Jeffrey T Gotro

8432036, Apr 30, 2013

Jan 15, 2010

12/657214

Eric L. Hanson - Carlsbad CA, US
Eric L. Bruner - San Diego CA, US
Jeffrey Gotro - Trabuco Canyon CA, US

Aculon, Inc. - San Diego CA

H01L 23/495
H01L 23/48
H01L 23/52
H01L 29/40

257753, 267666, 267690, 267734, 267E23018, 267E21514

A lead frame and an electronic package having improved adhesion between the lead frame and an encapsulating plastic material is disclosed. The lead frame can be pre plated having an outer layer comprising a precious metal such as palladium or gold to which is adhered a self-assembled monolayer (SAM), such as a SAM derived from an organophosphorus acid. The organophosphorus acid preferably is a mixture in which the organo groups are fluoro substituted hydrocarbons and hydrocarbons containing ethylenically unsaturated groups.

20020019464, Feb 14, 2002

Aug 10, 2001

09/928103

Marc Hein - Onalaska WI, US
Martin Choate - Onalaska WI, US
Nancy Androff - Burnsville MN, US
Jeffrey Gotro - Trabuco Canyon CA, US

Isola Laminate Systems Corp.

C08K005/00

523/461000

A composition useful for manufacturing AOI inspectable laminates including a polymer, at least one fluorescent light activated dye, and at least one dye that is visible under ambient light.

20020162685, Nov 7, 2002

May 7, 2002

10/143713

Jeffrey Gotro - Trabuco Canyon CA, US
Karim Fernandes - Alta Loma CA, US

H05K001/03
H05K003/30
H05K003/20

174/258000, 174/256000, 174/250000, 029/831000, 029/846000, 029/841000

A multilayer circuit board comprising at least one substantially void free encapsulated heavy copper core and methods for producing such a board. Such a board may be formed by providing a first core that includes a substrate and heavy copper circuit traces, filling the spaces between circuit traces with a resin, and at least partially curing the resin so as to form two exposed and substantially planar surfaces on opposite sides of the core. The filled and planarized core is then laminated with additional dielectric layers to form a fully cured, void free multilayer printed circuit board.

20040091622, May 13, 2004

Sep 4, 2003

10/656500

Karim Fernandes - Alta Loma CA, US
Jeffrey Gotro - Trabuco Canyon CA, US

B05D001/30

427/355000, 427/420000, 156/309900

A coated prepreg with high resin content and method of making such a prepreg, and a thermal dissipating printed circuit board and methods for manufacturing such a board. In particular, means to fill between circuit features with either a high Tg thermally enhanced dielectric or a non-thermally enhanced resin system.

20050028925, Feb 10, 2005

Sep 4, 2003

10/655789

Karim Fernandes - Alta Loma CA, US
Jeffrey Gotro - Trabuco Canyon CA, US

B32B031/00

156269000, 156250000

A continuous method to make a prepreg with improved thermal conductivity and electrical properties for use in multilayer printed circuit boards.

20120091016, Apr 19, 2012

Oct 12, 2011

13/271902

Roy Carlton Jones - Hagerstown MD, US
Jeffrey Thomas Gotro - Trabuco Canyon CA, US
George Pesansky - Pottsville PA, US
James Edward Pinkley - Aurora CO, US

B65D 77/00
B65B 31/00

206216, 141 4

An assembly for extending the shelf-life of a pressurized resin cartridge. The assembly includes at least one pressurized resin cartridge comprising a first compartment for holding a catalyst and a second compartment for holding a resin mastic. The assembly has a pressurized container sealingly disposed about the pressurized resin cartridge. Such assembly minimizes depressurization of the pressurized resin cartridge and extends the shelf-life of the pressurized resin cartridge. An assembly for extending the shelf-life of a depressurized resin cartridge. The assembly includes at least one depressurized resin cartridge comprising a first compartment for holding a catalyst and a second compartment for holding a resin mastic. The assembly has a pressurized container sealingly disposed about the depressurized resin cartridge. Such assembly increases pressurization of the depressurized resin cartridge and extends the shelf-life of the depressurized resin cartridge.

55275931, Jun 18, 1996

Nov 23, 1994

8/344477

Jeffrey T. Gotro - Endwell NY
Jeffrey C. Hedrick - Peekskill NY
Konstantinos Papathomas - Endicott NY
Niranjan M. Patel - Wappingers Falls NY
Jane M. Shaw - Ridgefield CT
Alfred Viehbeck - Fishkill NY

International Business Machines Corporation - Armonk NY

B32B 300

428209

An electronic circuit package comprising an electrically conductive pattern embedded within a curable material. The curable material comprises a fluorine-containing cyanate and a fluorine-containing arylene ether polymer. The cyanate is a monomer having the structure N. tbd. C--O--R--[R. sup. 1 ]. sub. n --O--C. tbd. N and the fluorine containing arylene ether polymer has the structure X--R--[R. sup. 1 ]. sub. m --X wherein X is any group capable of reacting with a --C. tbd. N group; R is an aliphatic or aromatic group which may or may not be fluorosubstituted; R. sup. 1 is an aliphatic or aromatic group which may or may not be fluoro substituted or R. sup. 1 is selected from the group consisting of ether, carbonyl, sulfone, phosphine oxide and sulfide, and at least one of R or R. sup. 1 must be fluoro substituted; n is 0-10; and m is 0-100.

6255039, Jul 3, 2001

Apr 3, 1998

9/054264

Chengzeng Xu - Succasunna NJ
James T. Yardley - Morristown NJ
David Haas - Westfield NJ
Michael Vallance - La Crosse WI
Jeffrey T. Gotro - Onalaska WI
Michael A. Petti - Buffalo Grove IL

Isola Laminate Systems Corp. - LaCrosse WI

G03F 726

430318

High density built-up multilayer printed circuit boards are produced by constructing microvias with photoimageable dielectric materials. A photosensitive dielectric composition on a conductive foil is laminated to conductive lines on a core. After imaging the foil and imaging and curing the photosensitive dielectric composition, vias are formed to the conductive lines. Thereafter the conductive lines are connected through the vias to the conductive foil, and then the conductive foil is patterned.