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Jeffrey Michael Klemovage

from Allentown, PA
Age ~64
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Also known as:
Jeffrey M Klemovage, Jeffrey K Klemovage, Jeff M Klemovage, Michelle Campbell
Phone and address:
251 Red Clover Ln, Allentown, PA 18104
(484) 560-8800
Related to:
Albert A BaranThomas Baran, 77Arnold HeicklenAngelique Baran, 51Thomas BirchAudrey Heicklen, 89
Connected to:
Carolyn D Klemow, 71Joanne Klemow, 67Aaron T Klemp, 52Christian Klemp, 33Christine L Klemp, 44Dennis C Klemp, 77Lieschen M Klemp, 34Roger P Klemp, 82Justin J Klempa, 45Sarah E Klempay, 42

Jeffrey Klemovage Phones & Addresses

  • 251 Red Clover Ln, Allentown, PA 18104 (484) 560-8800
  • 9067 Pathfinder Rd, Breinigsville, PA 18031 (610) 481-9582
  • 1120 Overlook Rd, Whitehall, PA 18052 (610) 439-1347
  • Lehighton, PA
  • 9067 Pathfinder Rd, Breinigsville, PA 18031 (610) 439-1347

Work

Position: Production Occupations

Education

Degree: High school graduate or higher

Publications

Us Patents

Integrated Circuit Device Having Flexible Leadframe

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US Patent:
7541220, Jun 2, 2009
Filed:
Dec 14, 2005
Appl. No.:
11/302690
Inventors:
Timothy Brooks Bambridge - Pittstown NJ, US
Jeffery J. Gilbert - Schwenksville PA, US
Juan Alejandro Herbsommer - Schnecksville PA, US
Jeffrey Michael Klemovage - Whitehall PA, US
Assignee:
Agere Systems Inc. - Allentown PA
International Classification:
H01L 21/44
US Classification:
438123, 438122, 438125, 257666, 257668, 257671, 257706
Abstract:
An integrated circuit device having a flexible leadframe, and techniques for fabricating the flexible leadframe and integrated circuit device, are provided. In one aspect of the invention, an integrated circuit device comprises a heat spreader having a top surface and a bottom surface. At least one integrated circuit die is attached to the top surface of the heat spreader. A flexible leadframe is also attached to the top surface of the heat spreader. The flexible leadframe has one or more flexible layers, including at least one flexible insulating layer. A plurality of electrically conductive traces are defined on the at least one flexible insulating layer.

Method Of Generating A Leadframe Ic Package Model, A Leadframe Modeler And An Ic Design System

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US Patent:
8370777, Feb 5, 2013
Filed:
Jun 16, 2009
Appl. No.:
12/485238
Inventors:
Stephen M. King - Hamburg PA, US
Jeffrey M. Klemovage - Breinigsville PA, US
John J. Krantz - Northampton PA, US
Allen S. Lim - Milpitas CA, US
Ashley Rebelo - Allentown PA, US
Richard J. Sergi - Bethlehem PA, US
Assignee:
LSI Corporation - Milpitas CA
International Classification:
G06F 9/455
G06F 17/50
US Classification:
716106, 716102, 716103, 716115, 716137, 716139, 257666, 257673, 438123, 361723
Abstract:
A method of generating a model of a leadframe IC package, a leadframe modeler and an IC design system are disclosed. In one embodiment the method includes: (1) adding connectivity information to a geometric representation of a leadframe, wherein the connectivity information represents electrical connections between the IC die and leads of the leadframe and (2) formatting the leads to represent BGA point of contacts for the IC die.

Method For Electrical Interconnection Between Printed Wiring Board Layers Using Through Holes With Solid Core Conductive Material

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US Patent:
8601683, Dec 10, 2013
Filed:
Apr 19, 2006
Appl. No.:
11/379256
Inventors:
Charles Cohn - Wayne NJ, US
Jeffrey M Klemovage - Whitehall PA, US
Assignee:
Agere Systems LLC - Wilmington DE
International Classification:
H05K 3/02
H05K 3/10
US Classification:
29846, 29829, 2281805, 228254
Abstract:
The present invention provides method of manufacture for a printed wiring board. The printed wiring board constructed according to the teachings of the present invention includes a printed wiring board dielectric layer having conductive foils located on at least two sides thereof. The printed wiring board further includes a solid core conductive material interconnecting the conductive foils.

Method For Electrical Interconnection Between Printed Wiring Board Layers Using Through Holes With Solid Core Conductive Material

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US Patent:
20050150682, Jul 14, 2005
Filed:
Jan 12, 2004
Appl. No.:
10/755616
Inventors:
Charles Cohn - Wayne NJ, US
Jeffrey Klemovage - Whitehall PA, US
Assignee:
Agere Systems Inc. - Allentown PA
International Classification:
H05K001/09
H05K001/11
US Classification:
174255000, 174262000, 174257000
Abstract:
The present invention provides a printed wiring board and a method of manufacture therefor. The printed wiring board constructed according to the teachings of the present invention includes a printed wiring board dielectric layer having conductive foils located on at least two sides thereof. The printed wiring board further includes a solid core conductive material interconnecting the conductive foils.

Integrated Circuit Device Having Flexible Leadframe

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US Patent:
20050224926, Oct 13, 2005
Filed:
Apr 1, 2004
Appl. No.:
10/816060
Inventors:
Timothy Bambridge - Pittstown NJ, US
Jeffery Gilbert - Schwenksville PA, US
Juan Herbsommer - Schnecksville PA, US
Jeffrey Klemovage - Whitehall PA, US
George Libricz - Bethlehem PA, US
International Classification:
H01L023/34
US Classification:
257666000
Abstract:
An integrated circuit device having a flexible leadframe, and techniques for fabricating the flexible leadframe and integrated circuit device, are provided. In one aspect of the invention, an integrated circuit device comprises a heat spreader having a top surface and a bottom surface. At least one integrated circuit die is attached to the top surface of the heat spreader. A flexible leadframe is also attached to the top surface of the heat spreader. The flexible leadframe has one or more flexible layers, including at least one flexible insulating layer. A plurality of electrically conductive traces are defined on the at least one flexible insulating layer.
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Jeffrey Michael Klemovage from Allentown, PA, age ~64 Get Report