Search

Jeb Wu

from Redmond, WA
Age ~68
Get Report
Related to:
Zhixiang WuKaikai Wu, 34Jie Ping WuNancy Wu, 40Amanda T Wu, 33Gody C Wu, 66Cathy Wu, 34Joseph Wu, 31
Connected to:
Aihua Wu, 39Ailsa T Wu, 53Alice H Wu, 54Alix S Wu, 51Amie Wu, 39Angela Y Wu, 71Anqi Wu, 44Anqiang Wu, 47Banting H Wu, 62Baodong Wu, 61

Jeb Wu Phones & Addresses

  • 17726 NE 113Th Way, Redmond, WA 98052
  • 1301 Ashley Ln, Allentown, PA 18103 (610) 439-3047
  • 253 Summer Ave, Horsham, PA 19044 (215) 956-9092
  • Bensalem, PA
  • Lehighton, PA
  • 17726 NE 113Th Way, Redmond, WA 98052 (610) 439-3047

Work

Company: Microvision inc. Nov 2007 to May 2012 Position: Senior staff engineer

Education

Degree: Masters School / High School: Drexel University 1995 to 1998 Specialities: Electrical Engineering, Mechanical Engineering

Skills

Engineering Management • Laser • Semiconductors • Electronics • R&D • Design For Manufacturing • Design of Experiments • Mems • Optics • Automation • Opto Mechanical Design • Optical Fiber • Labview • Quality Assurance • Spc • Solidworks • Pro Engineer • Wafer • Wire • Foreign Languages • Mems Design For Manufacturing • Semiconductor Packaging Design • Semiconductor Packaging Process Developm... • Power Semiconductor Packaging Process De... • Optoelectronics Packaging Design For Man... • Wafer Scale Bonding • Flip Chip Bonding • Laser Chip Bonding and Testing • Pico Projector Design For Manufacturing • Adhesive Selection For Optical System • Soft Solder Die Attach • Epoxy Die Attach • Gold Tin Solder Die Attach • Wedge Wire Bonding • Copper Wire Wire Bonding • Gold Wire Wire Bonding • Optical System Test and Characterization • Testing Methodology Development For Pico...

Languages

English • Mandarin

Industries

Computer Software

Resumes

Resumes

Jeb Wu Photo 1

Principal Hardware Engineer Hololens Hw Design

View page
Location:
Seattle, WA
Industry:
Computer Software
Work:
Microvision Inc. Nov 2007 - May 2012
Senior Staff Engineer
Microsoft Nov 2007 - May 2012
Principal Hardware Engineer Hololens Hw Design
Avo Photonics May 2002 - Nov 2007
Director, Manufacturing
Agility Communications Apr 2000 - Apr 2002
Senior Development Engineer
Nokia Oct 1995 - Apr 2000
Member of Technical Staff
Education:
Drexel University 1995 - 1998
Masters, Electrical Engineering, Mechanical Engineering
Skills:
Engineering Management
Laser
Semiconductors
Electronics
R&D
Design For Manufacturing
Design of Experiments
Mems
Optics
Automation
Opto Mechanical Design
Optical Fiber
Labview
Quality Assurance
Spc
Solidworks
Pro Engineer
Wafer
Wire
Foreign Languages
Mems Design For Manufacturing
Semiconductor Packaging Design
Semiconductor Packaging Process Development
Power Semiconductor Packaging Process Development
Optoelectronics Packaging Design For Manufacturing
Wafer Scale Bonding
Flip Chip Bonding
Laser Chip Bonding and Testing
Pico Projector Design For Manufacturing
Adhesive Selection For Optical System
Soft Solder Die Attach
Epoxy Die Attach
Gold Tin Solder Die Attach
Wedge Wire Bonding
Copper Wire Wire Bonding
Gold Wire Wire Bonding
Optical System Test and Characterization
Testing Methodology Development For Pico Projector
Languages:
English
Mandarin

Publications

Us Patents

Employing Deformable Contacts And Pre-Applied Underfill For Bonding Led Devices Via Lasers

View page
US Patent:
20200395504, Dec 17, 2020
Filed:
Jan 21, 2020
Appl. No.:
16/748697
Inventors:
- Menlo Park CA, US
Oscar Torrents Abad - Cork, IE
Jeb Wu - Redmond WA, US
Zheng Sung Chio - Cork, IE
Shari Farrens - Cork, IE
Ali Sengul - Zurich, CH
International Classification:
H01L 33/00
H01L 33/52
H01L 33/62
H01L 25/075
Abstract:
The invention is directed towards enhanced systems and methods for employing a pulsed photon (or EM energy) source, such as but not limited to a laser, to electrically couple, bond, and/or affix the electrical contacts of a semiconductor device to the electrical contacts of another semiconductor devices. Full or partial rows of LEDs are electrically coupled, bonded, and/or affixed to a backplane of a display device. The LEDs may be μLEDs. The pulsed photon source is employed to irradiate the LEDs with scanning photon pulses. The EM radiation is absorbed by either the surfaces, bulk, substrate, the electrical contacts of the LED, and/or electrical contacts of the backplane to generate thermal energy that induces the bonding between the electrical contacts of the LEDs' electrical contacts and backplane's electrical contacts. The temporal and spatial profiles of the photon pulses, as well as a pulsing frequency and a scanning frequency of the photon source, are selected to control for adverse thermal effects.

Curing Pre-Applied And Plasma-Etched Underfill Via A Laser

View page
US Patent:
20200395519, Dec 17, 2020
Filed:
Jan 21, 2020
Appl. No.:
16/748685
Inventors:
- Menlo Park CA, US
Oscar Torrents Abad - Cork, IE
Jeb Wu - Redmond WA, US
Zheng Sung Chio - Cork, IE
Ali Sengul - Zurich, CH
International Classification:
H01L 33/62
H01L 25/075
H01L 23/00
Abstract:
The invention is directed towards enhanced systems and methods for employing a pulsed photon (or EM energy) source, such as but not limited to a laser, to electrically couple, bond, and/or affix the electrical contacts of a semiconductor device to the electrical contacts of another semiconductor devices. Full or partial rows of LEDs are electrically coupled, bonded, and/or affixed to a backplane of a display device. The LEDs may be μLEDs. The pulsed photon source is employed to irradiate the LEDs with scanning photon pulses. The EM radiation is absorbed by either the surfaces, bulk, substrate, the electrical contacts of the LED, and/or electrical contacts of the backplane to generate thermal energy that induces the bonding between the electrical contacts of the LEDs' electrical contacts and backplane's electrical contacts. The temporal and spatial profiles of the photon pulses, as well as a pulsing frequency and a scanning frequency of the photon source, are selected to control for adverse thermal effects.

Dielectric-Dielectric And Metallization Bonding Via Plasma Activation And Laser-Induced Heating

View page
US Patent:
20200395520, Dec 17, 2020
Filed:
Jan 21, 2020
Appl. No.:
16/748689
Inventors:
- Menlo Park CA, US
Oscar Torrents Abad - Cork, IE
Jeb Wu - Redmond WA, US
Zheng Sung Chio - Cork, IE
Shari Farrens - Cork, IE
Ali Sengul - Zurich, CH
Tennyson Nguty - Newcastle, GB
International Classification:
H01L 33/62
H01L 25/075
H01L 23/00
Abstract:
The invention is directed towards enhanced systems and methods for employing a pulsed photon (or EM energy) source, such as but not limited to a laser, to electrically couple, bond, and/or affix the electrical contacts of a semiconductor device to the electrical contacts of another semiconductor devices. Full or partial rows of LEDs are electrically coupled, bonded, and/or affixed to a backplane of a display device. The LEDs may be μLEDs. The pulsed photon source is employed to irradiate the LEDs with scanning photon pulses. The EM radiation is absorbed by either the surfaces, bulk, substrate, the electrical contacts of the LED, and/or electrical contacts of the backplane to generate thermal energy that induces the bonding between the electrical contacts of the LEDs' electrical contacts and backplane's electrical contacts. The temporal and spatial profiles of the photon pulses, as well as a pulsing frequency and a scanning frequency of the photon source, are selected to control for adverse thermal effects.

Selectively Bonding Light-Emitting Devices Via A Pulsed Laser

View page
US Patent:
20200395521, Dec 17, 2020
Filed:
Jan 21, 2020
Appl. No.:
16/748692
Inventors:
- Menlo Park CA, US
Oscar Torrents Abad - Cork, IE
Jeb Wu - Redmond WA, US
Zheng Sung Chio - Cork, IE
Shari Farrens - Cork, IE
International Classification:
H01L 33/62
H01L 25/075
H01L 23/00
Abstract:
The invention is directed towards enhanced systems and methods for employing a pulsed photon (or EM energy) source, such as but not limited to a laser, to electrically couple, bond, and/or affix the electrical contacts of a semiconductor device to the electrical contacts of another semiconductor devices. Full or partial rows of LEDs are electrically coupled, bonded, and/or affixed to a backplane of a display device. The LEDs may be μLEDs. The pulsed photon source is employed to irradiate the LEDs with scanning photon pulses. The EM radiation is absorbed by either the surfaces, bulk, substrate, the electrical contacts of the LED, and/or electrical contacts of the backplane to generate thermal energy that induces the bonding between the electrical contacts of the LEDs' electrical contacts and backplane's electrical contacts. The temporal and spatial profiles of the photon pulses, as well as a pulsing frequency and a scanning frequency of the photon source, are selected to control for adverse thermal effects.

Hololens Light Engine With Linear Array Imagers And Mems

View page
US Patent:
20190098267, Mar 28, 2019
Filed:
Sep 27, 2017
Appl. No.:
15/717709
Inventors:
- Redmond WA, US
Richard A. JAMES - Woodinville WA, US
Jeb WU - Redmond WA, US
Mark Louis Wilson O'HANLON - Woodinville WA, US
Vijay Krishna PARUCHURU - Redmond WA, US
Keita OKA - Bellevue WA, US
International Classification:
H04N 9/31
G06T 19/00
G09G 3/00
Abstract:
Features of the present disclosure implement a light illumination system that utilizes a scanning device that is pivotal on an axis between a plurality of positions. To this end, the system may partition the image frame into at least a first sub-image frame and a second sub-image frame. The system may adjust the scanning device, during the first time period, to a first position to reflect light associated with the first sub-image and adjust the scanning mirror, during the second time period, to a second position to reflect light associated with the second sub-image. Thus, by implementing the techniques described herein, the overall size of a linear array (e.g., liquid crystal on silicon or LCoS) in an optics systems (as well as of some optical components in the optics systems) may be reduced from its current constraints, and thereby achieving a compact optical system that is mobile and user friendly.

Multi-Pupil Display System For Head-Mounted Display Device

View page
US Patent:
20170176747, Jun 22, 2017
Filed:
Dec 21, 2015
Appl. No.:
14/977603
Inventors:
Tuomas Heikki Sakari Vallius - Espoo, FI
Richard Andrew Wall - Kirkland WA, US
Pasi Petteri Pietilä - Espoo, FI
Yarn Chee Poon - Redmond WA, US
Ian Anh Nguyen - Renton WA, US
Jeb Wu - Redmond WA, US
International Classification:
G02B 27/01
G02B 6/35
G02B 27/10
Abstract:
Disclosed are an apparatus and method for increasing the FOV of displayed images in a head-mounted display (HMD) device. A display apparatus comprises a display module and a waveguide optically coupled to the display module. The display module may generate individually multiple different portions of an image, to be conveyed to an optical receptor of a user of the HMD device, and may include multiple optical output ports, each to output a different portion of the image. The waveguide may include multiple optical input ports, each optically coupled to a different one of the optical output ports of the display module, where the waveguide is configured to output, to the optical receptor of the user, light corresponding to the image in its entirety.

Display Device With Optics For Brightness Uniformity Tuning

View page
US Patent:
20170160547, Jun 8, 2017
Filed:
Dec 3, 2015
Appl. No.:
14/958751
Inventors:
James Randolph Webster - Redmond WA, US
Jeb Wu - Redmond WA, US
Steven John Robbins - Redmond WA, US
Tuomas Heikki Sakari Vallius - Espoo, FI
Yarn Chee Poon - Redmond WA, US
International Classification:
G02B 27/01
G02B 27/42
G06T 19/00
Abstract:
Introduced here is a display device that comprises a light emitter and a diffractive optical element (DOE) that is optically coupled to receive light from the light emitter and to convey the light along an optical path. The DOE may have an input surface and an output surface parallel to the input surface, where the input surface and the output surface each have a central region and a peripheral region. The DOE further may have optical characteristics such that light exiting the DOE in the peripheral region of the output surface has greater brightness than light exiting the DOE in the central region of the output surface.

Left And Right Eye Optical Paths With Shared Optical Element For Head-Mounted Display Device

View page
US Patent:
20170068094, Mar 9, 2017
Filed:
Sep 3, 2015
Appl. No.:
14/845195
Inventors:
James Randolph Webster - Redmond WA, US
Jeb Wu - Redmond WA, US
Richard James - Woodinville WA, US
Steven John Robbins - Redmond WA, US
Yarn Chee Poon - Redmond WA, US
KengHui Lin - Taichung City, TW
Chienchih Hsiung - Chubei City, TW
International Classification:
G02B 27/01
G02B 27/26
G02B 27/28
Abstract:
A display engine assembly comprises a first imager and a second imager to generate a left image and a right image, respectively, in a head-mounted display device. The left and right images are left and right components, respectively, of a single stereoscopic image. The display engine further comprises an optical waveguide optically coupled to the first imager and the second imager. The optical waveguide is part of a first optical path to convey the left image to a left eye of a user of the head-mounted display device and is also part of a second optical path to convey the right image to a right eye of the user of the head-mounted display device.
Control profile
Jeb Wu from Redmond, WA, age ~68 Get Report