US Patent:
20110230973, Sep 22, 2011
Inventors:
Gregory M. Hippensteel - South Whitley IN, US
Lawrence F. Peek - Warsaw IN, US
Jeffrey P. Anderson - Warsaw IN, US
Devendra Gorhe - Warsaw IN, US
Steve M. Allen - Winona Lake IN, US
Clarence M. Panchison - Warsaw IN, US
David M. Miller - Warsaw IN, US
Joel G. Scrafton - Syracuse IN, US
Casey Harmon - Warsaw IN, US
International Classification:
A61F 2/28
B23K 20/00
B23K 31/02
Abstract:
Methods for bonding a porous tantalum structure to a substrate are provided. The method includes placing a compressible or porous interlayer between a porous tantalum structure and a cobalt or cobalt-chromium substrate to form an assembly. The interlayer comprising a metal or metal alloy that has solid state solubility with both the substrate and the porous tantalum structure. Heat and pressure are applied to the assembly to achieve solid state diffusion between the substrate and the interlayer and the between the porous tantalum structure and the interlayer.