Assignee:
Aavid Thermalloy, LLC - Laconia NH
International Classification:
F25B 39/04
US Classification:
16510421
Abstract:
A thermal transfer device having a reduced vertical profile. The device includes a condenser with substantially vertical internal cooling fins. An inlet conducts a thermal transfer fluid in a vapor state to the tops of the cooling fins where the vapor condenses and flows down the fins to the bottom of the condenser. The bottom of the condenser is angled towards an outlet for conducting the liquid thermal transfer fluid to a reservoir for holding the fluid. The inlet and the outlet are both positioned at a height above the level of the thermal transfer fluid in liquid state in the reservoir. The device may also include fins on the exterior of the condenser for providing cooling surfaces which do not contact the thermal transfer fluid in either the liquid or vapor states.
Control profile
John R Cennamo from Laconia, NH, age ~62 Get Report