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Jeremy Jon Schmitz

from Maple Plain, MN
Age ~52
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Also known as:
Jeremy J Schmitz, Jeremy K Schmitz, Jeremy Shmitz
Phone and address:
7850 County Road 26 APT 26, Maple Plain, MN 55359
(763) 234-9181
Related to:
Judith K Schmitz, 66Marsha R Frisque, 76Sarah R Frisque, 48Anthony R Frisque, 74Paul R Schmitzer, 53Sarah R Frisque, 42Jane B HewittSarah R Frisque, 50Kristyn A Hewitt, 58Clarice F Schmitz, 96James N Schmitz, 97Joan E Schmitz, 94Rosemary E Schmitz, 88
Connected to:
Aaron J Schmitz, 53Adrian E Schmitz, 43Allan W Schmitz, 49Andreas Schmitz, 56Arlene M Schmitz, 78Beau Schmitz, 32Benjamin S Schmitz, 47Bin Z Schmitz, 65Brad Schmitz, 67Brandon L Schmitz, 45

Jeremy Schmitz Phones & Addresses

  • 7850 County Road 26 APT 26, Maple Plain, MN 55359 (763) 234-9181
  • 3700 Lyndale Ave, Minneapolis, MN 55409 (612) 823-4858
  • Minnetrista, MN
  • Minnetonka, MN
  • Edina, MN
  • North Mankato, MN
  • San Diego, CA

Resumes

Resumes

Jeremy Schmitz Photo 1

General Manager

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Work:
Ruby Tuesday
General Manager
Jeremy Schmitz Photo 2

Sourcing And Procurement Manager -Travel

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Location:
Minneapolis, MN
Industry:
Hospitality
Work:
Unitedhealth Group
Sourcing and Procurement Manager -Travel
Sofitel Minneapolis Apr 2004 - Jan 2013
Director of Revenue Management
Doubletree By Hilton Mar 2003 - Apr 2004
Business Travel Sales Manager
Education:
University of Wisconsin - Stout 1997 - 2002
Bachelors, Bachelor of Science, General Business, Management
Jeremy Schmitz Photo 3

Jeremy Schmitz

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Jeremy Schmitz Photo 4

Jeremy Schmitz

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Publications

Us Patents

Method For Packaging Thermal Interface Materials

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US Patent:
20110186586, Aug 4, 2011
Filed:
Apr 12, 2011
Appl. No.:
13/084706
Inventors:
Radesh Jewram - Lakeville MN, US
William E. McIntosh - Northfield MN, US
Jeremy J. Schmitz - Minnetrista MN, US
International Classification:
B65D 90/12
B65B 1/04
US Classification:
220600, 53473
Abstract:
A package for delivery of a tacky product includes a carrier with a plurality of cavities separately disposed along a length and width thereof. Each of the cavities in the carrier tape includes a base that is sized to operably receive and support the product within the cavity. The base of each cavity includes a surface profile which defines a contact surface area that is sufficiently low so as to facilitate removal of the product from the cavity without damage to the product. In some cases, the contact surface area is less than about 50% of a base surface area of the base. The carrier may be configured to stack with other carriers without risk of damage to the tacky product.

Method For Packaging Thermal Interface Materials

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US Patent:
20130221014, Aug 29, 2013
Filed:
Apr 2, 2013
Appl. No.:
13/855268
Inventors:
The Bergquist Company - , US
William E. McIntosh - Northfield MN, US
Jeremy J. Schmitz - Minnetrista MN, US
Assignee:
The Bergquist Company - Chanhassen MN
International Classification:
B65D 25/00
US Classification:
220600
Abstract:
A package for delivery of a tacky product includes a carrier with a plurality of cavities separately disposed along a length and width thereof. Each of the cavities in the carrier tape includes a base that is sized to operably receive and support the product within the cavity. The base of each cavity includes a surface profile which defines a contact surface area that is sufficiently low so as to facilitate removal of the product from the cavity without damage to the product. In some cases, the contact surface area is less than about 50% of a base surface area of the base. The carrier may be configured to stack with other carriers without risk of damage to the tacky product.

Thermally Conductive Dielectric Interface

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US Patent:
20140374071, Dec 25, 2014
Filed:
Jun 20, 2014
Appl. No.:
14/310231
Inventors:
- Chanhassen MN, US
Jeremy J. Schmitz - Minnetrista MN, US
Jeremy L. Hammond - Stillwater MN, US
International Classification:
H05K 7/20
B23P 15/26
US Classification:
165133, 2989003
Abstract:
A thermally conductive dielectric interface includes a relatively hard polymer base, and a polymer upcoat disposed at first and second sides of the base. The upcoat has an intermediate condition that is relatively soft and facilitates thermal joints with respective components of an electronic assembly. Curing the upcoat layer to a finished condition solidifies such thermal joints.
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Jeremy Jon Schmitz from Maple Plain, MN, age ~52 Get Report