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Jay Patrick Baker

from Ozark, MO
Age ~71
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Also known as:
Jay P Baker, Jennifer Leigh Baker, Joshua P Baker, Jay P Jay, Jay P Bake, Jay P Bakers, Josh Baker, Cynthia Baker
Phone and address:
5521 Holly Wood Rd, Springfield, MO 65721
(417) 848-1440
Related to:
Deborah Powell, 66Deborah Blackburn, 58Tracy Brannan, 59Clara Blackburn, 88Joseph S Blackburn, 64
Connected to:
Abigail Baker, 45Abraham Baker, 46Adele J Baker, 88Adhara S Baker, 52Adiba Baker, 61Adria L Baker, 55Al BakerAlan D Baker, 61Albert J Baker, 88Alen F Baker, 53

Jay Baker Phones & Addresses

  • 5521 Holly Wood Rd, Ozark, MO 65721 (417) 848-1440
  • Ava, MO
  • Trappe, MD
  • Nixa, MO
  • Redford, MI
  • Chesapeake, VA
  • 5521 Holly Wood Rd, Ozark, MO 65721 (417) 827-2468

Work

Company: OZARKS COMMUNITY HOSPITAL Address: 2828 N National Ave, Springfield, MO 65803 Phones: (417) 837-4003 (417) 875-4765

Education

School / High School: Kansas City College of Osteopathic Medicine 1985

Languages

English

Emails

j***[email protected]

Specialities

Anesthesiology

Professional Records

Medicine Doctors

Jay Baker Photo 1

Dr. Jay P Baker, Chesapeake VA - DO (Doctor of Osteopathic Medicine)

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Specialties:
Anesthesiology
Address:
324 Downing Dr, Chesapeake, VA 23322

OZARKS COMMUNITY HOSPITAL
2828 N National Ave, Springfield, MO 65803
(417) 837-4003 (Phone), (417) 875-4765 (Fax)
Languages:
English
Hospitals:
324 Downing Dr, Chesapeake, VA 23322

OZARKS COMMUNITY HOSPITAL
2828 N National Ave, Springfield, MO 65803

Ozarks Community Hospital
2828 North National, Springfield, MO 65803
Education:
Medical School
Kansas City College of Osteopathic Medicine
Graduated: 1985
Jay Baker Photo 2

Jay F. Baker

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Specialties:
Cardiovascular Disease
Work:
Holy Cross Physician PartnersHoly Cross Medical Group Cardiology Associates Of Boca Raton
9980 Central Park Blvd N STE 304, Boca Raton, FL 33428
(561) 483-8335 (phone), (561) 483-1756 (fax)
Education:
Medical School
New York Medical College
Graduated: 1985
Procedures:
Cardiac Stress Test
Cardioversion
Echocardiogram
Conditions:
Acute Bronchitis
Acute Myocardial Infarction (AMI)
Acute Sinusitis
Acute Upper Respiratory Tract Infections
Angina Pectoris
Languages:
English
Spanish
Description:
Dr. Baker graduated from the New York Medical College in 1985. He works in Boca Raton, FL and specializes in Cardiovascular Disease. Dr. Baker is affiliated with Delray Medical Center, Holy Cross Hospital and West Boca Medical Center.
Jay Baker Photo 3

Jay P. Baker

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Specialties:
Anesthesiology
Work:
OHC Evergreen Pain Clinc
1540 E Evergreen St, Springfield, MO 65803
(417) 823-2960 (phone), (417) 823-2983 (fax)
Education:
Medical School
Kansas City University of Medicine and Biosciences College of Osteopathic Medicine
Graduated: 1985
Languages:
English
Description:
Dr. Baker graduated from the Kansas City University of Medicine and Biosciences College of Osteopathic Medicine in 1985. He works in Springfield, MO and specializes in Anesthesiology.
Jay Baker Photo 4

Jay A. Baker

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Specialties:
Diagnostic Radiology
Work:
Duke University Affil PhysicianDuke Radiology At Patterson Place
5324 Mcfarland Rd STE 160, Durham, NC 27707
(919) 684-6812 (phone), (919) 684-6703 (fax)
Languages:
English
Description:
Dr. Baker works in Durham, NC and specializes in Diagnostic Radiology.
Jay Baker Photo 5

Jay Barry Baker

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Specialties:
Emergency Medicine
Education:
University of Southern California(2000)
Jay Baker Photo 6

Jay Alan Baker

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Specialties:
Pathology
Radiology
Diagnostic Radiology
Education:
Duke University(1992) Neuroradiology
Jay Baker Photo 7

Jay Patrick Baker, Springfield MO

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Specialties:
Anesthesiologist
Address:
2828 N National Ave, Springfield, MO 65803

License Records

Jay P Baker

License #:
5101009766 - Expired
Category:
Osteopathic Medicine & Surgery
Issued Date:
Jul 1, 1986
Expiration Date:
Dec 31, 1992
Type:
Osteopathic Physician

Jay P Baker

License #:
5101009766 - Expired
Category:
Pharmacy
Expiration Date:
Jun 30, 1987
Type:
CS - 3

Jay Kevin Baker

License #:
74281 - Expired
Category:
Nursing Support
Issued Date:
Apr 27, 2006
Effective Date:
Aug 11, 2011
Type:
Nurse Aide

Business Records

Name / Title
Company / Classification
Phones & Addresses
Jay Baker
Osteopathy
Baker Jay
Medical Doctor's Office
2828 N National Ave, Springfield, MO 65803
Jay Baker
BACO ENTERPRISES, LTD
Jay Baker
Vice-President
BASF Corporation
Commercial Physical Research
26701 Telegraph Rd, Southfield, MI 48033
(248) 827-4670
Jay Baker
Chief Of Medical Staff
Ozarks Community Hospital
Psychiatric Hospital · Psychiatric Hospitals
2828 N National Ave, Springfield, MO 65803
Jay Baker
President,Treasurer,Chairman
HEALTHSOURCE OF FEDERAL WAY, INC
Jay Baker
Manager
BASF Nichiyu Coatings North America Inc
Mfg Industrial Organic Chemicals
26701 Telegraph Rd, Southfield, MI 48033

Publications

Wikipedia References

Jay Baker Photo 8

Jay Baker (Actor)

Jay Baker Photo 9

Jay Baker (Rugby Union)

Us Patents

Method Of Making An Electrical Circuit Board

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US Patent:
6412168, Jul 2, 2002
Filed:
Sep 6, 2000
Appl. No.:
09/655750
Inventors:
Andrew Z. Glovatsky - Livonia MI
Jay D. Baker - Dearborn MI
Assignee:
Visteon Global Tech, Inc. - Dearborn MI
International Classification:
H01K 310
US Classification:
29852, 29830, 29846, 29851
Abstract:
A multi-layer electronic circuit board design having selectively formed apertures or cavities.

Cladded Material Construction For Etched-Tri-Metal Circuits

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US Patent:
6454878, Sep 24, 2002
Filed:
Nov 1, 2000
Appl. No.:
09/703553
Inventors:
Achyuta Achari - Canton MI
Brenda Joyce Nation - Troy MI
Jay D Baker - Dearborn MI
Lakhi Nandlal Goenka - Ann Arbor MI
Mohan R. Paruchuri - Canton MI
Vladimir Stoica - Farmington Hills MI
Assignee:
Visteon Global Technologies, Inc. - Dearborn MI
International Classification:
C23C 806
US Classification:
148284, 216 13, 216 20, 29830
Abstract:
A method for forming sets of tri-metal material involving the use of cladding mills. When multiple sets of tri-metal material are formed, the outside surfaces of each set is prepared by oxidation to prevent each set from adhering to the set above or below. An alternative to oxidation is to provide a removable layer on the outside surface of the tri-metal material. Alternatively bonding materials may be used on the intermediate surfaces; such bonding materials can be selected from a group consisting of tin, nickel, titanium, chromium, silver and zinc.

Electrical Circuit Board And A Method For Making The Same

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US Patent:
6501031, Dec 31, 2002
Filed:
Sep 6, 2000
Appl. No.:
09/655809
Inventors:
Andrew Z. Glovatsky - Livonia MI
Jay D. Baker - Dearborn MI
Robert Edward Belke - West Bloomfield MI
Myron Lemecha - Dearborn Heights MI
Richard Keith McMillan - Dearborn MI
Thomas B. Krautheim - Belleville MI
Assignee:
Visteon Global Tech., Inc. - Dearborn MI
International Classification:
H05K 111
US Classification:
174262, 29846, 29832, 29852, 29856
Abstract:
A multi-layer electronic circuit board design having a core member a pair of dielectric layers disposed thereon, and a first circuit portion which is coupled to the dielectric layer and core member using a layer of adhesive material Circuit board design further having selectively formed âblindâ apertures, vias or cavities formed through the first circuit portion dielectric layer and adhesive layer thereby exposing core member.

Multi-Layer Printed Circuit Board And Method Of Making Same

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US Patent:
6528736, Mar 4, 2003
Filed:
Jan 21, 1997
Appl. No.:
08/786494
Inventors:
Daniel Phillip Dailey - West Bloomfield MI
Jay DeAvis Baker - Dearborn MI
Achyuta Achari - Canton MI
Myron Lemecha - Dearborn MI
Michael George Todd - South Lyon MI
Assignee:
Visteon Global Technologies, Inc. - Dearborn MI
International Classification:
H01R 909
US Classification:
174261, 174255, 361772, 361809
Abstract:
Method of manufacturing a multi-layer printed circuit board adapted for reduce interfacial sheer stresses includes a laminate substrate having a top layer forming a first major surface, a middle layer having a predetermined thickness and a bottom layer forming a second major surface opposed to the first major surface. Etch resists are disposed on the first and second surfaces corresponding to reverse images of desired conductor patterns. The first and second surfaces are thereafter etched and the photoresist removed. The laminate substrate is secured via a low modules adhesive layer to a major surface of a base. The middle layer of the laminate substrate is thereafter selectively etched so as to isolate selected portions of the first and second surfaces and to define inner connect regions therebetween having a height equal to the predetermined thickness.

Multi-Layer Printed Circuit Board And Method Of Making Same

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US Patent:
6555015, Apr 29, 2003
Filed:
Nov 9, 2000
Appl. No.:
09/712838
Inventors:
Daniel Phillip Dailey - West Bloomfield MI
Jay DeAvis Baker - Dearborn MI
Achyuta Achari - Canton MI
Myron Lemecha - Dearborn MI
Michael George Todd - South Lyon MI
Assignee:
Visteon Global Technologies, Inc. - Dearborn MI
International Classification:
H01B 1300
US Classification:
216 17, 216 19
Abstract:
Method of manufacturing a multi-layer printed circuit board adapted for reduce interfacial sheer stresses includes a laminate substrate having a top layer forming a first major surface, a middle layer having a predetermined thickness and a bottom layer forming a second major surface opposed to the first major surface. Etch resists are disposed on the first and second surfaces corresponding to reverse images of desired conductor patterns. The first and second surfaces are thereafter etched and the photoresist removed. The laminate substrate is secured via a low modules adhesive layer to a major surface of a base. The middle layer of the laminate substrate is thereafter selectively etched so as to isolate selected portions of the first and second surfaces and to define inner connect regions therebetween having a height equal to the predetermined thickness.

Method For Soldering Surface Mount Components To A Substrate Using A Laser

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US Patent:
6583385, Jun 24, 2003
Filed:
Dec 19, 2001
Appl. No.:
10/028417
Inventors:
Peter Joseph Sinkunas - Canton MI
Zhong-You (Joe) Shi - Ann Arbor MI
Jay D. Baker - Dearborn MI
Assignee:
Visteon Global Technologies, Inc. - Dearborn MI
International Classification:
B23K 1005
US Classification:
21912185, 21912164
Abstract:
A method for reflowing a solder dispersed between a plurality electrical circuit conductor pads attached to a flexible substrate and at least one electronic component using a laser is disclosed. The method includes aligning the plurality of electric circuit conductor pads along a common axis, placing the at least one electronic component having a light colored surface side on a pair of the electrical circuit conductor pads wherein the light colored surface faces the laser, and sweeping the laser across a plurality of electronic components and conductor pads to reflow the solder without damaging the substrate.

Void-Free Die Attachment Method With Low Melting Metal

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US Patent:
6601753, Aug 5, 2003
Filed:
May 17, 2001
Appl. No.:
09/859553
Inventors:
Jay DeAvis Baker - Dearborn MI
Lawrence Leroy Kneisel - Novi MI
Mohan R. Paruchuri - Canton MI
Prathap Amervai Reddy - Farmington Hills MI
Vivek Amir Jairazbhoy - Farmington Hills MI
Assignee:
Visteon Global Technologies, Inc. - Dearborn MI
International Classification:
B23K 3538
US Classification:
228219, 228121, 2281221, 2281231, 2281246, 228212, 438110, 438111, 257668
Abstract:
A method for attaching an electronic die to a substrate is disclosed. Preferably, the method includes depositing a pad of low temperature die attachment material within a die attachment area on the substrate, positioning the die over the pad of low temperature die attachment material, and compressing the die against the substrate to expel air trapped within the pad of low temperature die attachment material. Further, a bead of containment material is deposited onto the substrate to define the die attachment area. In this manner, the die attachment material is contained on the substrate. Thus, the method of the present invention improves the reliability of the electronic die.

Circuit Board And A Method For Making The Same

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US Patent:
6623651, Sep 23, 2003
Filed:
Mar 22, 2001
Appl. No.:
09/815364
Inventors:
Bharat Patel - Canton MI
Jay D. Baker - Dearborn MI
Mohan Paruchuri - Canton MI
Assignee:
Visteon Global Technologies, Inc. - Dearborn MI
International Classification:
H01B 1300
US Classification:
216 13, 174254
Abstract:
A method for making a multi-layer electronic circuit board having at least one electrically conductive protuberance which forms a âviaâ and which traverses through the various layers of the electric circuit board , and further having at least one interconnection portion which supports a wide variety of components and interconnection assemblies.

Isbn (Books And Publications)

Night of the Fair

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Author

Jay Baker

ISBN #

0708950205

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Jay Patrick Baker from Ozark, MO, age ~71 Get Report