Mukesh V. Khare - White Plains NY, US Christopher P. D'Emic - Ossining NY, US Thomas T. Hwang - Wappingers Falls NY, US Paul C. Jamison - Hopewell Junction NY, US James J. Quinlivan - Essex Junction VT, US Beth A. Ward - Essex Junction VT, US
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
H01L021/31 H01L021/469
US Classification:
438769, 438775, 438786
Abstract:
A method for forming a gate dielectric for an integrated circuit device. In an exemplary embodiment of the invention, the method includes forming an initial oxynitride layer upon a substrate material, the oxynitride layer having an initial physical thickness. The initial oxynitride layer is then subjected to a plasma nitridation, the plasma nitridation resulting in final oxynitride layer having a final physical thickness.
Mukesh V. Khare - White Plains NY, US Christopher P. D'Emic - Ossining NY, US Thomas T. Hwang - Wappingers Falls NY, US Paul C. Jamison - Hopewell Junction NY, US James J. Quinlivan - Essex Junction VT, US Beth A. Ward - Essex Junction VT, US
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
H01L 29/76 H01L 29/94
US Classification:
257411, 257649
Abstract:
A method for forming a gate dielectric for an integrated circuit device. In an exemplary embodiment of the invention, the method includes forming an initial oxynitride layer upon a substrate material, the oxynitride layer having an initial physical thickness. The initial oxynitride layer is then subjected to a plasma nitridation, the plasma nitridation resulting in final oxynitride layer having a final physical thickness.