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Jeevan M Prasannakumar

from Plymouth, MN
Age ~50
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Also known as:
Jeevan Jeevan Prasannakumar, Jeevan M Prasannkumar
Connected to:
Arjun Prasanna, 28Ganesh A Prasanna, 55Karthik Prasanna, 42Praveen Prasanna, 45Ramya Prasanna, 41Roopa Prasanna, 49Shalini Prasanna, 38Srinivasa G Prasanna, 54Sudha R Prasannappa, 60George Prasanth, 37

Jeevan Prasannakumar Phones & Addresses

  • Plymouth, MN
  • Minnetonka, MN
  • 232 Pine Hollow Dr, Circle Pines, MN 55014
  • Westmont, IL
  • Woodridge, IL
  • Willowbrook, IL

Work

Company: Medtronic Jul 2010 Position: Principal engineer

Education

Degree: MS School / High School: University of Minnesota-Twin Cities 2008 to 2010 Specialities: Management of Technology

Skills

Iso 13485 • Design Control • Design of Experiments • Medical Devices • Manufacturing • Fda • V&V • Injection Molding • Quality System • Six Sigma • R&D • Design For Manufacturing • Project Management • U.s. Food and Drug Administration • Drm • Fmea • Research and Development • Verification and Validation • Strategic Planning • Critical Thinking • Empathy • Emerging Markets • Business Model Development

Languages

Hindi • Kannada

Ranks

Certificate: Drm/Dfss

Emails

t***[email protected]

Industries

Medical Devices

Resumes

Resumes

Jeevan Prasannakumar Photo 1

Senior Manager Global Sourcing

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Location:
Circle Pines, MN
Industry:
Medical Devices
Work:
Medtronic since Jul 2010
Principal Engineer
Medtronic Nov 2004 - Jul 2010
Sr. Project Engineer
Medtronic Nov 2004 - Jul 2006
Manufacturing Engineer
Education:
University of Minnesota-Twin Cities 2008 - 2010
MS, Management of Technology University of Massachusetts at Lowell 2000 - 2002
MS, Plastics Engineering University of Mysore 1992 - 1996
Bachelor of Science (BS), Polymer Science and Technology
Skills:
Iso 13485
Design Control
Design of Experiments
Medical Devices
Manufacturing
Fda
V&V
Injection Molding
Quality System
Six Sigma
R&D
Design For Manufacturing
Project Management
U.s. Food and Drug Administration
Drm
Fmea
Research and Development
Verification and Validation
Strategic Planning
Critical Thinking
Empathy
Emerging Markets
Business Model Development
Languages:
Hindi
Kannada
Certifications:
Drm/Dfss

Publications

Us Patents

Implantable Medical Electrical Device Connector Module Assemblies And Methods

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US Patent:
20130307184, Nov 21, 2013
Filed:
May 17, 2012
Appl. No.:
13/473965
Inventors:
Andrew J. Ries - Lino Lakes MN, US
Jeevan M. Prasannakumar - Circle Pines MN, US
Richard P. Nelson - Hudson WI, US
International Classification:
B29C 45/14
US Classification:
26427214
Abstract:
Methods for forming an insulative body of an implantable medical device connector module assembly employ an injection molding process, whereby first and second shots of insulative material form core and an overlay portions, respectively. In some methods, a panel portion of an electrical component is mounted between opposing surfaces of a mold such that a finger-like portion of the component extends into a cavity of the mold, with a first side thereof touching another surface of the mold and a second, opposite side exposed within the cavity; following first shot injection, the core portion captures the finger-like portion in relatively rigid relation thereto. When two types of connector bores are formed, a color indicator may be engaged with a feature of the core portion that is located in proximity to a connector bore of the first type, and then the overlay portion is formed over the indicator.

Connector Module Assemblies, Methods, And Components For Implantable Medical Electrical Devices

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US Patent:
20130309889, Nov 21, 2013
Filed:
May 17, 2012
Appl. No.:
13/473934
Inventors:
Andrew J. Ries - Lino Lakes MN, US
Jeevan M. Prasannakumar - Circle Pines MN, US
Richard P. Nelson - Hudson WI, US
International Classification:
H01R 13/52
H01R 43/00
US Classification:
439277, 29857
Abstract:
A contact component of an implantable medical device connector module assembly includes a threaded bore in fluid communication with a connector bore thereof, and a flanged bore in fluid communication with the threaded bore. A perimeter surface of the flanged bore creates a shutoff with a pin during injection molding to form an insulative body of the assembly, and a perimeter surface of an insulative bore formed around the pin is preferably flush with that of the flanged bore of the contact component. A centerline axis of the flanged bore is preferably aligned with that of the threaded bore, for example, so that the molded insulative bore has a centerline axis aligned with that of the threaded bore of the contact component.

Implantable Medical Electrical Lead Construction And Associated Implant Systems

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US Patent:
20190060636, Feb 28, 2019
Filed:
Aug 28, 2018
Appl. No.:
16/114445
Inventors:
- Minneapolis MN, US
Eric H. Bonde - Minnetonka MN, US
Phillip C. Falkner - Minneapolis MN, US
Jeevan M. Prasannakumar - Circle Pines MN, US
Brian T. Stolz - Bloomington MN, US
John Shishilla - Medina MN, US
Adam J. Rivard - Blaine MN, US
Robert Sandgren - Lindstrom MN, US
Seth Humphrys - Golden Valley MN, US
Bernard Li - Plymouth MN, US
International Classification:
A61N 1/05
A61N 1/08
A61N 1/375
Abstract:
A temporary medical electrical lead includes a connector pin and a single conductor coil. The coil being close-wound and having no turns of the coil distal portion being mechanically coupled together. The coil distal portion translates a force of no greater than 0.1 lb(0.4 N) when strained 400%.

Connector Module Assemblies, Methods, And Components For Implantable Medical Electrical Devices

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US Patent:
20140123490, May 8, 2014
Filed:
Jan 13, 2014
Appl. No.:
14/153109
Inventors:
- Minneapolis MN, US
Jeevan M. Prasannakumar - Circle Pines MN, US
Richard P. Nelson - Hudson WI, US
International Classification:
A61N 1/05
US Classification:
29874
Abstract:
A contact component of an implantable medical device connector module assembly includes a threaded bore in fluid communication with a connector bore thereof, and a flanged bore in fluid communication with the threaded bore. A perimeter surface of the flanged bore creates a shutoff with a pin during injection molding to form an insulative body of the assembly, and a perimeter surface of an insulative bore formed around the pin is preferably flush with that of the flanged bore of the contact component. A centerline axis of the flanged bore is preferably aligned with that of the threaded bore, for example, so that the molded insulative bore has a centerline axis aligned with that of the threaded bore of the contact component.
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Jeevan M Prasannakumar from Plymouth, MN, age ~50 Get Report