US Patent:
20060038273, Feb 23, 2006
Inventors:
Jicun Lu - Rancho Cordova CA, US
Charles Gealer - Phoenix AZ, US
International Classification:
H01L 21/44
H01L 23/48
US Classification:
257686000, 438109000, 257690000
Abstract:
A stacked dice electronic package without spacers between the dice and where an overlying die is landed on wire bonds of the underlying die is disclosed.