James E Shaffer

7982662, Jul 19, 2011

Dec 8, 2009

12/633652

James Shaffer - Boise ID, US

Intellex, LLC - Eagle ID

G01S 7/02
G01S 7/48
G01S 13/00
G01S 17/00

342158, 702127, 702155, 702158, 702159, 342 27, 342 52, 342 53, 342 54, 342 59, 342 70, 342 73, 342 74, 342118, 342146, 342147, 342368, 244 31, 701300, 701301, 356 3, 356 401, 356 501, 250200, 2502011, 2502031, 2502032

This scanning array scans an area around the array for nearby objects, collision obstructions, and terrain topography. The scanning array can scan for sounds emitted by objects in the vicinity of the scanning array, passive energy receipt sources, or it can also send out an energy beam and scan for reflections from objects within the energy beam. The energy beam can be optical, laser, radar or other energy emitting sources. The scanning array of the invention can be used for helicopter detection and avoidance of collision risk and can be used for other scanning purposes. Scanning of an entire hemisphere or greater is accomplished by manipulating the scanner platform through the coordination of either linear actuators or gimbals so as to produce nutation without rotation. This motion allows transceivers to be directly coupled to transmitting and sensing modules without the losses associated with slip rings and other coupling devices.

8292243, Oct 23, 2012

Sep 3, 2009

12/553913

James Shaffer - Boise ID, US

Twin Turbine Technologies LLC - Boise ID

A47B 96/00

24822214, 403 43, 403 47, 411413

A compound differentially threaded element engages two or more longitudinally severed segments of a mating threaded element to provide differential linear motion. Different thread types may include pitch, thread starts, handedness or thread-form. Combinations of differential threads may be selected to enable fine or coarse linear motion without correspondingly fine or coarse thread pitches.

8602371, Dec 10, 2013

Oct 12, 2012

13/651062

James E. Shaffer - Boise ID, US

Twin Turbine Technologies LLC - Boise ID

A47B 96/00

24822214, 403 43, 403 47, 411413

A compound differentially threaded element engages two or more longitudinally severed segments of a mating threaded element to provide differential linear motion. Different thread types may include pitch, thread starts, handedness or thread-form. Combinations of differential threads may be selected to enable fine or coarse linear motion without correspondingly fine or coarse thread pitches.

54356938, Jul 25, 1995

Feb 18, 1994

8/198889

James E. Shaffer - Maitland FL

Solar Turbines Incorporated - San Diego CA

F04D 2960

416204A

In a turbine, a plurality of blades are attached to a turbine wheel by way of a plurality of joints which form a rolling contact between the blades and the turbine wheel. Each joint includes a pin and a pair of rollers to provide rolling contact between the pin and an adjacent pair of blades. Because of this rolling contact, high stress scuffing between the blades and the turbine wheel reduced, thereby inhibiting catastrophic failure of the blade joints.

57985650, Aug 25, 1998

Jan 23, 1995

8/659866

Glen G. Atkins - Boise ID
Michael S. Cohen - Boise ID
Karl H. Mauritz - Eagle ID
James M. Shaffer - Boise ID

Micron Technology, Inc. - Boise ID

H01L 2353
H01L 2312

257701

An apparatus for integrating wafer scale semiconductor integrated circuits and interfacing them with other systems. A wafer, partial wafer, die or plurality of same are mated to a printed circuit board (PCB) which electrically contacts the pads on each die using small conductive pillars. The PCB in turn is connected easily to other electronic systems. The entire apparatus is incorporated into other systems which utilize the dice in the apparatus. The apparatus may be fitted with heating elements and cooling channels to generate the necessary dice temperatures for burn-in, testing, and operation. The apparatus is easily adaptable to include more dice in a stacked configuration.

50529846, Oct 1, 1991

Feb 23, 1990

7/484064

James E. Shaffer - Maitland FL

Consulier Industries, Inc. - Riviera Beach FL

F16H 706

474156

A drive mechanism has a cam with dual outwardly-facing elliptical cam surfaces axially-spaced across a gap and an arcuate wave gear segment with an inwardly-facing multi-toothed cam track annularly positioned in opposition to the gap. A chain has linked roller assemblies with first and third rollers that ride on the dual cam surfaces and second rollers of larger diameter that ride on the cam track and are held against axial displacement by travel in the gap. A differential exists over the same distance between the number of rollers and the number of teeth of the cam track. The cam surfaces drive the roller assemblies in a travelling wave along the cam track to drive the chain at a reduced speed around the cam. A drive winch assembly has link plates joining the roller assemblies on both sides of each roller to provide improved force distribution from one chain segment to the next.

50447386, Sep 3, 1991

Dec 11, 1989

7/448645

James E. Shaffer - Maitland FL

Consulier Engineering, Inc. - Rivieria Beach FL

G02B 2316
G02B 700
H01J 314

359504

An optical system for scanning a wide angle conical field of regard through a small aperture and with a narrow field of view device includes a first optical offsetting device rotated about a first axis coincident to the axis of the conical field of regard. The first offsetting optical device receives light along a second optical axis which at a certain acute angle with respect to the first axis. A second optical offsetting device is positioned at the output side of the first device and is rotated about the second axis. The second offsetting device also receives light along a third optical axis, which is at the certain angle with respect to the second axis. The first, second and third axes intersect in front of the system in the narrow aperture through which the viewing takes place. By rotating each of the two optical offsetting devices, an entire area having a field of regard of twice the certain angle from the viewing aperture may be mapped.

55700322, Oct 29, 1996

Aug 17, 1993

8/108097

Glen G. Atkins - Boise ID
Michael S. Cohen - Boise ID
Karl H. Mauritz - Eagle ID
James M. Shaffer - Boise ID

Micron Technology, Inc. - Boise ID

G01R 106

324760

An apparatus for wafer scale burn-in and testing of semiconductor integrated circuits and a method for its utilization. A wafer is mated to a printed circuit board which electrically contacts the pads on each die using small conductive pillars. Single precise alignment of entire wafer within apparatus allows for testing all the dice on the wafer in parallel, eliminating need to probe each die individually. The apparatus is fitted with heating elements and cooling channels to generate the necessary wafer temperatures for burn-in and testing. The method of utilization eliminates processing of defective dice beyond burn-in and test, thereby increasing throughput.