James D Meindl

6528349, Mar 4, 2003

Oct 26, 2000

09/697031

Chirag S. Patel - Peekskill NY
Kevin Martin - Atlanta GA
James D. Meindl - Marietta GA

Georgia Tech Research Corporation - Atlanta GA

H01L 2144

438117, 438 15, 438106, 438108, 438612, 438613, 438623, 438624, 438640

Compliant wafer level packages and methods for monolithically fabricating the same. A monolithically fabricated compliant wafer level package having a compliant layer and a compliant interconnect passing therein. The compliant interconnects being provided so that electrical and mechanical connections may be supported across the compliant layer , and constructed so that stresses related to relative motion between electrical components is accommodated. A method of providing a substrate having a compliant layer , the compliant layer having a via that exposes a die pad on the substrate. Fabricating a compliant interconnect so that the compliant interconnect contacts the die pad. The compliant interconnect constructed so that electrical and mechanical connections may be supported through the compliant layer.

6606432, Aug 12, 2003

May 3, 2001

09/848935

Thomas K. Gaylord - Atlanta GA
Elias N. Glytsis - Atlanta GA
James D. Meindl - Marietta GA

Georgia Tech Research Corp. - Atlanta GA

G02B 634

385 37, 359 12

The present invention entails a phase mask for producing a plurality of volume gratings for use as optical couplers and method for creating the phase mask. The phase mask is produced by creating a plurality of volume gratings having predetermined characteristics which allow the phase mask, when excited by a coherent light wave, to produce a plurality of volume gratings in a recording material.

6690081, Feb 10, 2004

Nov 19, 2001

09/993100

Muhannad S. Bakir - Atlanta GA
Hollie Reed - Atlanta GA
Paul Kohl - Atlanta GA
Chirag S. Patel - Peekskill NY
Kevin P. Martin - Atlanta GA
James Meindl - Marietta GA

Georgia Tech Research Corporation - Atlanta GA

H01L 2900

257522, 257792, 257506, 438461, 438421

Devices and method of fabrication thereof are disclosed. A representative device includes one or more lead packages. The lead packages include a substrate including a plurality of die pads, an overcoat polymer layer, a plurality of sacrificial polymer layers disposed between the substrate and the overcoat polymer layer, and a plurality of leads. Each lead is disposed upon the overcoat polymer layer having a first portion disposed upon a die pad. The sacrificial polymer layer can be removed to form one or more air-gaps.

6785458, Aug 31, 2004

Feb 11, 2002

10/074420

Chirag Patel - College Park GA
James D. Meindl - Marietta GA
Thomas K. Gaylord - Atlanta GA
Elias N. Glytsis - Dunwoody GA
Kevin P. Martin - Atlanta GA
Stephen M. Schultz - Tucson AZ
Muhannad Bakir - Atlanta GA
Hollie Reed - Smyrna GA
Paul Kohl - Atlanta GA

Georgia Tech Research Corporation - Atlanta GA

G02B 610

385131, 385132

Wafer-level electronic packages having waveguides and methods of fabricating chip-level electronic packages having waveguides are disclosed. A representative chip-level electronic package includes at least one waveguide having a waveguide core. In addition, another representative chip-level electronic package includes a waveguide having an air-gap cladding layer around a portion of the waveguide core. A representative method for fabricating a chip-level electronic package includes: providing a substrate having a passivation layer disposed on the substrate; disposing a waveguide core on a portion of the passivation layer; disposing a first sacrificial layer onto at least one portion of the passivation layer and the waveguide core; disposing an overcoat layer onto the passivation layer and the first sacrificial layer; and removing the first sacrificial layer to define an air-gap cladding layer within the overcoat polymer layer and around a portion of the waveguide core.

6788867, Sep 7, 2004

Dec 11, 2003

10/734075

James D. Meindl - Marietta GA
Paul Kohl - Atlanta GA
Stephen M. Schultz - Tucson AZ
Thomas K. Gaylord - Atlanta GA
Elias N. Glytsis - Dunwoody GA
Ricardo Villalaz - Atlanta GA
Muhannad Bakir - Atlanta GA
Hollie Reed - Smyrna GA

Georgia Tech Research Corp. - Atlanta GA

G02B 600

385129, 385 14, 385130, 385132

Optical interconnect layers and methods of fabrication thereof are described. In addition, the optical interconnect layers integrated into devices such as backplane (BP), printed wiring board (PWB), and multi-chip module (MCM) level devices are described. A representative optical interconnect layer includes a first cladding layer, a second cladding layer, one or more waveguides having a waveguide core and an air-gap cladding layer engaging a portion of waveguide core, wherein the first cladding layer and the second cladding layer engage the waveguide.

6807352, Oct 19, 2004

Feb 11, 2002

10/074067

James D. Meindl - Marietta GA
Thomas K. Gaylord - Atlanta GA
Elias N. Glytsis - Dunwoody GA
Paul Kohl - Atlanta GA

Georgia Tech Research Corporation - Atlanta GA

G02B 610

385131, 385132

Waveguides having air-gap cladding layers and methods of fabricating waveguides having air-gap cladding layers are disclosed. A representative waveguide includes a waveguide core having an air-gap cladding layer engaging a portion of the waveguide core. In addition, a representative method of fabricating a waveguide having an air-gap cladding layer includes: providing a substrate having a lower cladding layer disposed on the substrate; disposing a waveguide core on a portion of the lower cladding layer; disposing a sacrificial layer onto at least one portion of the lower cladding layer and the waveguide core; disposing an overcoat layer onto the lower cladding layer and the sacrificial layer; and removing the sacrificial layer to define an air-gap cladding layer within the overcoat polymer layer and engaging a portion of the waveguide core.

6947651, Sep 20, 2005

May 10, 2002

10/142601

Paul Kohl - Atlanta GA, US
James D. Meindl - Marietta GA, US
Agnes Padovani - Phoenix AZ, US
Thomas K. Gaylord - Atlanta GA, US
Elias N. Glytsis - Dunwoody GA, US
Sue Ann B. Allen - Atlanta GA, US

Georgia Tech Research Corporation - Atlanta GA

G02B006/02
G02B006/20

385125

Waveguides and methods of fabrication thereof are presented. A representative waveguide includes a waveguide core and a cladding layer, where the cladding layer surrounds the waveguide core. The waveguide core and cladding can be made of a host material having a plurality of nano-pores, wherein the nano-pores include a sacrificial material, and the sacrificial material can be selectively decomposed in both the core and cladding layers to form a plurality of nano air-gaps.

6954576, Oct 11, 2005

Jul 21, 2004

10/895685

Chirag Patel - College Park GA, US
James D. Meindl - Marietta GA, US
Thomas K. Gaylord - Atlanta GA, US
Elias N. Glytsis - Dunwoody GA, US
Kevin P. Martin - Atlanta GA, US
Stephen M. Schultz - Tucson AZ, US
Muhannad Bakir - Atlanta GA, US
Hollie Reed - Smyrna GA, US
Paul Kohl - Atlanta GA, US

Georgia Tech Research Corporation - Atlanta GA

G02B006/10

385131, 438 31

Wafer-level electronic packages having waveguides and methods of fabricating chip-level electronic packages having waveguides are disclosed. A representative chip-level electronic package includes at least one waveguide having a waveguide core. In addition, another representative chip-level electronic package includes a waveguide having an air-gap cladding layer around a portion of the waveguide core. A representative method for fabricating a chip-level electronic package includes: providing a substrate having a passivation layer disposed on the substrate; disposing a waveguide core on a portion of the passivation layer; disposing a first sacrificial layer onto at least one portion of the passivation layer and the waveguide core; disposing an overcoat layer onto the passivation layer and the first sacrificial layer; and removing the first sacrificial layer to define an air-gap cladding layer within the overcoat polymer layer and around a portion of the waveguide core.